VISHAY SUM90N08-4M8P

SUM90N08-4m8P
Vishay Siliconix
N-Channel 75-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
V(BR)DSS (V)
75
rDS(on) (Ω)
ID (A)
0.0048 at VGS = 10 V
90d
0.006 at VGS = 8 V
90
d
• TrenchFET® Power MOSFET
• 175 °C Junction Temperature
• 100 % UIS Tested
Qg (Typ)
105
RoHS
COMPLIANT
APPLICATIONS
• Power Supply
- Half-Bridge
- Secondary Synchronous Rectification
• Industrial
TO-263
D
G
D S
G
Top View
Ordering Information: SUM90N08-4m8P-E3 (Lead (Pb)-free)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
75
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 175 °C)
TC = 25 °C
TC = 70 °C
ID
IDM
Pulsed Drain Current
Avalanche Current
a
L = 0.1 mH
Single Pulse Avalanche Energy
TC = 25 °C
Maximum Power Dissipationa
TA = 25
Operating Junction and Storage Temperature Range
°Cc
Unit
V
90d
90d
240
IAS
70
EAS
245
A
mJ
b
PD
300
3.75
W
TJ, Tstg
- 55 to 175
°C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB Mount)
c
Junction-to-Case (Drain)
RthJA
40
RthJC
0.5
°C/W
Notes:
a. Duty cycle ≤ 1 %.
b. See SOA curve for voltage derating.
c. When Mounted on 1" square PCB (FR-4 material).
d. Package limited.
Document Number: 74458
S-71663-Rev. C, 06-Aug-07
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SUM90N08-4m8P
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
V(BR)DSS
VDS = 0 V, ID = 250 µA
75
VGS(th)
VDS = VGS, ID = 250 µA
2
IGSS
VDS = 0 V, VGS = ± 20 V
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
1
VDS = 75 V, VGS = 0 V, TJ = 125 °C
50
VDS = 75 V, VGS = 0 V, TJ = 150 °C
250
VDS ≥ 10 V, VGS = 10 V
VGS = 10 V, ID = 20 A
a
Forward Transconductance
± 250
VDS = 75 V, VGS = 0 V
ID(on)
Drain-Source On-State Resistancea
4
rDS(on)
gfs
70
V
nA
µA
A
0.004
0.0048
VGS = 10 V, ID = 20 A, TJ = 125 °C
0.0096
VGS = 8 V, ID = 20 A, TJ = 150 °C
0.0106
VGS = 8 V, ID = 20 A
0.0046
VDS = 15 V, ID = 20 A
58
Ω
0.006
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
c
Gate-Source Charge
Qgs
Gate-Drain Chargec
Qgd
c
Rise Timec
Turn-Off Delay Time
105
VDS = 30 V, VGS = 10 V, ID = 85 A
c
Fall Timec
td(off)
160
nC
32
28
f = 1 MHz
td(on)
tr
pF
571
275
Rg
Gate Resistance
Turn-On Delay Time
6460
VGS = 0 V, VDS = 40 V, f = 1 MHz
VDD = 30 V, RL = 0.4 Ω
ID ≅ 85 A, VGEN = 10 V, Rg = 1 Ω
tf
1.3
2.6
23
35
17
26
34
52
8
15
Ω
ns
Source-Drain Diode Ratings and Characteristics (TC = 25 °C)b
IS
85
Pulsed Current
ISM
240
Forward Voltagea
VSD
Continuous Current
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 30 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = 75 A, di/dt = 100 A/µs
A
0.85
1.5
V
68
100
ns
2.6
4
A
88
132
µC
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 74458
S-71663-Rev. C, 06-Aug-07
SUM90N08-4m8P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
120
120
VGS = 10 thru 6 V
100
I D - Drain Current (A)
I D - Drain Current (A)
100
80
60
40
5V
80
60
40
20
20
0
0
TC = 125 °C
25 °C
- 55 °C
0
1
2
3
4
5
0
2
VDS - Drain-to-Source Voltage (V)
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.015
150
gfs - Transconductance (S)
25 °C
90
125 °C
60
30
r DS(on) - On-Resistance ( )
TC = - 55 °C
120
0.012
0.009
VGS = 8 V
0.006
0.003
VGS = 10 V
0.000
0
0
10
20
30
40
50
0
60
20
40
80
100
ID - Drain Current (A)
VGS - Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
8200
0.020
ID = 20 A
Ciss
6560
0.016
C - Capacitance (pF)
r DS(on) - On-Resistance ( )
60
0.012
125 °C
0.008
3280
1640
25 °C
0.004
4920
Coss
0.000
4.0
Crss
0
5.2
6.4
7.6
8.8
VGS - Gate-to-Source Voltage (V)
On-resistance vs. Gate-to-Source Voltage
Document Number: 74458
S-71663-Rev. C, 06-Aug-07
10.0
0
15
30
45
60
75
VDS - Drain-to-Source Voltage (V)
Capacitance
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SUM90N08-4m8P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
10
2.0
ID = 20 A
VDS = 30 V
8
6
1.7
r DS(on) - On-Resistance
(Normalized)
V GS - Gate-to-Source Voltage (V)
ID = 85 A
VDS = 60 V
4
2
10 V
1.4
1.1
0.8
0
0
23
46
69
92
0.5
- 50
115
- 25
Gate Charge
50
75
100
125
150
175
0.7
150 °C
10
0.2
V GS(th) Variance (V)
I S - Source Current (A)
25
On-Resistance vs. Junction Temperature
100
1.0
25 °C
0.1
0.01
ID = 5 mA
- 0.3
- 0.8
- 1.3
ID = 250 µA
- 1.8
0.001
0.0
0
TJ - Junction Temperature (°C)
Qg - Total Gate Charge (nC)
0.2
0.4
0.6
0.8
1.0
- 2.3
- 50
1.2
VSD - Source-to-Drain Voltage (V)
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Threshold Voltage
Source-Drain Diode Forward Voltage
100
100
ID = 1 mA
90
IDAV (A)
V(BR)DSS (normalized)
95
150 °C
25 °C
10
85
80
75
- 50
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Drain Source Breakdown vs. Junction Temperature
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1
0.00001 0.0001
0.001
0.01
0.1
1.0
TAV (sec)
Single Pulse Avalanche Current Capability
vs. Time
Document Number: 74458
S-71663-Rev. C, 06-Aug-07
SUM90N08-4m8P
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
180
1000
*Limited by r DS(on)
144
100 µs
108
I D - Drain Current (A)
I D - Drain Current (A)
100
Package Limited
72
1 ms
10
10 ms
100 ms
dc
1
36
TC = 25 °C
Single Pulse
0
0.1
0
25
50
75
100
125
150
0.1
1
TC - Case Temperature (°C)
*VGS
Maximum Drain Current vs. Case Temperature
10
100
VDS - Drain-to-Source Voltage (V)
minimum VGS at which rDS(on) is specified
Safe Operating Area
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
Square Wave Pulse Duration (sec)
10-1
1
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?74458.
Document Number: 74458
S-71663-Rev. C, 06-Aug-07
www.vishay.com
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
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Document Number: 91000
Revision: 18-Jul-08
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