VISHAY SI1426DH_08

Si1426DH
New Product
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
D TrenchFETr Power MOSFET
D Thermally Enhanced SC-70 Package
D PWM Optimized
PRODUCT SUMMARY
VDS (V)
rDS(on) (W)
ID (A)
0.075 @ VGS = 10 V
3.6
APPLICATIONS
0.115 @ VGS = 4.5 V
2.9
D Boost Converter in Portable Devices
– Low Gate Charge (3 nC)
D Low Current Synchronous Rectifier
30
SOT-363
SC-70 (6-LEADS)
D
1
6
D
D
2
5
D
AC
G
3
4
XX
YY
Marking Code
Lot Traceability
and Date Code
S
Part # Code
Top View
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)
_ a
TA = 25_C
V
3.6
2.8
2.6
2.1
ID
TA = 85_C
Pulsed Drain Current
IDM
Continuous Diode Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
Unit
TA = 85_C
Operating Junction and Storage Temperature Range
PD
A
10
1.3
0.8
1.6
1.0
0.8
0.5
TJ, Tstg
W
_C
–55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 5 sec
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
60
80
100
125
34
45
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71805
S-05803—Rev. A, 18-Feb-02
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Si1426DH
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VDS = VGS, ID = 250 mA
0.80
Typ
Max
Unit
2.5
V
"100
nA
Static
Gate Threshold Voltage
VGS(th)
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Voltagea
VDS = 24 V, VGS = 0 V
1
VDS = 24 V, VGS = 0 V, TJ = 85_C
5
VDS = 5 V, VGS = 10 V
m
mA
10
A
VGS = 10 V, ID = 3.6 A
0.061
0.075
VGS = 4.5 V, ID = 2.0 A
0.092
0.115
gfs
VDS = 10 V, ID = 3.6 A
5
VSD
IS = 1.3 A, VGS = 0 V
0.78
1.2
1.9
3
VDS = 15 V, VGS = 4.5 V, ID = 3.6 A
0.75
rDS(on)
Forward Transconductancea
Diode Forward
VDS = 0 V, VGS = "20 V
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
0.75
Turn-On Delay Time
td(on)
10
15
tr
12
18
15
22
9
15
40
70
Rise Time
Turn-Off Delay Time
VDD = 15 V, RL = 15 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery
trr
IF = 1.4 A. di/dt = 100/ms
nC
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
10
10
VGS = 10 thru 5 V
4V
8
I D – Drain Current (A)
I D – Drain Current (A)
8
6
4
3V
2
6
4
TC = 125_C
2
25_C
–55_C
0
0.0
0
0.5
1.0
1.5
2.0
2.5
3.0
VDS – Drain-to-Source Voltage (V)
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2
3.5
4.0
0
1
2
3
4
5
VGS – Gate-to-Source Voltage (V)
Document Number: 71805
S-05803—Rev. A, 18-Feb-02
Si1426DH
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
250
C – Capacitance (pF)
r DS(on) – On-Resistance ( W )
0.16
0.12
VGS = 4.5 V
0.08
VGS = 10 V
200
Ciss
150
Coss
100
Crss
0.04
50
0.00
0
0
2
4
6
8
10
0
6
ID – Drain Current (A)
Gate Charge
r DS(on) – On-Resistance (W)
(Normalized)
V GS – Gate-to-Source Voltage (V)
30
On-Resistance vs. Junction Temperature
8
6
4
2
VGS = 10 V
ID = 3.6 A
1.6
1.4
1.2
1.0
0.8
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.6
–50
4.0
–25
0
Qg – Total Gate Charge (nC)
25
50
75
100
125
150
TJ – Junction Temperature (_C)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.20
r DS(on) – On-Resistance ( W )
10
I S – Source Current (A)
24
1.8
VDS = 15 V
ID = 3.6 A
TJ = 150_C
1
TJ = 25_C
0.1
0.0
18
VDS – Drain-to-Source Voltage (V)
10
0
0.0
12
0.16
ID = 1 A
ID = 3.6 A
0.12
0.08
0.04
0.00
0.2
0.4
0.6
0.8
1.0
VSD – Source-to-Drain Voltage (V)
Document Number: 71805
S-05803—Rev. A, 18-Feb-02
1.2
0
2
4
6
8
10
VGS – Gate-to-Source Voltage (V)
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Si1426DH
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Single Pulse Power
30
0.2
25
ID = 250 mA
20
–0.0
Power (W)
V GS(th) Variance (V)
Threshold Voltage
0.4
–0.2
15
–0.4
10
–0.6
5
–0.8
–50
–25
0
25
50
75
100
125
150
0
0.001
0.01
1
0.1
TJ – Temperature (_C)
10
100
600
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA =100_C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
10–3
10–2
10–1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
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4
10–3
10–2
10–1
Square Wave Pulse Duration (sec)
1
10
Document Number: 71805
S-05803—Rev. A, 18-Feb-02
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
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or in any other disclosure relating to any product.
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therein, which apply to these products.
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Document Number: 91000
Revision: 18-Jul-08
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