INTERSIL HI1175_05

®
nd R
ee a
r
Data
Sheet
F
Pb
o HS
Co
HI1175
a nt
mpli
October 25, 2005
FN3577.8
8-Bit, 20MSPS, Flash A/D Converter
Features
The HI1175 is an 8-bit, analog-to-digital converter built in a
1.4µm CMOS process. The low power, low differential gain
and phase, high sampling rate, and single 5V supply make
the HI1175 ideal for video and imaging applications.
• Resolution . . . . . . . . . . . . . . . . . . . . 8-Bit ±0.3 LSB (DNL)
The adoption of a 2-step flash architecture achieves low
power consumption (60mW) at a maximum conversion
speed of 20MSPS (Min), 35MSPS typical with only a 2.5
clock cycle data latency. The HI1175 also features digital
output enable/disable and a built in voltage reference. The
HI1175 can be configured to use the internal reference or an
external reference if higher precision is required.
• Maximum Sampling Frequency . . . . . . . . . . . . . . 20MSPS
• Low Power Consumption . . . . . . 60mW (at 20MSPS Typ)
(Reference Current Excluded)
• Built-In Sample and Hold Circuit
• Built-In Reference Voltage Self Bias Circuit
• Three-State TTL Compatible Output
• Single +5V Power Supply
• Low Input Capacitance. . . . . . . . . . . . . . . . . . . 11pF (Typ)
Ordering Information
PART NUMBER
TEMP.
RANGE (oC)
• Reference Impedance . . . . . . . . . . . . . . . . . . . 300Ω (Typ)
PACKAGE
PKG.
NO.
• Evaluation Board Available (HI1175-EV)
• Low Cost
HI1175JCB
-40 to 85
HI1175-EV
25
24 Ld SOIC
M24.2-S
• Direct Replacement for the Sony CXD1175
Evaluation Board
Applications
• Video Digitizing
• PC Video Capture
• Image Scanners
• TV Set Top Boxes
• Multimedia
• Personal Communication Systems (PCS)
Pinout
HI1175 (SOIC)
TOP VIEW
1
OE
1
24
DVSS
DVSS
2
23
VRB
D0 (LSB)
3
22
VRBS
D1
4
21
AVSS
D2
5
20
AVSS
D3
6
19
VIN
D4
7
18
AVDD
D5
8
17
VRT
D6
9
16
VRTS
D7 (MSB)
10
15
AVDD
DVDD
11
14
AVDD
CLK
12
13
DVDD
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2000, 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
HI1175
Functional Block Diagram
OE
1
DVSS
2
D0 (LSB)
3
D1
4
D2
5
D3
6
D4
7
D5
8
D6
24 DVSS
REFERENCE VOLTAGE
23 VRB
22
LOWER
ENCODER
(4-BIT)
LOWER
DATA
LATCHES
21 AVSS
20 AVSS
LOWER
ENCODER
(4-BIT)
LOWER
COMPARATORS
WITH S/H (4-BIT)
UPPER
ENCODER
(4-BIT)
UPPER
COMPARATORS
WITH S/H (4-BIT)
19 VIN
18 AVDD
17 VRT
UPPER
DATA
LATCHES
9
LOWER
COMPARATORS
WITH S/H (4-BIT)
D7 (MSB) 10
16
VRTS
2.6V (Typ)
15 AVDD
DVDD 11
CLK 12
VRBS
0.6V (Typ)
14 AVDD
13 DVDD
CLOCK GENERATOR
Typical Application Schematic
HC04
CA158A
+5V
+5V
R4
+
-
C9 +
4.7µF
R13
R11
R3
ICL8069
CLK
CLOCK IN
C10
0.1µF
13
12
14
11
15
10
D7 (MSB)
16
9
D6
17
8
D5
7
D4
19
6
D3
20
5
D2
21
4
D1
22
3
D0 (LSB)
23
2
24
1
R5
R12
+
CA158A
C12
0.1µF
C8
18
HA2544
VIN
†
+
-
R1
R2
C11
0.1µF
† : Ceramic Chip Capacitor 0.1µF.
HI1175
C7
4.7µF
+
+5V
: Analog GND.
: Digital GND.
NOTE: It is necessary that AVDD and DVDD pins be driven from the same supply. The gain of analog input signal can be changed by adjusting the ratio of R2 to R1.
2
HI1175
Pin Descriptions and Equivalent Circuits
PIN
NUMBER
SYMBOL
1
OE
EQUIVALENT CIRCUIT
DESCRIPTION
When OE = Low, Data is valid.
When OE = High, D0 to D7 pins high impedance.
DVDD
1
DVSS
2, 24
DVSS
3-10
D0 to D7
Digital GND.
D0 (LSB) to D7 (MSB) Output.
D1
11, 13
DVDD
Digital +5V.
12
CLK
Clock Input.
DVDD
12
DVSS
16
VRTS
Shorted with VRT generates, +2.6V.
AVDD
16
17
VRT
23
VRB
Reference Voltage (Top).
AVDD
Reference Voltage (Bottom).
17
23
AVSS
14, 15, 18
AVDD
19
VIN
Analog +5V.
Analog Input.
AVDD
19
AVSS
20, 21
AVSS
22
VRBS
Analog GND.
AVSS
22
3
Shorted with VRB generates +0.6V.
HI1175
Absolute Maximum Ratings
Thermal Information
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7V
Reference Voltage, VRT, VRB . . . . . . . . . . . . . . . . . . . . VDD to VSS
Analog Input Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . VDD to VSS
Digital Input Voltage, CLK . . . . . . . . . . . . . . . . . . . . . . . VDD to VSS
Digital Output Voltage, VOH, VOL . . . . . . . . . . . . . . . . . VDD to VSS
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
98
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range, TSTG . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions (Note 1)
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Supply Voltage
AVDD , AVSS , DVDD , DVSS . . . . . . . . . . . . . . . . +4.75V to +5.25V
|DGND-AGND|. . . . . . . . . . . . . . . . . . . . . . . . . . . . 0mV to 100mV
Reference Input Voltage
VRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V and Above
VRT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.8V and Below
Analog Input Range, VIN . . . . . . . VRB to VRT (1.8VP-P to 2.8VP-P)
Clock Pulse Width
tPW1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25ns (Min)
tPW0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25ns (Min)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
fC = 20 MSPS, VDD = +5V, VRB = 0.5V, VRT = 2.5V, TA = 25oC (Note 1)
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
-
-
-
-
EOT
-60
-35
-10
mV
EOB
0
+15
+45
mV
SYSTEM PERFORMANCE
Offset Voltage
Integral Non-Linearity, INL
fC = 20 MSPS, VIN = 0.6V to 2.6V
-
±0.5
±1.3
LSB
Differential Non-Linearity, DNL
fC = 20 MSPS, VIN = 0.6V to 2.6V
-
±0.3
±0.5
LSB
Effective Number of Bits, ENOB
fIN = 1MHz
-
7.6
-
Bits
Spurious Free Dynamic Range
fIN = 1MHz
-
51
-
dB
Signal to Noise Ratio, SINAD
RMS Signal
= -----------------------------------------------------------------RMS Noise + Distortion
fC = 20MHz, fIN = 1MHz
-
46
-
dB
fC = 20MHz, fIN = 3.58MHz
-
46
-
dB
Maximum Conversion Speed, fC
VIN = 0.6V to 2.6V, fIN = 1kHz Ramp
20
35
-
MSPS
-
-
0.5
MSPS
-
1.0
-
%
Differential Phase Error, DP
-
0.5
-
Degree
Aperture Jitter, tAJ
-
30
-
ps
Sampling Delay, tDS
-
4
-
ns
Data Latency, tLAT
-
-
2.5
Cycles
-
18
-
MHz
-
11
-
pF
DYNAMIC CHARACTERISTICS
Minimum Conversion Speed
Differential Gain Error, DG
NTSC 40 IRE Mod Ramp, fC = 14.3 MSPS
ANALOG INPUTS
Analog Input Bandwidth (-1dB), BW
Analog Input Capacitance, CIN
VIN = 1.5V + 0.07VRMS
4
HI1175
fC = 20 MSPS, VDD = +5V, VRB = 0.5V, VRT = 2.5V, TA = 25oC (Note 1) (Continued)
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Reference Pin Current, IREF
4.5
6.6
8.7
mA
Reference Resistance (VRT to VRB),
RREF
230
300
450
Ω
-
-
-
-
0.60
0.64
0.68
V
1.96
2.09
2.21
V
2.25
2.39
2.53
V
-
-
-
-
VIH
4.0
-
-
V
VIL
-
-
1.0
V
-
-
-
-
VIH = VDD
-
-
5
µA
VIL = 0V
-
-
5
µA
-
-
-
-
VOH = VDD -0.5V
-1.1
-
-
mA
VOL = 0.4V
3.7
-
-
mA
-
-
-
-
VOH = VDD
-
0.01
16
µA
VOL = 0V
-
0.01
16
µA
-
18
30
ns
-
12
17
mA
REFERENCE INPUT
INTERNAL VOLTAGE REFERENCE
Self Bias Mode 1
VRB
Short VRB and VRBS , Short VRT and VRTS
VRT - VRB
Self Bias Mode 2, VRT
VRB = AGND, Short VRT and VRTS
DIGITAL INPUTS
Digital Input Voltage
Digital Input Current
IIH
VDD = Max
IIL
DIGITAL OUTPUTS
Digital Output Current
IOH
OE = VSS , VDD = Min
IOL
Digital Output Current
IOZH
OE = VDD , VDD = Max
IOZL
TIMING CHARACTERISTICS
Output Data Delay, tDL
POWER SUPPLY CHARACTERISTIC
Supply Current, IDD
fC = 20 MSPS, NTSC Ramp Wave Input
NOTE:
2. Electrical specifications guaranteed only under the stated operating conditions.
Timing Diagrams
tPW1
tPW0
CLOCK
ANALOG INPUT
N
DATA OUTPUT
N+1
N-3
: POINT FOR ANALOG SIGNAL SAMPLING
N-2
tD = 18ns
FIGURE 1.
5
N-2
N-1
N+3
N
N+4
N+1
HI1175
Timing Diagrams
(Continued)
VI (1)
VI (2)
VI (3)
VI (4)
ANALOG INPUT
EXTERNAL CLOCK
S (1)
UPPER COMPARATOR BLOCK
C (1)
MD (0)
UPPER DATA
S (1)
LOWER COMPARATOR BLOCK A
C (2)
S (3)
MD (1)
RV (0)
LOWER REFERENCE VOLTAGE
C (3)
C (1)
LOWER DATA B
C (0)
OUT (-2)
RV (3)
S (3)
H (3)
C (3)
LD (1)
S (2)
H (2)
LD (-2)
DIGITAL OUTPUT
C (4)
MD (3)
RV (2)
LD (-1)
H (0)
S (4)
MD (2)
RV (1)
H (1)
LOWER DATA A
LOWER COMPARATOR BLOCK B
S (2)
C (2)
S (4)
LD (0)
OUT (-1)
H (4)
LD (2)
OUT (0)
OUT (1)
FIGURE 2.
Typical Performance Curves
20
100
20
IDD (mA)
IDD (mA)
15
15
10
10
50
5
4.0
4.5
5.0
5.5
POWER SUPPLY VOLTAGE (V)
FIGURE 3. SUPPLY CURRENT vs SUPPLY VOLTAGE
6
5
0
5
10
15
20
25
30
POWER DISSIPATION (mW)
VPP = 5.0V, VRT = 2.5V, VRB = 0.5V
TA = 25oC, VIN = 2VP-P
35
SAMPLING RATE (MSPS)
FIGURE 4. SUPPLY CURRENT AND POWER vs SAMPLING
RATE
HI1175
Typical Performance Curves
50
TA = 25oC, VRT = 2.5V, VRB = 0.5V
VDD = 5.0V, fC = 20 MSPS
49
ENCODE 21MHz
48
1.0
47
ENCODE 31MHz
46
(dB)
DIFFERENTIAL NON-LINEARITY (LSB)
1.4
(Continued)
0.6
45
ENCODE 26MHz
44
43
42
0.2
41
0
0
2
4
6
8
40
10
0
1
2
INPUT FREQUENCY (MHz)
FIGURE 5. DIFFERENTIAL NON-LINEARITY vs INPUT
FREQUENCY
3
4
5
6
7
8
INPUT FREQUENCY (MHz)
-30
7.75
-33
7.50
-35
-38
ENCODE 21MHz
-40
6.75
(dB)
(BITS)
11
ENCODE 26MHz
7.25
6.50
ENCODE 26MHz
6.25
10
FIGURE 6. HI1175JCP SNR vs INPUT FREQUENCY
8.00
7.00
9
ENCODE 31MHz
-43
-45
6.00
ENCODE 21MHz
-48
5.75
-50
ENCODE 31MHz
5.50
-53
5.25
-55
5.00
0
1
2
3
4
5
6
7
8
9
10
11
0
1
2
INPUT FREQUENCY (MHz)
3
4
5
6
7
8
9
10
11
INPUT FREQUENCY (MHz)
FIGURE 7. HI1175JCP ENOB vs INPUT FREQUENCY
FIGURE 8. HI1175JCP THD vs INPUT FREQUENCY
1.0
8.00
7.75
0.8
7.50
fIN = 1MHz
0.6
7.00
fIN = 5MHz
6.75
INL (LSB)
ENOB (BITS)
7.25
6.50
6.25
6.00
0.4
0.2
fIN = 10MHz
5.75
5.50
0
5.25
5.00
21
26
31
CLOCK FREQUENCY (MHz)
FIGURE 9. ENOB vs CLOCK FREQUENCY
7
36
-0.2
-55
-35
-15
5
25
45
65
85
TEMPERATURE (oC)
FIGURE 10. INL vs TEMPERATURE
105
125
HI1175
Typical Performance Curves
(Continued)
5.0
20
4.5
IOH = -3.7mA
SUPPLY CURRENT (mA)
OUTPUT VOLTAGE (V)
4.0
3.5
3.0
2.5
2.0
1.5
fC = 35MHz
16
14
fC = 20MHz
12
1.0
IOH = 1.1mA
0.5
0
-55
18
-35
-15
5
25
45
65
TEMPERATURE (oC)
85
105
10
-55
125
-35
-15
5
25
45
65
85
105
125
TEMPERATURE (oC)
FIGURE 11. DIGITAL OUTPUT VOLTAGE vs TEMPERATURE
FIGURE 12. SUPPLY CURRENT vs TEMPERATURE
0.2
54
fIN = 1MHz
0.15
53
0.1
SFDR (dB)
DNL (LSB)
52
0.05
0
51
50
-0.05
49
-0.1
-0.15
-55
-35
-15
5
25
45
65
85
105
48
-55
125
-35
-15
TEMPERATURE (oC)
5
25
45
65
85
105
125
105
125
TEMPERATURE (oC)
FIGURE 13. DNL vs TEMPERATURE
FIGURE 14. SFDR vs TEMPERATURE
-48
8.0
fIN = 1MHz
7.9
-49
fIN = 1MHz
7.8
ENOB (BITS)
THD (dB)
-50
-51
-52
7.7
7.6
7.5
7.4
-53
-54
-55
7.3
-35
-15
5
25
45
65
85
TEMPERATURE (oC)
FIGURE 15. THD vs TEMPERATURE
8
105
125
7.2
-55
-35
-15
5
25
45
65
85
TEMPERATURE (oC)
FIGURE 16. ENOB vs TEMPERATURE
HI1175
Typical Performance Curves
(Continued)
2.5
2.2
VRT SHORTED TO VRTS
VRB = AGND
VRB SHORTED TO VRBS
VRT SHORTED TO VRTS
2.15
VRT - VRB (V)
VRT (V)
2.45
2.4
2.35
2.1
2.05
2.3
-40
-15
10
35
60
2.0
-40
85
10
-15
TEMPERATURE (oC)
35
60
85
TEMPERATURE (oC)
FIGURE 17. VRT vs TEMPERATURE
FIGURE 18. VRT - VRB vs TEMPERATURE
0.75
25
VRB SHORTED TO VRBS
VRT SHORTED TO VRTS
OUTPUT RISING EDGE
20
DATA DELAY (ns)
VRB (V)
0.7
0.65
OUTPUT FALLING EDGE
15
10
0.6
5
0.55
-40
-15
10
35
60
0
-40
85
10
-15
TEMPERATURE (oC)
35
60
85
TEMPERATURE (oC)
FIGURE 19. VRB vs TEMPERATURE
FIGURE 20. OUTPUT DATA DELAY vs TEMPERATURE
A/D OUTPUT CODE TABLE
DIGITAL OUTPUT CODE
INPUT SIGNAL
VOLTAGE
STEP
MSB
D6
D5
D4
D3
D2
D1
LSB
VRT
255
1
1
1
1
1
1
1
1
•
•
•
•
•
•
•
•
•
•
•
128
1
0
0
0
0
0
0
0
127
0
1
1
1
1
1
1
1
VRB
0
0
0
0
•
•
•
•
•
•
•
•
•
0
9
0
0
0
0
HI1175
Detailed Description
Power, Grounding, and Decoupling
The HI1175 is a 2-step A/D converter featuring a 4-bit upper
comparator group and two lower comparator groups of 4 bits
each. The reference voltage can be obtained from the
onboard bias generator or be supplied externally. This IC
uses an offset canceling type comparator that operates
synchronously with an external clock. The operating modes of
the part are input sampling (S), hold (H), and compare (C).
To reduce noise effects, separate the analog and digital
grounds.
In order to avoid latchup at power up, it is necessary that
AVDD and DVDD be driven from the same supply.
Bypass both the digital and analog VDD pins to their
respective grounds with a ceramic 0.1µF capacitor close to
the pin.
The operation of the part is illustrated in Figure 2. A
reference voltage that is between VRT -VRB is constantly
applied to the upper 4-bit comparator group. VI(1) is
sampled with the falling edge of the first clock by the upper
comparator block. The lower block A also samples VI(1) on
the same edge. The upper comparator block finalizes
comparison data MD(1) with the rising edge of the first clock.
Simultaneously the reference supply generates a reference
voltage RV(1) that corresponds to the upper results and
applies it to the lower comparator block A. The lower
comparator block finalizes comparison data LD(1) with the
rising edge of the second clock. MD(1) and LD(1) are
combined and output as OUT(1) with the rising edge of the
third clock. There is a 2.5 cycle clock delay from the analog
input sampling point to the corresponding digital output data.
Notice how the lower comparator blocks A and B alternate
generating the lower data in order to increase the overall A/D
sampling rate.
Analog Input
The input capacitance is small when compared with other
flash type A/D converters. However, it is necessary to drive
the input with an amplifier with sufficient bandwidth and drive
capability. In order to prevent parasitic oscillation, it may be
necessary to insert a low value (i.e., 0.24Ω) resistor between
the output of the amplifier and the A/D input.
Reference Input
The range of the A/D is set by the voltage between VRT and
VRB . The internal bias generator will set VRTS to 2.6V and
VRBS to 0.6V. These can be used as the part reference by
shorting VRT and VRTS and VRB to VRBS . The analog input
range of the A/D will now be from 0.6V to 2.6V and is
referred to as Self Bias Mode 1. Self Bias Mode 2 is where
VRB is connected to AGND and VRT is shorted to VRTS .
The analog input range will now be from 0V to 2.4V.
Test Circuits
+V
S2
-
S1 : ON IF A < B
S2 : ON IF A > B
S1
+
-V
A<B
A>B
COMPARATOR
VIN
DUT
HI1175
8
“0”
A8
TO
A1
A0
B8
TO
B1
B0
8
BUFFER
“1”
DVM
8
CLK (20MHz)
000 • • • 00
TO
111 • • • 10
CONTROLLER
FIGURE 21. INTEGRAL AND DIFFERENTIAL NON-LINEARITY ERROR AND OFFSET VOLTAGE TEST CIRCUIT
10
HI1175
Test Circuits
(Continued)
2.6V
ERROR RATE
fC -1kHz
SG
HPF
0.6V
1
100
IRE
0
-40
SG
(CW)
VIN
AMP
2
NTSC
SIGNAL
SOURCE
40 IRE
MODULATION
COUNTER
HI20201
DUT
HI1175
8
TTL
1
8
10-BIT
D/A
ECL
620
2
VECTOR
SCOPE
CLK
2.6V
BURST
DG
DP
-5.2V
620
0.6V
SYNC
-5.2V
TTL
fC
ECL
FIGURE 22. MAXIMUM OPERATIONAL SPEED AND DIFFERENTIAL GAIN AND PHASE ERROR TEST CIRCUIT
VDD
VRT
2.6V
VIN
VIN
VRB
0.6V
VDD
VRT
2.6V
IOL
IOH
VRB
0.6V
HI1175
HI1175
CLK
CLK
VOL
OE
GND
VOH
OE
+
GND
-
+
-
FIGURE 23. DIGITAL OUTPUT CURRENT TEST CIRCUIT
ICL8069
REFERENCE
A/D
AMP
HI1175 (8-Bit)
HA5020 (Single)
HA5022(Dual)
HA5024 (Quad)
HA5013 (Triple)
DSP/µP
HSP9501
HSP48901
HSP43881
HSP43168
D/A
HI3338 (8-Bit)
HI1171 (8-Bit)
HSP9501: Programmable Data Buffer
HSP48901: 3 x 3 Image Filter, 30MHz, 8-Bit
HSP43881: Digital Filter, 30MHz, 1-D and 2-D FIR Filters
HSP43168: Dual FIR Filter, 10-Bit, 33MHz/45MHz
CMOS Logic Available in HC, HCT, AC, ACT and FCT.
HA5013:
HA5020:
HA5022:
HA5024:
Triple, 125MHz, IOUT = 20mA
Single, 100MHz, IOUT = 30mA, Output Enable/Disable
Dual, 125MHz, IOUT = 20mA, Output Enable/Disable
Quad, 125MHz, IOUT = 20mA, Output Enable/Disable
FIGURE 24. 8-BIT SYSTEM COMPONENTS
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AMP
HA5020 (Single)
HI1175
Static Performance Definitions
Total Harmonic Distortion
Offset, full scale, and gain all use a measured value of the
internal voltage reference to determine the ideal plus and
minus full scale values. The results are all displayed in
LSBs.
This is the ratio of the RMS sum of the first 5 harmonic
components to the RMS value of the measured input signal.
Offset Error (EOB)
The first code transition should occur at a level 1/2 LSB
above the bottom reference voltage. Offset is defined as the
deviation of the actual code transition from this point. Note
that this is adjustable to zero.
Full Scale Error (EOT)
The last code transition should occur for a analog input that
is 11/2 LSBs below full scale. Full scale error is defined as
the deviation of the actual code transition from this point.
Differential Linearity Error (DNL)
DNL is the worst case deviation of a code width from the
ideal value of 1 LSB. The converter is guaranteed to have no
missing codes.
Integral Linearity Error (INL)
2nd and 3rd Harmonic Distortion
This is the ratio of the RMS value of the 2nd and 3rd
harmonic component respectively to the RMS value of the
measured input signal.
Spurious Free Dynamic Range (SFDR)
SFDR is the ratio of the fundamental RMS amplitude to the
RMS amplitude of the next largest spur or spectral
component. If the harmonics are buried in the noise floor it is
the largest peak.
Full Power Input Bandwidth
Full power bandwidth is the frequency at which the
amplitude of the digitally reconstructed output has
decreased 3dB below the amplitude of the input sine wave.
The input sine wave has a peak-to-peak amplitude equal to
the reference voltage. The bandwidth given is measured at
the specified sampling frequency.
INL is the worst case deviation of a code center from a best
fit straight line calculated from the measured data.
Timing Definitions
Dynamic Performance Definitions
Sampling delay is the time delay between the external
sample command (the falling edge of the clock) and the time
at which the signal is actually sampled. This delay is due to
internal clock path propagation delays.
Fast Fourier Transform (FFT) techniques are used to
evaluate the dynamic performance of the HI1175. A low
distortion sine wave is applied to the input, it is sampled, and
the output is stored in RAM. The data is then transformed
into the frequency domain with a 1024 point FFT and
analyzed to evaluate the dynamic performance of the A/D.
The sine wave input to the part is -0.5dB down from fullscale
for all these tests. The distortion numbers are quoted in dBc
(decibels with respect to carrier) and DO NOT include any
correction factors for normalizing to fullscale.
Signal-to-Noise Ratio (SNR)
SNR is the measured RMS signal to RMS noise at a
specified input and sampling frequency. The noise is the
RMS sum of all of the spectral components except the
fundamental and the first five harmonics.
Signal-to-Noise + Distortion Ratio (SINAD)
SINAD is the measured RMS signal to RMS sum of all
other spectral components below the Nyquist frequency
excluding DC.
Effective Number Of Bits (ENOB)
The effective number of bits (ENOB) is derived from the
SINAD data. ENOB is calculated from:
ENOB = (SINAD - 1.76 + VCORR) / 6.02,
where: VCORR = 0.5dB.
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Sampling Delay (tSD)
Aperture Jitter (tAJ)
This is the RMS variation in the sampling delay due to
variation of internal clock path delays.
Data Latency (tLAT)
After the analog sample is taken, the data on the bus is
available after 2.5 cycles of the clock. This is due to the
architecture of the converter where the data has to ripple
through the stages. This delay is specified as the data
latency. After the data latency time, the data representing
each succeeding sample is output at the following clock
pulse. The digital data lags the analog input by 2.5 cycles.
Output Data Delay (tD)
Output Data Delay is the delay time from when the data is
valid (rising clock edge) to when it shows up at the output
bus. This is due to internal delays at the digital output.
HI1175
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