FAIRCHILD FCA47N60F

SuperFET
TM
FCA47N60F
600V N-Channel MOSFET, FRFET
Features
Description
• 650V @TJ = 150°C
SuperFETTM is, Fairchild’s proprietary, new generation of high
voltage MOSFET family that is utilizing an advanced charge
balance mechanism for outstanding low on-resistance and
lower gate charge performance.
• Typ. RDS(on) = 0.062Ω
• Fast Recovery Type ( trr = 240ns)
This advanced technology has been tailored to minimize
conduction loss, provide superior switching performance, and
withstand extreme dv/dt rate and higher avalanche energy.
Consequently, SuperFET is very suitable for various AC/DC
power conversion in switching mode operation for system
miniaturization and higher efficiency.
• Ultra Low Gate Charge (typ. Qg = 210nC)
• Low Effective Output Capacitance (typ. Cosseff. = 420pF)
• 100% avalanche tested
D
G
TO-3PN
G DS
FCA Series
S
Absolute Maximum Ratings
Symbol
Parameter
FCA47N60F
VDSS
Drain-Source Voltage
ID
Drain Current
- Continuous (TC = 25°C)
- Continuous (TC = 100°C)
IDM
Drain Current
- Pulsed
VGSS
Gate-Source voltage
(Note 1)
Unit
600
V
47
29.7
A
A
141
A
± 30
V
EAS
Single Pulsed Avalanche Energy
(Note 2)
1800
mJ
IAR
Avalanche Current
(Note 1)
47
A
EAR
Repetitive Avalanche Energy
(Note 1)
41.7
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
50
V/ns
PD
Power Dissipation
417
3.33
W
W/°C
-55 to +150
°C
300
°C
(TC = 25°C)
- Derate above 25°C
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
Thermal Characteristics
Symbol
Parameter
RθJC
Thermal Resistance, Junction-to-Case
RθCS
Thermal Resistance, Case-to-Sink
RθJA
Thermal Resistance, Junction-to-Ambient
©2009 Fairchild Semiconductor Corporation
FCA47N60F Rev. A
1
Typ.
Max.
Unit
--
0.3
°C/W
0.24
--
°C/W
--
41.7
°C/W
www.fairchildsemi.com
FCA47N60F 600V N-Channel MOSFET, FRFET
January 2009
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
FCA47N60F
FCA47N60F
TO-3PN
-
-
30
Electrical Characteristics
Symbol
TC = 25°C unless otherwise noted
Parameter
Conditions
Min
Typ
Max Units
VGS = 0V, ID = 250μA, TJ = 25°C
600
--
--
V
VGS = 0V, ID = 250μA, TJ = 150°C
--
650
--
V
ID = 250μA, Referenced to 25°C
--
0.6
--
V/°C
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
ΔBVDSS
/ ΔTJ
Breakdown Voltage Temperature
Coefficient
BVDS
Drain-Source Avalanche Breakdown
Voltage
VGS = 0V, ID = 47A
--
700
--
V
IDSS
Zero Gate Voltage Drain Current
VDS = 600V, VGS = 0V
VDS = 480V, TC = 125°C
---
---
10
100
μA
μA
IGSSF
Gate-Body Leakage Current, Forward
VGS = 30V, VDS = 0V
--
--
100
nA
IGSSR
Gate-Body Leakage Current, Reverse
VGS = -30V, VDS = 0V
--
--
-100
nA
On Characteristics
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250μA
3.0
--
5.0
V
RDS(on)
Static Drain-Source
On-Resistance
VGS = 10V, ID = 23.5A
--
0.062
0.073
Ω
gFS
Forward Transconductance
VDS = 40V, ID = 23.5A
--
40
--
S
--
5900
8000
pF
(Note 4)
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Coss
Output Capacitance
Coss eff.
Effective Output Capacitance
VDS = 25V, VGS = 0V,
f = 1.0MHz
--
3200
4200
pF
--
250
--
pF
VDS = 480V, VGS = 0V, f = 1.0MHz
--
160
--
pF
VDS = 0V to 400V, VGS = 0V
--
420
--
pF
VDD = 300V, ID = 47A
RG = 25Ω
--
185
430
ns
--
210
450
ns
--
520
1100
ns
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
(Note 4, 5)
VDS = 480V, ID = 47A
VGS = 10V
(Note 4, 5)
--
75
160
ns
--
210
270
nC
--
38
--
nC
--
110
--
nC
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
--
--
47
A
ISM
Maximum Pulsed Drain-Source Diode Forward Current
--
--
141
A
VSD
Drain-Source Diode Forward Voltage
VGS = 0V, IS = 47A
--
--
1.4
V
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VGS = 0V, IS = 47A
dIF/dt =100A/μs
(Note 4)
--
240
--
ns
--
2.04
--
μC
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. IAS = 18A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 47A, di/dt ≤ 1,200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
2
FCA47N60F Rev. A
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FCA47N60F 600V N-Channel MOSFET, FRFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
VGS
Top :
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
Bottom : 5.5 V
ID, Drain Current [A]
10
2
10
ID , Drain Current [A]
2
1
10
150°C
1
-55°C
* Notes :
1. 250μs Pulse Test
o
2. TC = 25 C
0
10
-1
0
10
- Note
1. VDS = 40V
0
2. 250μs Pulse Test
10
2
1
10
25°C
10
10
4
VDS, Drain-Source Voltage [V]
8
10
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
0.25
IDR , Reverse Drain Current [A]
RDS(ON) [Ω],Drain-Source On-Resistance
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
0.20
0.15
VGS = 10V
0.10
VGS = 20V
0.05
2
10
1
10
150°C
25°C
* Notes :
1. VGS = 0V
2. 250μs Pulse Test
* Note : TJ = 25°C
0
0.00
0
20
40
60
80
100
120
140
160
180
10
200
0.2
0.4
0.6
Figure 5. Capacitance Characteristics
25000
1.4
1.6
VDS = 100V
VGS, Gate-Source Voltage [V]
15000
* Notes :
1. VGS = 0 V
2. f = 1 MHz
Ciss
5000
Crss
10
VDS = 250V
VDS = 400V
8
6
4
2
* Note : ID = 47A
0
0
10
0
1
10
50
100
150
200
250
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]
3
FCA47N60F Rev. A
1.2
12
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Coss
0
-1
10
1.0
Figure 6. Gate Charge Characteristics
20000
10000
0.8
VSD , Source-Drain Voltage [V]
ID, Drain Current [A]
Capacitance [pF]
6
VGS , Gate-Source Voltage [V]
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FCA47N60F 600V N-Channel MOSFET, FRFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
RDS(ON), (Normalized)
Drain-Source On-Resistance
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
1.1
1.0
* Notes :
1. VGS = 0 V
0.9
2. ID = 250μA
0.8
-100
-50
0
50
100
2.5
2.0
1.5
1.0
* Notes :
1. VGS = 10 V
2. ID = 23.5 A
0.5
150
0.0
-100
200
-50
0
TJ, Junction Temperature [°C]
50
100
150
200
TJ, Junction Temperature [°C]
Figure 9. Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
50
Operation in This Area
is Limited by R DS(on)
2
40
100 μs
ID, Drain Current [A]
ID, Drain Current [A]
10
1 ms
10 ms
1
10
DC
* Notes :
1. TC = 25°C
2. TJ = 150°C
3. Single Pulse
0
10
0
10
20
10
-1
10
30
1
2
10
0
25
3
10
10
50
75
100
125
150
TC, Case Temperature [°C]
VDS, Drain-Source Voltage [V]
ZθJC(t), Thermal Response
Figure 10. Transient Thermal Response Curve
D = 0 .5
10
-1
* N o te s :
1 . Z θ J C ( t) = 0 .3 ° C /W M a x .
2 . D u ty F a c to r , D = t 1 /t 2
3 . T J M - T C = P D M * Z θ J C ( t)
0 .2
0 .1
PDM
0 .0 5
t1
0 .0 2
10
-2
t2
0 .0 1
10
-5
s in g le p u ls e
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t 1 , S q u a r e W a v e P u ls e D u r a tio n [s e c ]
4
FCA47N60F Rev. A
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FCA47N60F 600V N-Channel MOSFET, FRFET
Typical Performance Characteristics (Continued)
FCA47N60F 600V N-Channel MOSFET, FRFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
5
FCA47N60F Rev. A
www.fairchildsemi.com
FCA47N60F 600V N-Channel MOSFET, FRFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
6
FCA47N60F Rev. A
www.fairchildsemi.com
FCA47N60F 600V N-Channel MOSFET, FRFET
Mechanical Dimensions
TO-3PN
Dimensions in Millimeters
7
FCA47N60F Rev. A
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Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
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First Production
Datasheet contains preliminary data; supplementary data will be published at a later
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Semiconductor. The datasheet is for reference information only.
Rev. I37
8
FCA47N60F Rev. A
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FCA47N60F 600V N-Channel MOSFET, FRFET
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