VISHAY SI3469DV

Si3469DV
Vishay Siliconix
New Product
P-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
−20
D TrenchFETr Power MOSFET
rDS(on) (W)
ID (A)
0.030 @ VGS = −10 V
−6.7
0.051 @ VGS = −4.5 V
−5.1
APPLICATIONS
D Load Switch
− Notebook PC
− Game Machine
− Desktop
TSOP-6
Top View
3 mm
1
6
2
5
3
4
(4) S
(3) G
(1, 2, 5, 6) D
2.85 mm
P-Channel MOSFET
Ordering Information: Si3469DV-T1—E3 (Lead Free)
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
VDS
−20
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current
ID
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
PD
V
−5.0
−6.7
−5.3
−4.0
IDM
Continuous Source Current (Diode Conduction)a
−25
−1.7
−0.95
2.0
1.14
1.3
0.73
TJ, Tstg
Unit
−55 to 150
A
W
_C
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Symbol
t v 5 sec
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
45
62.5
90
110
25
30
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 72676
S-40271—Rev. A, 23-Feb-04
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Si3469DV
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = −250 mA
−1.0
Typ
Max
Unit
−3
V
"100
nA
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain Source On-State
Drain-Source
On State Resistancea
VDS = 0 V, VGS = "20 V
Diode Forward Voltagea
−1
VDS = −20 V, VGS = 0 V, TJ = 85_C
−5
VDS v −5 V, VGS = −10 V
rDS(on)
DS( )
Forward Transconductancea
VDS = −20 V, VGS = 0 V
−25
mA
A
VGS = −10 V, ID = −6.7 A
0.024
0.030
VGS = −4.5 V, ID = −2 A
0.041
0.051
gfs
VDS = −15 V, ID = −6.7 A
15
VSD
IS = −1.7 A, VGS = 0 V
−0.8
−1.2
20
30
VDS = −10 V, VGS = −10 V, ID = −6.7 A
3.8
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
4.8
Rg
Turn-On Delay Time
f = 1 MHz
9
td(on)
Rise Time
tr
Turn-Off Delay Time
VDD = −10 V, RL = 10 W
ID ^ −1 A, VGEN = −10 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
nC
IF = −1.7 A, di/dt = 100 A/ms
W
10
15
12
20
50
75
35
55
25
50
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
25
25
VGS = 10 thru 5 V
20
15
I D − Drain Current (A)
I D − Drain Current (A)
20
4V
10
5
15
10
TC = 125_C
5
25_C
3V
0
0
1
2
3
4
VDS − Drain-to-Source Voltage (V)
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2
5
0
0.0
1.0
2.0
−55_C
3.0
4.0
5.0
VGS − Gate-to-Source Voltage (V)
Document Number: 72676
S-40271—Rev. A, 23-Feb-04
Si3469DV
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
1500
0.14
C − Capacitance (pF)
r DS(on) − On-Resistance ( W )
0.16
0.12
0.10
0.08
VGS = 4.5 V
0.06
0.04
1200
Ciss
900
600
Coss
VGS = 10 V
300
Crss
0.02
0.00
0
0
5
10
15
20
25
0
4
ID − Drain Current (A)
Gate Charge
16
20
On-Resistance vs. Junction Temperature
1.6
VDS = 10 V
ID = 6.7 A
VGS = 10 V
ID = 6.7 A
8
1.4
rDS(on) − On-Resiistance
(Normalized)
V GS − Gate-to-Source Voltage (V)
12
VDS − Drain-to-Source Voltage (V)
10
6
4
2
1.2
1.0
0.8
0
0
4
8
12
16
0.6
−50
20
−25
0
Qg − Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.10
r DS(on) − On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
1
0.0
25
TJ − Junction Temperature (_C)
30
I S − Source Current (A)
8
0.08
ID = 2 A
ID = 6.7 A
0.06
0.04
0.02
0.00
0.2
0.4
0.6
0.8
1.0
VSD − Source-to-Drain Voltage (V)
Document Number: 72676
S-40271—Rev. A, 23-Feb-04
1.2
1.4
0
2
4
6
8
10
VGS − Gate-to-Source Voltage (V)
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Si3469DV
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Single Pulse Power
50
0.4
40
ID = 250 mA
0.2
30
Power (W)
V GS(th) Variance (V)
Threshold Voltage
0.6
0.0
20
−0.2
10
−0.4
−50
−25
0
25
50
75
100
125
0
10−3
150
10−2
10−1
TJ − Temperature (_C)
1
10
100
600
Time (sec)
Safe Operating Area
100
IDM Limited
rDS(on) Limited
P(t) = 0.0001
I D − Drain Current (A)
10
P(t) = 0.001
1
ID(on)
Limited
P(t) = 0.01
P(t) = 0.1
0.1
P(t) = 1
P(t) = 10
dc
TA = 25_C
Single Pulse
BVDSS Limited
0.01
0.1
1
10
100
VDS − Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 90_C/W
3. TJM − TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10−4
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4
10−3
10−2
10−1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 72676
S-40271—Rev. A, 23-Feb-04
Si3469DV
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
Document Number: 72676
S-40271—Rev. A, 23-Feb-04
10−3
10−2
10−1
Square Wave Pulse Duration (sec)
1
10
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Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
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or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
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Document Number: 91000
Revision: 08-Apr-05
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