VSMS3700 Vishay Semiconductors Infrared Emitting Diode, RoHS Compliant, 950 nm, GaAs FEATURES • Package type: surface mount • Package form: PLCC-2 • Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75 • Peak wavelength: λp = 950 nm • High reliability • Angle of half intensity: ϕ = ± 60° • Low forward voltage 94 8553 • Suitable for high pulse current operation • Good spectral matching with Si photodetectors • Package matched with IR emitter series VEMT3700 • Floor life: 4 weeks, MSL 2a, acc. J-STD-020 • Lead (Pb)-free reflow soldering DESCRIPTION • Lead (Pb)-free component in accordance RoHS 2002/95/EC and WEEE 2002/96/EC VSMS3700 is an infrared, 950 nm emitting diode in GaAs technology, molded in a PLCC-2 package for surface mounting (SMD). with APPLICATIONS • Infrared source in tactile keyboards • IR diode in low space applications • PCB mounted infrared sensors • Emitter in miniature photo-interrupters PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λP (nm) tr (ns) ± 60 950 800 VSMS3700 4.5 Note Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE VSMS3700-GS08 VSMS3700-GS18 Note MOQ: minimum order quantity PACKAGING REMARKS PACKAGE FORM Tape and reel Tape and reel MOQ: 7500 pcs, 1500 pcs/reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2 PLCC-2 ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL VALUE Reverse voltage TEST CONDITION VR 5 UNIT V Forward current IF 100 mA mA Peak forward current tp/T = 0.5, tp = 100 µs IFM 200 Surge forward current tp = 100 µs IFSM 1.5 A PV 170 mW Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient Tj 100 °C Tamb - 40 to + 85 °C °C Tstg - 40 to + 100 acc. figure 11, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W Note Tamb = 25 °C, unless otherwise specified www.vishay.com 322 For technical questions, contact: [email protected] Document Number: 81373 Rev. 1.2, 04-Sep-08 VSMS3700 Infrared Emitting Diode, RoHS Compliant, Vishay Semiconductors 950 nm, GaAs 120 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 180 140 120 100 RthJA = 250 K/W 80 60 40 100 80 60 RthJA = 250 K/W 40 20 20 0 0 0 10 21341 20 30 40 50 60 70 80 90 0 100 Tamb - Ambient Temperature (°C) 10 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 21342 Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity TEST CONDITION SYMBOL TYP. MAX. IF = 100 mA, tp = 20 ms VF MIN. 1.3 1.7 IF = 1 A, tp = 100 µs VF 1.8 IF = 100 mA TKVF - 1.3 VR = 5 V IR VR = 0 V, f = 1 MHz, E = 0 Cj IF = 100 mA, tp = 20 ms Ie 4.5 V V mV/K 100 µA 8.0 mW/sr 30 1.6 UNIT pF IF = 1.5 A, tp = 100 µs Ie 35 IF = 100 mA, tp = 20 ms φe 15 mW IF = 100 mA TKφe - 0.8 %/K ϕ ± 60 deg Peak wavelength IF = 100 mA λp 950 nm Spectral bandwidth IF = 100 mA Δλ 50 nm Temperature coefficient of λp IF = 100 mA TKλp 0.2 nm/K IF = 20 mA tr 800 ns IF = 1 A tr 400 ns IF = 20 mA tf 800 ns IF = 1 A tf 400 ns EN 60825-1 d 0.5 mm Radiant power Temperature coefficient of φe Angle of half intensity Rise time Fall time Virtual source diameter mW/sr Note Tamb = 25 °C, unless otherwise specified Document Number: 81373 Rev. 1.2, 04-Sep-08 For technical questions, contact: [email protected] www.vishay.com 323 VSMS3700 Vishay Semiconductors Infrared Emitting Diode, RoHS Compliant, 950 nm, GaAs BASIC CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 10 000 100 I F - Forward Current (mA) Ie - Radiant Intensity (mW/sr) Tamb < 60 °C tp/T = 0.005 0.01 1000 0.02 0.05 100 0.2 0.5 DC 0.1 10 1 0.01 1 10 100 t p - Pulse Length (ms) 100 Φe - Radiant Power (mW) I F - Forward Current (mA) 103 104 1000 10 3 10 2 10 1 10 0 0 1 2 3 100 10 1 0.1 100 4 V F - Forward Voltage (V) 94 7996 101 102 103 104 IF - Forward Current (mA) 94 8012 Fig. 4 - Forward Current vs. Forward Voltage Fig. 7 - Radiant Power vs. Forward Current 1.2 1.6 1.1 1.2 IF = 10 mA Ie rel; Φe rel VF rel - Relative Forward Voltage (V) 102 Fig. 6 - Radiant Intensity vs. Forward Current 10 4 1.0 0.9 IF = 20 mA 0.8 0.4 0.8 0.7 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 5 - Relative Forward Voltage vs. Ambient Temperature www.vishay.com 324 101 IF - Forward Current (mA) 94 7956 Fig. 3 - Pulse Forward Current vs. Pulse Duration 94 7990 1 0.1 0.1 95 9985 10 -1 10 0 - 10 0 10 94 7993 50 100 140 T amb - Ambient Temperature (°C) Fig. 8 - Relative Radiant Intensity/Power vs. Ambient Temperature For technical questions, contact: [email protected] Document Number: 81373 Rev. 1.2, 04-Sep-08 VSMS3700 Infrared Emitting Diode, RoHS Compliant, Vishay Semiconductors 950 nm, GaAs 0° 10° 20° 1.0 0.75 0.5 0.25 IF = 100 mA 0 900 0.9 50° 0.8 60° 1000 950 70° 0.7 80° 0.6 0.4 0.2 0 94 8013 λ - Wavelength (nm) 94 7994 40° 1.0 ϕ - Angular Displacement 30° Ie rel - Relative Radiant Intensity Φe rel - Relative Radiant Power 1.25 Fig. 9 - Relative Radiant Power vs. Wavelength Fig. 10 - Relative Radiant Intensity vs. Angular Displacement PACKAGE DIMENSIONS in millimeters 0.9 1.75 ± 0.1 3.5 ± 0.2 Pin identification Mounting Pad Layout 4 A area covered with solder resist 2.6 (2.8) C 2.2 2.8 ± 0.15 1.2 4 Ø 2.4 1.6 (1.9) 3 + 0.15 20541 Die Position (for reference only) X = +/- 0.2 mm centrical Y = +/- 0.2 mm centrical Z = 1.13 mm +/- 0.25 mm, from top of die bottom of component Document Number: 81373 Rev. 1.2, 04-Sep-08 For technical questions, contact: [email protected] www.vishay.com 325 VSMS3700 Vishay Semiconductors Infrared Emitting Diode, RoHS Compliant, 950 nm, GaAs SOLDER PROFILE max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 Temperature (°C) 2.2 2.0 3.5 3.1 300 5.75 5.25 200 4.0 3.6 max. 30 s 150 3.6 3.4 max. 100 s max. 120 s 8.3 7.7 100 1.85 1.65 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 1.6 1.4 4.1 3.9 0 0 50 19841 100 150 200 250 0.25 4.1 3.9 2.05 1.95 300 94 8668 Time (s) Fig. 11 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D Fig. 13 - Tape Dimensions in mm for PLCC-2 DRYPACK MISSING DEVICES Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. A maximum of 0.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020. De-reeling direction 94 8158 DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. > 160 mm Tape leader 40 empty compartments min. 75 empty compartments Carrier leader Carrier trailer Fig. 14 - Beginning and End of Reel TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. The tape leader is at least 160 mm and is followed by a carrier tape leader with at least 40 empty compartments. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartments and sealed with cover tape. Adhesive tape Blister tape Component cavity 94 8670 Fig. 12 - Blister Tape www.vishay.com 326 For technical questions, contact: [email protected] Document Number: 81373 Rev. 1.2, 04-Sep-08 VSMS3700 Infrared Emitting Diode, RoHS Compliant, Vishay Semiconductors 950 nm, GaAs COVER TAPE REMOVAL FORCE 10.0 9.0 120° 4.5 3.5 2.5 1.5 The removal force lies between 0.1 N and 1.0 N at a removal speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 180° with regard to the feed direction. 13.00 12.75 63.5 60.5 Identification Label: Vishay type group tape code production code quantity 14.4 max. 180 178 94 8665 Fig. 15 - Dimensions of Reel-GS08 10.4 8.4 120° 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 Identification Label: Vishay type group tape code production code quantity 321 329 14.4 max. 18857 Fig. 16 - Dimensions of Reel-GS18 Document Number: 81373 Rev. 1.2, 04-Sep-08 For technical questions, contact: [email protected] www.vishay.com 327 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1