VISHAY SUP90N04-3M3P

SUP90N04-3m3P
Vishay Siliconix
N-Channel 40 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
RDS(on) (Ω)
ID (A)d
0.0033 at VGS = 10 V
90
0.0041 at VGS = 4.5 V
90
VDS (V)
40
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
Qg (Typ.)
87
APPLICATIONS
• Power Supply
- Secondary Synchronous Rectification
• DC/DC Converter
TO-220AB
D
G
G D S
S
Top View
N-Channel MOSFET
Ordering Information: SUP90N04-3m3P-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
40
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
TC = 70 °C
ID
IDM
Pulsed Drain Current
Avalanche Current
a
L = 0.1 mH
Single Avalanche Energy
TC = 25 °C
Maximum Power Dissipationa
TA = 25
Operating Junction and Storage Temperature Range
°Cc
V
90d
90d
160
IAS
60
EAS
180
PD
Unit
125
A
mJ
b
3.1
W
TJ, Tstg
- 55 to 150
°C
Symbol
Limit
Unit
RthJA
40
RthJC
1
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB Mount)
c
Junction-to-Case (Drain)
°C/W
Notes:
a. Duty cycle ≤ 1 %.
b. See SOA curve for voltage derating.
c. When Mounted on 1" square PCB (FR-4 material).
d. Package limited.
Document Number: 65902
S10-0632-Rev. A, 22-Mar-10
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SUP90N04-3m3P
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VDS = 0 V, ID = 250 µA
40
VGS(th)
VDS = VGS, ID = 250 µA
1
IGSS
VDS = 0 V, VGS = ± 20 V
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
IDSS
ID(on)
RDS(on)
gfs
2.5
± 250
VDS = 40 V, VGS = 0 V
1
VDS = 40 V, VGS = 0 V, TJ = 125 °C
50
VDS = 40 V, VGS = 0 V, TJ = 150 °C
250
VDS ≥ 10 V, VGS = 10 V
50
V
nA
µA
A
VGS = 10 V, ID = 22 A
0.0027
0.0033
VGS = 4.5 V, ID = 20 A
0.0034
0.0041
VDS = 15 V, ID = 20 A
169
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
c
Rg
Gate Resistance
Turn-On Delay Timec
Rise Timec
87
VDS = 20 V, VGS = 10 V, ID = 20 A
Fall Timec
td(off)
131
nC
15.3
12.2
f = 1 MHz
td(on)
tr
c
pF
705
283
Qgd
Gate-Drain Charge
Turn-Off Delay Time
5286
VGS = 0 V, VDS = 20 V, f = 1 MHz
VDD = 20 V, RL = 2 Ω
ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω
tf
Drain-Source Body Diode Ratings and Characteristics TC = 25 °C
0.5
2.7
5.4
11
20
7
14
45
68
7
14
90
Pulsed Current
ISM
160
Forward Voltagea
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 10 A, VGS = 0 V
0.72
IF = 10 A, dI/dt = 100 A/µs
52
trr
IRM(REC)
Qrr
ns
b
IS
Continuous Current
Ω
A
1.2
V
42
63
ns
2.5
3.8
A
78
nC
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 65902
S10-0632-Rev. A, 22-Mar-10
SUP90N04-3m3P
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
160
0.0040
RDS(on) - On-Resistance (Ω)
VGS = 10 V thru 3 V
ID - Drain Current (A)
120
2V
80
40
0
0.0030
VGS = 10 V
0.0025
0.0020
0
0.5
1.0
1.5
2.0
0
20
40
60
80
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
Output Characteristics
On-Resistance vs. Drain Current
10
0.10
8
0.08
RDS(on) - On-Resistance (Ω)
ID - Drain Current (A)
VGS = 4.5 V
0.0035
TC = 25 °C
6
4
2
100
0.06
TJ = 150 °C
0.04
TJ = 25 °C
0.02
TC = 125 °C
TC = - 55 °C
0
0.00
0
0.6
1.2
1.8
2.4
3.0
0
2
4
6
8
VGS - Gate-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
On-Resistance vs. Gate-to-Source Voltage
10
10
450
ID = 24 A
gfs - Transconductance (S)
VGS - Gate-to-Source Voltage (V)
TC = 25 °C
360
TC = - 55 °C
270
TC = 125 °C
180
90
8
VDS = 8 V
6
VDS = 15 V
4
VDS = 24 V
2
0
0
0
16
32
48
64
80
0
15
30
45
60
ID - Drain Current (A)
Qg - Total Gate Charge
Transconductance
Gate Charge
Document Number: 65902
S10-0632-Rev. A, 22-Mar-10
75
90
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SUP90N04-3m3P
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
2.2
1.7
10
VGS(th) (V)
IS - Source Current (A)
100
TJ = 150 °C
TJ = 25 °C
ID = 250 μA
1.2
1
0.7
0.1
0.0
0.3
0.6
0.9
0.2
- 50
1.2
- 25
0
25
50
75
100
125
VSD - Source-to-Drain Voltage (V)
TJ - Junction Temperature (°C)
Source-Drain Diode Forward Voltage
Threshold Voltage
150
175
125
150
50
8000
VDS - Drain-to-Source Voltage (V)
ID = 250 μA
C - Capacitance (pF)
6000
Ciss
4000
2000
Coss
Crss
10
20
30
46
44
42
40
- 50
0
0
48
40
- 25
0
25
50
75
100
TJ - Junction Temperature (°C)
VDS - Drain-to-Source Voltage (V)
Capacitance
Drain Source Breakdown vs. Junction Temperature
160
2.0
ID = 22 A
VGS = 10 V
1.7
ID - Drain Current (A)
RDS(on) - On-Resistance
(Normalized)
120
1.4
VGS = 4.5 V
1.1
Package Limited
80
40
0.8
0
0.5
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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175
0
25
50
75
100
125
150
TC - Case Temperature (°C)
Current Derating
Document Number: 65902
S10-0632-Rev. A, 22-Mar-10
SUP90N04-3m3P
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
1000
Limited by RDS(on)*
ID - Drain Current (A)
IDAV (A)
100
TJ = 25 °C
10
TJ = 150 °C
100 μs
10
1 ms
10 ms
100 ms, 1 s
10 s, DC
1
0.1
TA = 25 °C
Single Pulse
1
0.00001
0.0001
0.001
0.01
0.01
0.1
0.1
Time (s)
BVDSS Limited
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Single Pulse Avalanche Current Capability vs. Time
Safe Operating Area
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
0.1
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?65902.
Document Number: 65902
S10-0632-Rev. A, 22-Mar-10
www.vishay.com
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
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document or by any conduct of Vishay.
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Document Number: 91000
Revision: 18-Jul-08
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