VISHAY SUM90P10-19L

SUM90P10-19L
Vishay Siliconix
P-Channel 100-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 100
rDS(on) (Ω)
ID (A)
0.019 at VGS = - 10 V
- 90
0.021 at VGS = - 4.5 V
- 85
Qg (Typ)
• TrenchFET® Power MOSFET
RoHS
COMPLIANT
97 nC
S
TO-263
G
Drain Connected to Tab
G
D
S
D
Top View
P-Channel MOSFET
Ordering Information: SUM90P10-19L-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TC = 25 °C
TC = 125 °C
TA = 25 °C
TA = 125 °C
ID
IDM
Pulsed Drain Current
TC = 25 °C
TA = 25 °C
IS
Avalanche Current
Single-Pulse Avalanche Energy
L = 0.1 mH
IAS
EAS
Maximum Power Dissipation
TC = 25 °C
TC = 125 °C
TA = 25 °C
TA = 125 °C
PD
Continuous Source-Drain Diode Current
Limit
- 100
± 20
- 90
- 52
TJ, Tstg
Operating Junction and Storage Temperature Range
Unit
V
- 17.2b, c
- 9.9b, c
- 90
- 250
A
- 9b, c
- 70
245
375
125
mJ
13.6b, c
4.5b, c
- 50 to 175
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Case (Drain)
t ≤ 10 sec
Steady State
Symbol
RthJA
RthJC
Typical
8
0.33
Maximum
11
0.4
Unit
°C/W
Notes:
a. Package Limited.
b. Surface Mounted on 1" x 1" FR4 Board.
c. t = 10 sec.
d. Maximum under Steady State conditions is 40 °C/W.
Document Number: 73474
S-71207-Rev. D, 18-Jun-07
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SUM90P10-19L
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
VDS
VGS = 0 V, ID = - 250 µA
- 100
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
ID = - 250 µA
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS , ID = - 250 µA
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
V
- 125
mV/°C
5.9
-1
-3
V
± 100
nA
VDS = - 100 V, VGS = 0 V
-1
VDS = - 100 V, VGS = 0 V, TJ = 175 °C
- 500
VDS ≥ 10 V, VGS = - 10 V
rDS(on)
gfs
- 90
µA
A
VGS = - 10 V, ID = - 20 A
0.0156
0.019
VGS = - 4.5 V, ID = - 15 A
0.0173
0.021
VDS = - 15 V, ID = - 20 A
80
Ω
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
11100
VDS = - 50 V, VGS = 0 V, f = 1 MHz
VDS = - 50 V, VGS = - 10 V, ID = - 90 A
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
tr
pF
1690
217
326
97
146
VDS = - 50 V, VGS = - 4.5 V, ID = - 90 A
42
f = 1 MHz
3.5
nC
51
td(on)
td(off)
700
VDD = - 50 V, RL = 0.56 Ω
ID ≅ - 90 A, VGEN = - 10 V, RG = 1 Ω
tf
Ω
20
30
510
855
145
220
870
1300
ns
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode
Current
IS
Pulse Diode Forward Currenta
ISM
Body Diode Voltage
VSD
TC = 25 °C
- 90
A
- 250
IS = - 20 A
- 0.8
- 1.5
V
80
120
ns
220
330
nC
Body Diode Reverse Recovery
Time
trr
Body Diode Reverse Recovery
Charge
Qrr
Reverse Recovery Fall Time
ta
56
Reverse Recovery Rise Time
tb
24
IF = - 20 A, di/dt = 100 A/µs, TJ = 25 °C
ns
Notes
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 73474
S-71207-Rev. D, 18-Jun-07
SUM90P10-19L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
180
40
VGS = 10 thru 4V
30
ID – Drain Current (A)
ID – Drain-Current (A)
150
120
90
60
30
20
25 °C
10
3V
TC = 125 °C
0
0
1
2
3
0
0.0
4
- 55 °C
1.0
VDS – Drain-to-Source Voltage (V)
2.0
Transfer Characteristics
0.030
15000
VGS = 4.5 V
Ciss
12000
C – Capacitance (pF)
RDS(on) – On-Resistance (Ω)
4.0
VGS – Gate-to-Source Voltage (V)
Output Characteristics
0.020
VGS = 10
0.010
9000
6000
Crss
3000
0.000
Coss
0
0
20
40
60
80
100
120
0
20
ID – Drain Current (A)
40
80
100
Capacitance
10.0
2.5
VGS = 10 V
I D = - 90 A
8.0
ID = 20 A
rDS(on) – On-Resistance
(Normalized)
2.1
VDS = 50 V
6.0
VDS = 80 V
4.0
2.0
0.0
0.0
60
VDS – Drain-to-Source (V)
On-Resistance vs. Drain Current
VGS – Gate-to-Source Voltage (V)
3.0
1.7
1.3
0.9
40.0
80.0
120.0
160.0
200.0
240.0
0.5
- 50
- 25
0
25
50
75
100
125
150
Qg – Total Gate Charge (nC)
TJ – Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 73474
S-71207-Rev. D, 18-Jun-07
175
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SUM90P10-19L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
TJ = 150 C
0.10
RDS(on) – Drain-to-Source On-Resistance (Ω)
IS – Source Current (A)
100
25 C
10
0.08
0.06
0.04
125 °C
0.02
25 °C
0.00
1
0.0
0.3
0.6
0.9
1.2
1
2
3
4
5
6
7
8
9
10
VGS – Gate-to-Source Voltage (V)
VSD – Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.9
6000
0.7
5000
0.5
4000
Power (W)
VGS(th) Variance (V)
ID = 10 mA
0.3
3000
0.1
2000
- 0.1
1000
- 0.3
- 50
- 25
0
25
50
75
100
125
150
0
0.0001
175
0.001
TJ – Temperature (°C)
0.01
0.10
1
Time (sec)
Single Pulse, Junction-to-Case (TC = 25 °C)
Threshold Voltage
400
1000
350
ID – Drain Current (A)
Power Dissipation (W)
300
250
200
150
100
100
*Limited by r DS(on)
10 µs
100 µs
10
1 ms
10 ms
DC
1
Single pulse
Tc = 25 °C
50
0
25
50
75
100
125
150
TC – Case-Temperature (°C)
Power Derating (Junction-to-Case)
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175
0.1
0.1
100
1
10
VDS – Drain-to-Source Voltage (V)
* VGS > minimum VGS at which rDS(on) is specified
Safe Operating Area
Document Number: 73474
S-71207-Rev. D, 18-Jun-07
SUM90P10-19L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
120
IDav – Peak Avalanche Curent (A)
1000
I D – Drain Current (A)
90
60
30
100
10
1
0.1
0
0
25
50
75
100
125
150
175
0.00001
TC – Case Temperature (°C)
0.001
0.01
0.1
1.0
tin – Time in Avalanche (Sec)
Max Avalanche and Drain Current vs. Case Temperature
Normalized Effective Transient Thermal Impedance
0.0001
Avalanche Current vs. Time
1
0.5
0.2
0.1
0.05
0.1
0.02
Single
0.01
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (Sec)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73474.
Document Number: 73474
S-71207-Rev. D, 18-Jun-07
www.vishay.com
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
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document or by any conduct of Vishay.
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Document Number: 91000
Revision: 18-Jul-08
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