VISHAY SUD50N02-04P

SUD50N02-04P
Vishay Siliconix
N-Channel 20-V (D-S) 175_C MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (W)
ID (A)a
0.0043 @ VGS = 10 V
34
0.006 @ VGS = 4.5 V
28
VDS (V)
20
D TrenchFETr Power MOSFET
D 175_C Junction Temperature
D PWM Optimized for High Efficiency
APPLICATIONS
D
TO-252
Drain Connected to Tab
G
D
D Synchronous Buck Converter
− Low-Side
− Desktop, Servers, Desknote
D Synchronous Rectification
− POL
G
S
Top View
S
Ordering Information:
SUD50N02-04P
SUD50N02-04P—E3 (Lead Free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
"20
TA = 25_C
Continuous Drain Currenta
TC= 25_C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
Avalanche Currentc
Avalanche
L= 0.1
0 1 mH
Energyc
TA = 25_C
Maximum Power Dissipation
TC = 25_C
Operating Junction and Storage Temperature Range
Unit
V
34a
ID
50b
A
IDM
100
IS
8.3a
IAS
50
A
125
mJ
Eas
8.3a
PD
W
136
TJ, Tstg
−55 to 175
_C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction
Junction-to-Ambient
to Ambienta
Maximum Junction-to-Case
Symbol
t v 10 sec
Steady State
RthJA
RthJC
Typical
Maximum
15
18
40
50
0.85
1.1
Unit
_C/W
C/W
Notes
a. Surface Mounted on FR4 Board, t v 10 sec.
b. Limited by package
c. Single Pulse
Document Number: 72216
S-40272—Rev. B, 23-Feb-04
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SUD50N02-04P
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Typa
Symbol
Test Condition
Min
Max
V(BR)DSS
VGS = 0 V, ID = 250 mA
20
VGS(th)
VDS = VGS, ID = 250 mA
0.8
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 20 V, VGS = 0 V
1
VDS = 20 V, VGS = 0 V, TJ = 125_C
50
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currentb
ID(on)
VDS = 5 V, VGS = 10 V
0.0043
0.0061
VGS = 4.5 V, ID = 20 A
Forward Transconductanceb
gfs
mA
A
0.0035
VGS = 10 V, ID = 20 A, TJ = 125_C
rDS(on)
nA
50
VGS = 10 V, ID = 20 A
Drain-Source
Drain
Source On
On-State
State Resistanceb
V
3.0
0.0048
VDS = 15 V, ID = 20 A
W
0.006
15
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Gate Resistance
Rg
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
Gate-Drain Chargec
Qgd
Turn-On Delay Timec
td(on)
Rise Timec
5000
VGS = 0 V, VDS = 10 V, f = 1 MHz
f = 1 MHz
1.6
W
40
60
14
VDS = 10 V, VGS = 4.5 V, ID = 50 A
nC
13
VDD = 10 V, RL = 0.2 W
ID ^ 50 A, VGEN = 10 V, Rg = 2.5 W
td(off)
Fall Timec
pF
p
770
tr
Turn-Off Delay Timec
1650
tf
20
30
20
30
50
75
15
25
ns
Source-Drain Diode Ratings and Characteristic (TC = 25_C)
Pulsed Current
ISM
Diode Forward Voltageb
VSD
IF = 50 A, VGS = 0 V
0.9
1.5
V
trr
IF = 50 A, di/dt = 100 A/ms
45
70
ns
Source-Drain Reverse Recovery Time
100
A
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
c. Independent of operating temperature.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
200
200
160
120
ID - Drain Current (A)
ID - Drain Current (A)
VGS = 10 thru 5 V
4V
80
150
100
50
40
25_C
3V
0
0.0
2
−55_C
0
0.5
1.0
1.5
2.0
VDS - Drain-to-Source Voltage (V)
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TC = 125_C
2.5
3.0
0
1
2
3
4
5
6
VGS - Gate-to-Source Voltage (V)
Document Number: 72216
S-40272—Rev. B, 23-Feb-04
SUD50N02-04P
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Transconductance
On-Resistance vs. Drain Current
0.010
TC = −55_C
TC = 25_C
120
0.008
RDS-on - On−Resistance (W)
GFS - Transconductance (S)
160
TC = 125_C
80
40
0.006
VGS = 4.5 V
VGS = 10 V
0.004
0.002
0
0.000
0
15
30
45
60
0
20
40
Capacitance
V GS − Gate-to-Source Voltage (V)
Ciss
C − Capacitance (pF)
100
Gate Charge
10
6000
5000
4000
3000
Coss
2000
80
ID - Drain Current (A)
ID - Drain Current (A)
7000
60
Crss
1000
0
8
VDS = 10 V
ID = 50 A
6
4
2
0
0
5
10
15
0
20
20
VDS − Drain-to-Source Voltage (V)
1.8
40
60
80
Qg − Total Gate Charge (nC)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
100
1.4
VGS = 10 V
ID = 20 A
I S − Source Current (A)
rDS(on) − On-Resiistance
(Normalized)
1.6
1.2
1.0
TJ = 150_C
10
TJ = 25_C
0.8
0.6
−50
−25
0
25
50
75
100
125
TJ − Junction Temperature (_C)
Document Number: 72216
S-40272—Rev. B, 23-Feb-04
150
175
1
0
0.3
0.6
0.9
1.2
1.5
VSD − Source-to-Drain Voltage (V)
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SUD50N02-04P
Vishay Siliconix
THERMAL RATINGS
Max Avalanche and Drain Current vs.
Case Temperature
Safe Operating Area
1000
40
Limited
by rDS(on)
10 ms
100 ms
100
I D − Drain Current (A)
I D − Drain Current (A)
32
24
16
8
1 ms
10
10 ms
100 ms
1
1s
0.1
0
0
25
50
75
100
125
150
0.1
1
10
100
VDS − Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
dc
0.0
175
Tc − Case Temperature (_C)
1
10 s
100 s
Single Pulse
TA = 25_C
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
10−3
10−2
10−1
1
10
100
1000
Square Wave Pulse Duration (sec)
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Document Number: 72216
S-40272—Rev. B, 23-Feb-04
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Vishay
Disclaimer
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Document Number: 91000
Revision: 18-Jul-08
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