ETC MAX14972

19-5952; Rev 1; 3/12
备有评估板
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
概述
MAX14972双通道超高速USB 3.0均衡器/转接驱动器采用
可编程输入均衡和输出去加重，有效降低确定性抖动以及
信号重建电路板造成的损耗或电缆损耗，有助于对超高速
USB 3.0关键元件的布局进行优化，并可使用较长的电路
板走线或电缆。器件具有高级电源管理功能，带有接收器
侦测功能，完全支持USB 3.0低频周期信号(LFPS)。
器件采用小型24引脚(4.0mm x 4.0mm) TQFN封装，按照
数据流通走线，实现最优布局，将空间要求降至最小。器
件工作在0°C至+70°C商业级工作温度范围。
应用
USB端口
USB集线器
笔记本电脑
台式计算机
坞站
工业USB开关
优势和特性
S创新设计，无需昂贵的外部元件
+3.3V单电源供电
S高级电源管理实现最高效率
1mW (典型值)待机状态功耗
23mW (典型值)接收器侦测状态功耗
82.5mW (典型值)动态关断状态功耗
304mW (典型值)工作状态功耗
S
高度集成
超低延迟，传输延时为250ps (典型值)
2.5GHz下具有10dB (典型值)输入/输出回波损耗
3级可编程输入均衡
6级可编程输出去加重
完全支持LFPS，带频率整形功能
提供超高速USB 3.0兼容接收器侦测
低压(1.8V)兼容控制
优异的抖动和损耗补偿能力
4mil微带线，大于40in
S理想用于空间敏感应用
片上50Ω输入/输出端接
24引脚、4.0mm x 4.0mm TQFN封装
所有引脚具有±8kV HBM ESD保护
与TI SN65LVPE502和TI SN65LVPE502CP引脚兼容
定购信息在数据资料的最后给出。
典型工作电路
VCC
REMOTE BOARD
MAIN BOARD
0.1µF
100nF (X7R)
TX+
RX1+
100nF (X7R)
TXUSB 3.0
HOST
RX1-
100nF (X7R)
SINGLE DIFFERENTIAL PAIR
RX+
RX-
TX1100nF (X7R)
TX2+
RX2+
TX2-
RX2-
TX+
SINGLE DIFFERENTIAL PAIR
100nF (X7R)
RX-
MIDPLANE
MAX14972
100nF (X7R)
RX+
100nF (X7R)
TX1+
GND
USB 3.0
DEVICE
100nF (X7R)
TX-
CONNECTORS
本文是英文数据资料的译文，文中可能存在翻译上的不准确或错误。如需进一步确认，请在您的设计中参考英文资料。
有关价格、供货及订购信息，请联络Maxim亚洲销售中心：10800 852 1249 (北中国区)，10800 152 1249 (南中国区)，
或访问Maxim的中文网站：china.maximintegrated.com。
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
Absolute Maximum Ratings
(Voltages referenced to GND.)
VCC ...................................................................... -0.3V to +4.0V
All Other Pins (Note 1) ............................ -0.3V to (VCC + 0.3V)
Continuous Current RX_+, RX_-, TX_+, TX_-.................. Q30mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 27.8mW/NC above +70NC) ............. 2222.2mW
Operating Temperature Range ............................ 0NC to +70NC
Junction Temperature Range ......................... -40NC to +150NC
Storage Temperature Range .......................... -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1: All I/O pins are clamped by internal diodes.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance (qJA).......... 36NC/W
Junction-to-Case Thermal Resistance (qJC)..................3NC/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to china.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VCC = +3.0V to +3.6V, CC = 100nF coupling capacitor on each output, RL = 50I and CL = 1pF on each output, TA = 0NC to +70NC,
unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25NC.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
3.0
3.3
3.6
V
ENRXD = 1, data rate = 5.0Gbps, D10.2
pattern, DE­­_ = VCC, OS_ = GND
92
125
ENRXD = 1, CM = 0, no output
termination
7
10
Dynamic power-down mode,
ENRXD = 1, CM = 0, with output
termination, no input signal
25
32
DC PERFORMANCE
Power-Supply Range
Operating Supply Current
VCC
ICC
500
FA
Differential Input Impedance
ZRX-DC-DIFF
DC
72
120
I
Differential Output Impedance
ZTX-DC-DIFF
DC
72
120
I
Single-Ended High Input
Impedance
ZRX-SE-HIGH
No output termination, CM = 0 (Note 3)
25
Standby Supply Current
ISTBY
ENRXD = 0
mA
50
kI
Common-Mode Input Impedance
ZRX-DC-CM
(Note 3)
18
30
I
Common-Mode Output
Impedance
ZTX-DC-CM
(Note 4)
18
30
I
Common-Mode Input Voltage
VRX-DC-CM
(Note 3)
0
V
Common-Mode Output Voltage
VTX-DC-CM
(Note 3)
2.75
V
Active LFPS Common-Mode Delta
DVLFPS-CM
Active LFPS squelched and not
squelched
Maxim Integrated
50
mV
2
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +3.0V to +3.6V, CC = 100nF coupling capacitor on each output, RL = 50I and CL = 1pF on each output, TA = 0NC to +70NC,
unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25NC.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
AC PERFORMANCE (Note 5)
Redriver-Operation Differential
Input Signal Range
LFPS Detect Threshold
VRX-DIFF-PP
USB 3.0 data
150
1200
mVP-P
VLFPS-DIFF-PP
USB 3.0 data
100
300
mV
50MHz P f < 1250MHz
16
18
1250MHz P f < 2500MHz
8
12
50MHz P f < 1250MHz
13
16
1250MHz P f < 2500MHz
8
10
dB
Differential Input Return Loss
RLRX-DIFF
Differential Output Return Loss
RLTX-DIFF
Common-Mode Input Return Loss
RLRX-CM
50MHz P f < 2500MHz
11
13
dB
Common-Mode Output Return
Loss
RLTX-CM
50MHz P f < 2500MHz
11
13
dB
OS_ = 0, DE_ = 0
Differential Output Amplitude
(Transition Bit), Figure 1
Differential Output Amplitude
(Nontransition Bit), Figure 1
LFPS Idle Differential Output
Voltage
VTX-DIFF-TB-PP
1120
OS_ = 0, DE_ = N.C.
940
OS_ = 0, DE_ = 1
1210
OS_ = 1 or N.C., DE_ = 0
1180
OS_ = 1 or N.C., DE_ = N.C.
1010
OS_ = 1 or N.C., DE_ = 1
1270
DE_ = N.C.
640
VTX-DIFF-NTB-PP DE_ = 0
840
DE_ = 1
940
VLFPS-IDLEDIFF -PP
dB
mVP-P
mVP-P
Highpass filter to remove DC offset
30
mV
Voltage Change to Allow Receiver
Detect
VDETECT
Positive voltage to sense receiver
termination
500
mV
Deterministic Jitter
tTX-DJ-DD
K28.5 pattern, data rate = 5.0Gbps,
EQ_ = not connected
12
psP-P
Random Jitter
tTX-RJ-DD
K28.5 pattern, data rate = 5.0Gbps,
EQ_ = not connected
1
psRMS
Rise/Fall Time
tTX-RISE-FALL
Differential Propagation Delay
LFPS Idle Entry Delay
LFPS Idle Exit Delay
Maxim Integrated
tPD
tIDLE-ENTRY
tIDLE-EXIT
(Note 6)
Propagation delay input to output at 50%
40
ps
250
ps
USB 3.0 LFPS pattern, active state
4
6
USB 3.0 LFPS pattern, active state
4
6
15.6
22.5
USB 3.0 LFPS pattern, dynamic powerdown state
ns
ns
3
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +3.0V to +3.6V, CC = 100nF coupling capacitor on each output, RL = 50I and CL = 1pF on each output, TA = 0NC to +70NC,
unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25NC.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
CONTROL LOGIC
Input Logic-High
Input Logic-Low
Input Logic Hysteresis
VIH
ENRXD, CM, EQ_, OS_, and DE_
VIL
ENRXD, CM, EQ_, OS_, and DE_
VHYST
ENRXD, CM, EQ_, OS_, and DE_
1.5
V
0.5
V
0.075
V
±8
kV
ESD PROTECTION
HBM ESD Protection
Note
Note
Note
Note
Human Body Model
3: Measured with respect to ground.
4: Measured with respect to VCC.
5: Guaranteed by design, unless otherwise noted.
6: Rise and fall times are measured using 20% and 80% levels.
VTX-DIFF-NTB-PP VTX-DIFF-TB-PP
DE(dB) = 20 log
VTX-DIFF-NTB-PP
VTX-DIFF-TB-PP
图1. 输出去加重示意图
Maxim Integrated
4
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
典型工作特性
(VCC = 3.3V, TA = +25NC, EQ_ = N.C., using 5Gbps QK28.5 pattern, unless otherwise noted.)
DE_ = N.C, OS_ = N.C or 1,
VRX-DIFF-PP = 150mVP-P
200
0
-200
-400
-600
MAX14972 toc02
400
600
EYE DIAGRAM VOLTAGE (mV)
MAX14972 toc01
600
EYE DIAGRAM VOLTAGE (mV)
DE_ = N.C, OS_ = 0,
VRX-DIFF-PP = 150mVP-P
400
200
0
-200
-400
-600
-200ps
-100ps
-150ps
0ps
-50ps
200ps
100ps
50ps
-200ps
150ps
200
0
-200
-400
-600
200ps
150ps
MAX14972 toc04
400
200
0
-200
-400
-600
-200ps
-100ps
-150ps
Maxim Integrated
100ps
50ps
600
EYE DIAGRAM VOLTAGE (mV)
MAX14972 toc03
EYE DIAGRAM VOLTAGE (mV)
400
0ps
-50ps
DE_ = N.C, OS_ = 0,
VRX-DIFF-PP = 1200mVP-P
DE_ = N.C, OS_ = N.C or 1,
VRX-DIFF-PP = 1200mVP-P
600
-100ps
-150ps
-50ps
0ps
200ps
100ps
50ps
150ps
-200ps
-100ps
-150ps
-50ps
0ps
100ps
50ps
200ps
150ps
5
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
典型工作特性(续)
(VCC = 3.3V, TA = +25NC, EQ_ = N.C., using 5Gbps QK28.5 pattern, unless otherwise noted.)
DE_ = N.C, OS_ = 1,
VRX-DIFF-PP = 150mVP-P
USB 3.0 DEVICE COMPLIANCE FILTER
DE_ = N.C, OS_ = 1,
VRX-DIFF-PP = 150mVP-P
USB 3.0 HOST COMPLIANCE FILTER
600mV
400mV
800mV
600mV
400mV
200mV
200mV
0mV
0mV
-200mV
-200mV
-400mV
-400mV
-600mV
-600mV
-800mV
-200ps
-100ps
-150ps
0ps
-50ps
-800mV
-200ps
100ps
50ps
MAX14972 toc06
MAX14972 toc05
800mV
150ps
DIFFERENTIAL INPUT RETURN LOSS
vs. FREQUENCY
MASK
-15
-20
-25
-30
-35
-40
-5
-10
MASK
-15
-20
-25
-30
-35
-40
0
0.5
1.0
1.5
FREQUENCY (GHz)
Maxim Integrated
150ps
MAX14972 toc08
-10
100ps
50ps
0
DIFFERENTIAL OUTPUT RETURN LOSS (dB)
-5
0ps
-50ps
DIFFERENTIAL OUTPUT RETURN LOSS
vs. FREQUENCY
MAX14972 toc07
DIFFERENTIAL INPUT RETURN LOSS (dB)
0
-100ps
-150ps
2.0
2.5
0
0.5
1.0
1.5
2.0
2.5
FREQUENCY (GHz)
6
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
EQ2
DE2
OS2
CM
VCC
TOP VIEW
GND
引脚配置
18
17
16
15
14
13
RX2+ 19
12
TX2+
RX2- 20
11
TX2-
GND 21
10
GND
9
RX1+
8
RX1-
7
N.C.
MAX14972
TX1+ 22
TX1- 23
*EP
+
1
2
3
4
5
6
VCC
EQ1
DE1
OS1
ENRXD
GND
N.C. 24
TQFN
*CONNECT EXPOSED PAD (EP) TO GND.
引脚说明
引脚
名称
1, 13
VCC
电源输入，利用0.1μF和2.2μF低ESR、并联电容将VCC旁路至GND，电容尽量靠近器件。
功能
2
EQ1
三态输入均衡控制，通道1。EQ1保持浮空时为默认状态。
3
DE1
三态跳变位和非跳变位输出幅值控制，通道1。将DE1连接至VCC为默认状态。
4
OS1
二态跳变位输出幅值控制，通道1。将OS1连接至GND为默认状态。
5
ENRXD
6, 10, 18, 21
GND
地。
7, 24
N.C.
无连接。无内部连接。
8
RX1-
反相输入，通道1。采用低ESR 100nF电容交流耦合RX1-。
高电平有效使能。正常工作时将ENRXD驱动为高电平或保持浮空。将ENRXD驱动为低电平时进入待机
状态。ENRXD具有400kΩ (典型值)电阻上拉至VCC。
9
RX1+
同相输入，通道1。采用低ESR 100nF电容交流耦合RX1+。
11
TX2-
反相输出，通道2。采用低ESR 100nF电容交流耦合TX2-。
12
TX2+
同相输出，通道2。采用低ESR 100nF电容交流耦合TX2+。
14
CM
Maxim Integrated
高电平有效兼容模式控制。将CM驱动为高电平时强制为主动状态。将CM驱动为低电平或保持浮空时为
正常工作。CM具有400kΩ (典型值)电阻下拉至GND。
7
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
引脚说明(续)
引脚
名称
功能
15
OS2
二态跳变位输出幅值控制，通道2。将OS2连接至GND为默认状态。
16
DE2
三态跳变位和非跳变位输出幅值控制，通道2。将DE2连接至VCC为默认状态。
17
EQ2
三态输入均衡控制，通道2。EQ2保持浮空时为默认状态。
19
RX2+
同相输入，通道2。采用低ESR 100nF电容交流耦合RX2+。
20
RX2-
反相输入，通道2。采用低ESR 100nF电容交流耦合RX2-。
22
TX1+
同相输出，通道1。采用低ESR 100nF电容交流耦合TX1+。
23
TX1-
反相输出，通道1。采用低ESR 100nF电容交流耦合TX1-。
—
EP
裸焊盘。内部连接至GND。连接至大接地区域以增强散热。不作为电气连接点。
功能框图
VCC
RX1+
MAX14972
TX1+
RX1-
TX1-
TX2-
RX2-
TX2+
RX2+
CONTROL LOGIC
GND
OS1 OS2 EQ1 EQ2 DE1 DE2 ENRXD CM
Maxim Integrated
8
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
详细说明
MAX14972具有两个完全相同的驱动器，支持完整的超高
速USB 3.0链路。利用每个通道的可编程均衡和去加重电
路获得最优的超高速收发器电路板布局，提供灵活的前端、
后端和侧面超高速端口布局。器件具有高级电源管理功能，
带有接收检测，支持USB 3.0低频周期信号(LFPS)。
可编程输入均衡
通道1的输入均衡由EQ1控制，通道2的输入均衡由EQ2控
制。EQ1和EQ2两个引脚各有三级均衡设置，可灵活补偿
各种电路板输入走线、连接器或电缆损耗(表1)。EQ_三态
输入将低于VIH和高于VIL的电压作为高阻。例如，如果要
求高阻状态，则可将EQ_置为1V或保持浮空。
可编程输出去加重
通道1输出跳变位幅值由OS1和DE1引脚控制，非跳变位幅
值由DE1引脚控制。通道2输出跳变位幅值由OS2和DE2引
脚控制，非跳变位幅值由DE2引脚控制。两路通道各有6种
可能的输出去加重状态，可灵活补偿各种输出电路板走线、
表1. 典型输入均衡
连接器或电缆损耗(表2、表3和表4)。DE_三态输入将低于
VIH和高于VIL的电压作为高阻。例如，如果需要高阻状态，
可将DE_设置为1V或保持浮空。
LFPS支持
器件通过检测输入端的空闲状态并禁止相应输出，防止由
于转接驱动产生的不利噪声，完全支持USB 3.0 LFPS。差
分输入LFPS信号下降至100mVP-P门限以下时，器件禁止
输出。输入出现高于300mVP-P (典型值)的差分LFPS信号
时，器件打开相应输出并转接驱动信号。有效工作模式下，
器件进入LFPS空闲状态的时间为4ns (典型值)，退出时间
为4ns (典型值)。
高级电源管理
待机状态
将ENRXD驱动为低电平时，器件置于低功耗待机模式。
待 机 模 式 下， 输 入 处 于 共 模 高 阻 状 态， 器 件 功 耗 低 于
1mW (典型值)。进入待机状态的时间为2μs (典型值)，退
出时间为50μs (典型值)。
表3. 典型输出非跳变位幅值
EQ_
EQUALIZATION (dB)
DE_
AMPLITUDE (mVP-P)
N.C.*
0
N.C*
640
0
6
0
840
1
10
1
940
*不连接。
*不连接。
表2. 典型输出跳变位幅值(参见Electrical
Characteristics表)
表4. 典型输出去加重
OS_
AMPLITUDE (mVP-P)
N.C.*, 1
1010 to 1270
0
940 to 1210
*不连接。
Maxim Integrated
CONTROL LOGIC
OS_ = 0
OS_ = 1, N.C.*
DE_ = 0
-2.5dB
-3.0dB
DE_ = N.C.
-3.3dB
-3.9dB
DE_ = 1
-2.2dB
-2.7dB
*不连接。
9
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
接收检测
器件的每个通道都具有独立的接收检测功能。初始上电时，
如果ENRXD为高电平，启动接收检测功能。如果器件处于
已上电状态，接收检测功能在ENRXD的上升沿启动。接收
检测期间，器件保持23mW (典型值)低功耗模式，输出和
输入处于共模高阻态。每12ms (典型值)重复进行一次接收
检测，直到检测到有效接收信号。必须在两个通道均检测
到接收信号时，才退出接收检测状态。
动态关断
已检测到接收器且输入上无信号出现时，器件进入动态关
断状态。在输入端检测到信号时，器件退出该状态。器件
在动态关断状态下的功耗小于82.5mW (典型值)。30μs空
闲检测之后，器件进入动态关断。如果在超过12ms (典型
值)的时间内未检测到信号，器件进入接收检测状态。
有效工作状态
检测到接收信号并且信号出现在输入端时，器件自动进入
有效工作模式。如表5所示，通过设置CM = 1，可强制器
件进入工作状态。器件在该状态下的功耗小于304mW (典
型值)。
USB 3.0兼容模式
MAX14972具有USB 3.0兼容模式，强制器件保持有效工
作状态。器件转接驱动信号，测试发送器的电压和定时参
数，使其符合USB 3.0规范要求。将ENRXD驱动为高电平
或保持浮空，并将CM驱动为高电平，则激活USB 3.0兼容
模式。将ENRXD驱动为高电平或保持浮空，并将CM驱动
为低电平或保持浮空，则为标准工作模式(表5)。兼容模式
下(CM = 1)，禁用接收检测和动态关断，器件保持在有效
工作状态，支持LFPS。
应用信息
布局
电路板布局和设计对器件性能的影响非常明显。采用良好
的高频设计技术，包括最小化接地电感、采用阻抗受控的
数据信号传输线。电源去耦电容须尽量靠近VCC安装。总
是将VCC连接至电源区域。
裸焊盘封装
带裸焊盘的24引脚TQFN封装为IC散热提供了极低的热阻
通路。器件上的裸焊盘必须焊接至PCB接地区域，以完全
实现电气和热性能。关于裸焊盘封装的更多信息，请参
考应用笔记862：HFAN-08.1: Thermal Considerations of
QFN and Other Exposed-Paddle Packages 。
电源排序
注意：如果超过所列额定值，可能会造成器件永久损坏，
所以请勿超过绝对最大额定值。
建议对所有器件进行正确的电源排序。总是先施加GND，
接着为VCC，然后再施加信号，尤其是信号无限流时。
定购信息
表5. 数字控制真值表
ENRXD
CM
说明
0
0
关断。
0
1
关断。
1或N.C.*
0或N.C.*
1或N.C.*
1
正常工作。
兼容模式(主动)。
型号
温度范围
引脚-封装
MAX14972CTG+
0NC至+70NC
24 TQFN-EP*
+表示无铅(Pb)/符合RoHS标准的封装。
*EP = 裸焊盘。
*不连接。
Maxim Integrated
10
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
芯片信息
PROCESS: BiCMOS
Maxim Integrated
封装信息
如需最近的封装外形信息和焊盘布局(占位面积)，请查询china.
maximintegrated.com/packages。请注意，封装编码中的“+”、
“#”或“-”仅表示RoHS状态。封装图中可能包含不同的尾缀字符，
但封装图只与封装有关，与RoHS状态无关。
封装类型
封装编码
外型编号
焊盘布局编号
24 TQFN-EP
T2444+3
21-0139
90-0021
11
MAX14972
双通道超高速USB 3.0均衡器/转接驱动器
修订历史
修订号
修订日期
0
10/11
最初版本。
说明
修改页
—
1
3/12
更新Electrical Characteristics表。
14
Maxim北京办事处
北京8328信箱 邮政编码100083
免费电话：800 810 0310
电话：010-6211 5199
传真：010-6211 5299
Maxim不对Maxim产品以外的任何电路使用负责，也不提供其专利许可。Maxim保留在任何时间、没有任何通报的前提下修改产品资料和规格的权利。电气
特性表中列出的参数值(最小值和最大值)均经过设计验证，数据资料其它章节引用的参数值供设计人员参考。
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-10 00
© 2012 Maxim Integrated
12
Maxim标志和Maxim Integrated是Maxim Integrated Products, Inc.的商标。
19-5952; Rev 1; 3/12
EVALUATION KIT AVAILABLE
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
General Description
The MAX14972 dual SuperSpeed USB 3.0 equalizer/
redriver utilizes programmable input equalization and
output deemphasis to reduce deterministic jitter and
restore signal loss caused by circuit-board or signalcable losses, and allows optimal placement of key
SuperSpeed USB 3.0 components and longer circuitboard traces or cables. The device features advanced
power management with receiver detection and explicit
support for USB 3.0 low-frequency periodic signals
(LFPS).
The device is available in a small, 24-pin (4.0mm x
4.0mm) TQFN package with flow-through traces for optimal layout and minimal space requirements. The device
is specified over the 0NC to +70NC commercial operating
temperature range.
Applications
USB Ports
USB Hubs
Notebook Computers
Benefits and Features
SInnovative Design Eliminates Need for Costly
External Components
Single +3.3V Supply Operation
SAdvanced Power Management for Maximum
Efficiency
1mW (typ) in Standby State
23mW (typ) in Receiver Detect State
82.5mW (typ) in Dynamic Power-Down State
304mW (typ) in Active State
SHigh Level of Integration for Performance
Very Low Latency with 250ps (typ) Propagation
Delay
10dB (typ) Input/Output Return Loss Up to 2.5GHz
Three-Level Programmable Input Equalization
Six-Level Programmable Output Deemphasis
Explicit LFPS Support with Frequency Shaping
SuperSpeed USB 3.0-Compliant Receiver
Detection
Low-Voltage (1.8V) Compatible Controls
Excellent Jitter and Loss Compensation Capability
> 40in of 4mil Microstrip
SIdeal for Space-Sensitive Applications
On-Chip 50I Input/Output Terminations
24-Pin, 4.0mm x 4.0mm TQFN Packaging
±8kV HBM ESD Protection on All Pins
Pin-to-Pin Compatible with TI SN65LVPE502
and TI SN65LVPE502CP
Desktop Computers
Docking Stations
Industrial USB Switching
Ordering Information appears at end of data sheet.
Typical Operating Circuit
VCC
REMOTE BOARD
MAIN BOARD
0.1µF
100nF (X7R)
TX+
100nF (X7R)
RX1+
TX1+
RX1-
TX1-
100nF (X7R)
TXUSB 3.0
HOST
SINGLE DIFFERENTIAL PAIR
RX-
MAX14972
TX2+
100nF (X7R)
TX+
RX2+
SINGLE DIFFERENTIAL PAIR
100nF (X7R)
RX-
RX+
100nF (X7R)
100nF (X7R)
RX+
MIDPLANE
TX2-
GND
USB 3.0
DEVICE
100nF (X7R)
TX-
RX2-
CONNECTORS
����������������������������������������������������������������� Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
VCC ...................................................................... -0.3V to +4.0V
All Other Pins (Note 1) ............................ -0.3V to (VCC + 0.3V)
Continuous Current RX_+, RX_-, TX_+, TX_-.................. Q30mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 27.8mW/NC above +70NC) ............. 2222.2mW
Operating Temperature Range ............................ 0NC to +70NC
Junction Temperature Range ......................... -40NC to +150NC
Storage Temperature Range .......................... -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1: All I/O pins are clamped by internal diodes.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance (qJA).......... 36NC/W
Junction-to-Case Thermal Resistance (qJC)..................3NC/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +3.6V, CC = 100nF coupling capacitor on each output, RL = 50I and CL = 1pF on each output, TA = 0NC to +70NC,
unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25NC.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
3.0
V
DC PERFORMANCE
Power-Supply Range
Operating Supply Current
Standby Supply Current
VCC
ICC
ISTBY
3.3
3.6
ENRXD = 1, data rate = 5.0Gbps, D10.2
pattern, DE­­_ = VCC, OS_ = GND
92
125
ENRXD = 1, CM = 0, no output
termination
7
10
Dynamic power-down mode,
ENRXD = 1, CM = 0, with output
termination, no input signal
25
32
ENRXD = 0
mA
500
FA
Differential Input Impedance
ZRX-DC-DIFF
DC
72
120
I
Differential Output Impedance
ZTX-DC-DIFF
DC
72
120
I
Single-Ended High Input
Impedance
ZRX-SE-HIGH
No output termination, CM = 0 (Note 3)
25
50
kI
Common-Mode Input Impedance
ZRX-DC-CM
(Note 3)
18
30
I
Common-Mode Output
Impedance
ZTX-DC-CM
(Note 4)
18
30
I
Common-Mode Input Voltage
VRX-DC-CM
(Note 3)
0
V
Common-Mode Output Voltage
VTX-DC-CM
(Note 3)
2.75
V
Active LFPS Common-Mode Delta
DVLFPS-CM
Active LFPS squelched and not
squelched
50
mV
����������������������������������������������������������������� Maxim Integrated Products 2
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +3.0V to +3.6V, CC = 100nF coupling capacitor on each output, RL = 50I and CL = 1pF on each output, TA = 0NC to +70NC,
unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25NC.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
1200
mVP-P
300
mV
AC PERFORMANCE (Note 5)
Redriver-Operation Differential
Input Signal Range
LFPS Detect Threshold
VRX-DIFF-PP
USB 3.0 data
150
VLFPS-DIFF-PP
USB 3.0 data
100
50MHz P f < 1250MHz
16
18
1250MHz P f < 2500MHz
8
12
50MHz P f < 1250MHz
13
16
1250MHz P f < 2500MHz
8
10
Differential Input Return Loss
RLRX-DIFF
Differential Output Return Loss
RLTX-DIFF
Common-Mode Input Return Loss
RLRX-CM
50MHz P f < 2500MHz
11
13
dB
Common-Mode Output Return
Loss
RLTX-CM
50MHz P f < 2500MHz
11
13
dB
Differential Output Amplitude
(Transition Bit), Figure 1
Differential Output Amplitude
(Nontransition Bit), Figure 1
LFPS Idle Differential Output
Voltage
VTX-DIFF-TB-PP
OS_ = 0, DE_ = 0
1120
OS_ = 0, DE_ = N.C.
940
OS_ = 0, DE_ = 1
1210
OS_ = 1 or N.C., DE_ = 0
1180
OS_ = 1 or N.C., DE_ = N.C.
1010
OS_ = 1 or N.C., DE_ = 1
1270
DE_ = N.C.
640
VTX-DIFF-NTB-PP DE_ = 0
840
DE_ = 1
940
VLFPS-IDLEDIFF -PP
dB
dB
mVP-P
mVP-P
Highpass filter to remove DC offset
30
mV
Voltage Change to Allow Receiver
Detect
VDETECT
Positive voltage to sense receiver
termination
500
mV
Deterministic Jitter
tTX-DJ-DD
K28.5 pattern, data rate = 5.0Gbps,
EQ_ = not connected
12
psP-P
Random Jitter
tTX-RJ-DD
K28.5 pattern, data rate = 5.0Gbps,
EQ_ = not connected
1
psRMS
Rise/Fall Time
tTX-RISE-FALL
Differential Propagation Delay
LFPS Idle Entry Delay
LFPS Idle Exit Delay
tPD
tIDLE-ENTRY
tIDLE-EXIT
(Note 6)
Propagation delay input to output at 50%
40
ps
250
ps
USB 3.0 LFPS pattern, active state
4
6
USB 3.0 LFPS pattern, active state
4
6
15.6
22.5
USB 3.0 LFPS pattern, dynamic powerdown state
ns
ns
����������������������������������������������������������������� Maxim Integrated Products 3
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +3.0V to +3.6V, CC = 100nF coupling capacitor on each output, RL = 50I and CL = 1pF on each output, TA = 0NC to +70NC,
unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25NC.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
CONTROL LOGIC
Input Logic-High
VIH
ENRXD, CM, EQ_, OS_, and DE_
Input Logic-Low
VIL
ENRXD, CM, EQ_, OS_, and DE_
VHYST
ENRXD, CM, EQ_, OS_, and DE_
Input Logic Hysteresis
1.5
V
0.5
V
0.075
V
±8
kV
ESD PROTECTION
HBM ESD Protection
Note
Note
Note
Note
Human Body Model
3: Measured with respect to ground.
4: Measured with respect to VCC.
5: Guaranteed by design, unless otherwise noted.
6: Rise and fall times are measured using 20% and 80% levels.
VTX-DIFF-NTB-PP VTX-DIFF-TB-PP
DE(dB) = 20 log
VTX-DIFF-NTB-PP
VTX-DIFF-TB-PP
Figure 1. Illustration of Output Deemphasis
����������������������������������������������������������������� Maxim Integrated Products 4
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
Typical Operating Characteristics
(VCC = 3.3V, TA = +25NC, EQ_ = N.C., using 5Gbps QK28.5 pattern, unless otherwise noted.)
DE_ = N.C, OS_ = N.C or 1,
VRX-DIFF-PP = 150mVP-P
200
0
-200
-400
-600
MAX14972 toc02
400
600
EYE DIAGRAM VOLTAGE (mV)
MAX14972 toc01
600
EYE DIAGRAM VOLTAGE (mV)
DE_ = N.C, OS_ = 0,
VRX-DIFF-PP = 150mVP-P
400
200
0
-200
-400
-600
-200ps
-100ps
-150ps
0ps
-50ps
200ps
100ps
50ps
-200ps
150ps
100ps
50ps
200ps
150ps
200
0
-200
-400
-600
MAX14972 toc04
600
EYE DIAGRAM VOLTAGE (mV)
MAX14972 toc03
EYE DIAGRAM VOLTAGE (mV)
400
0ps
-50ps
DE_ = N.C, OS_ = 0,
VRX-DIFF-PP = 1200mVP-P
DE_ = N.C, OS_ = N.C or 1,
VRX-DIFF-PP = 1200mVP-P
600
-100ps
-150ps
400
200
0
-200
-400
-600
-200ps
-100ps
-150ps
-50ps
0ps
200ps
100ps
50ps
150ps
-200ps
-100ps
-150ps
-50ps
0ps
100ps
50ps
200ps
150ps
����������������������������������������������������������������� Maxim Integrated Products 5
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
Typical Operating Characteristics (continued)
(VCC = 3.3V, TA = +25NC, EQ_ = N.C., using 5Gbps QK28.5 pattern, unless otherwise noted.)
DE_ = N.C, OS_ = 1,
VRX-DIFF-PP = 150mVP-P
USB 3.0 DEVICE COMPLIANCE FILTER
DE_ = N.C, OS_ = 1,
VRX-DIFF-PP = 150mVP-P
USB 3.0 HOST COMPLIANCE FILTER
600mV
400mV
800mV
600mV
400mV
200mV
200mV
0mV
0mV
-200mV
-200mV
-400mV
-400mV
-600mV
-600mV
-800mV
-200ps
-100ps
-150ps
0ps
-50ps
-800mV
-200ps
100ps
50ps
MAX14972 toc06
MAX14972 toc05
800mV
150ps
DIFFERENTIAL INPUT RETURN LOSS
vs. FREQUENCY
MASK
-15
150ps
-20
-25
-30
-35
-40
MAX14972 toc08
-10
100ps
50ps
0
DIFFERENTIAL OUTPUT RETURN LOSS (dB)
-5
0ps
-50ps
DIFFERENTIAL OUTPUT RETURN LOSS
vs. FREQUENCY
MAX14972 toc07
DIFFERENTIAL INPUT RETURN LOSS (dB)
0
-100ps
-150ps
-5
-10
MASK
-15
-20
-25
-30
-35
-40
0
0.5
1.0
1.5
FREQUENCY (GHz)
2.0
2.5
0
0.5
1.0
1.5
2.0
2.5
FREQUENCY (GHz)
����������������������������������������������������������������� Maxim Integrated Products 6
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
EQ2
DE2
OS2
CM
VCC
TOP VIEW
GND
Pin Configuration
18
17
16
15
14
13
RX2+ 19
12
TX2+
RX2- 20
11
TX2-
GND 21
10
GND
9
RX1+
8
RX1-
7
N.C.
MAX14972
TX1+ 22
TX1- 23
*EP
+
1
2
3
4
5
6
VCC
EQ1
DE1
OS1
ENRXD
GND
N.C. 24
TQFN
*CONNECT EXPOSED PAD (EP) TO GND.
Pin Description
PIN
NAME
FUNCTION
1, 13
VCC
Power-Supply Input. Bypass VCC to GND with 0.1FF and 2.2FF low-ESR capacitors in parallel as
close as possible to the device.
2
EQ1
Three-State Input Equalization Control, Channel 1. Leave EQ1 unconnected for default state.
3
DE1
Three-State Transition Bit and Nontransition Bit Output Amplitude Control, Channel 1. Connect DE1 to
VCC for default state.
4
OS1
Two-State Transition-Bit Output Amplitude Control, Channel 1. Connect OS1 to GND for default state.
5
ENRXD
6, 10, 18, 21
GND
Ground
7, 24
N.C.
No Connection. Not internally connected.
8
RX1-
Inverting Input, Channel 1. AC-couple RX1- with a low-ESR 100nF capacitor.
9
RX1+
Noninverting Input, Channel 1. AC-couple RX1+ with a low-ESR 100nF capacitor.
11
TX2-
Inverting Output, Channel 2. AC-couple TX2- with a low-ESR 100nF capacitor.
12
TX2+
Noninverting Output, Channel 2. AC-couple TX2+ with a low-ESR 100nF capacitor.
14
CM
Active-High Enable. Drive ENRXD high or leave unconnected for normal operation. Drive ENRXD low
to enter standby state. ENRXD has a 400kI (typ) pullup resistor to VCC.
Active-High Compliance Mode Control. Drive CM high to force active state. Drive CM low or leave
unconnected for normal operation. CM has a 400kI (typ) pulldown resistor to GND.
����������������������������������������������������������������� Maxim Integrated Products 7
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
Pin Description (continued)
PIN
NAME
FUNCTION
15
OS2
Two-State Transition-Bit Output Amplitude Control, Channel 2. Connect OS2 to GND for default state.
16
DE2
Three-State Transition Bit and Nontransition Bit Output Amplitude Control, Channel 2. Connect DE2 to
VCC for default state.
17
EQ2
Three-State Input Equalization Control, Channel 2. Leave EQ2 unconnected for default state.
19
RX2+
Noninverting Input, Channel 2. AC-couple RX2+ with a low-ESR 100nF capacitor.
20
RX2-
Inverting Input, Channel 2. AC-couple RX2- with a low-ESR 100nF capacitor.
22
TX1+
Noninverting Output, Channel 1. AC-couple TX1+ with a low-ESR 100nF capacitor.
23
TX1-
Inverting Output, Channel 1. AC-couple TX1- with a low-ESR 100nF capacitor.
—
EP
Exposed Pad. Internally connected to GND. Connect to a large ground plane to maximize thermal
performance. Not intended as an electrical connection point.
Functional Diagram
VCC
RX1+
MAX14972
TX1+
RX1-
TX1-
TX2-
RX2-
TX2+
RX2+
CONTROL LOGIC
GND
OS1 OS2 EQ1 EQ2 DE1 DE2 ENRXD CM
����������������������������������������������������������������� Maxim Integrated Products 8
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
Detailed Description
The MAX14972 features two identical drivers to support a
complete single SuperSpeed USB 3.0 link. Programmable
equalization and deemphasis on each channel allows
for optimal board placement of SuperSpeed transceivers and enables flexibility of front, rear, and side
SuperSpeed ports. The device features advanced power
management with receiver detection and support for
USB 3.0 low-frequency periodic signals (LFPS).
Programmable Input Equalization
Input equalization for channel 1 is controlled by EQ1,
while input equalization for channel 2 is controlled by
EQ2. Each of the two pins, EQ1 and EQ2, has three
equalization settings, which offer flexible compensation
for varied input circuit-board trace, connector, or cable
losses (Table 1). The EQ_ three-state inputs interpret
voltages below VIH and higher than VIL as high impedance. Set EQ_ to 1V, for example, or leave unconnected
if the impedance state is required.
Programmable Output Deemphasis
Channel 1 output transition bit amplitude is controlled
by the OS1 and DE1 pins, and the nontransition bit
amplitude is controlled only by the DE1 pin. Channel 2
output transition bit amplitude is controlled by the OS2
and DE2 pins, and the nontransition bit amplitude is
Table 1. Typical Input Equalization
EQ_
EQUALIZATION (dB)
N.C.*
0
0
6
1
10
*Not connected.
controlled only by the DE2 pin. There are six possible
output deemphasis states for each of the two channels,
which offer flexibility to compensate for varied losses in
the output circuit-board traces, connectors, or cables
runs (Table 2, Table 3, and Table 4.) The DE_ three-state
input interprets voltages below VIH and higher than VIL
as high impedance. Set DE_ to 1V, for example, or leave
unconnected if a high-impedance state is required.
LFPS Support
The device explicitly supports USB 3.0 LFPS by detecting an idle state at the input and squelching the corresponding output to prevent unwanted noise from being
redriven. When the differential input LFPS signal falls
below the 100mVP-P threshold, the device squelches the
output. When a differential LFPS signal above 300mVP-P
(typ) is present at the input, the device turns on the corresponding output and redrives the signal. The device
features an LFPS idle entry time of 4ns (typ) and exit time
of 4ns (typ) in the active state.
Advanced Power Management
Standby State
Drive ENRXD low to place the device into a low-power
standby state. In standby, the inputs are in a commonmode high-impedance state and the device consumes
less than 1mW (typ) of power. The entry time to standby
is 2Fs (typ), and the exit time is 50Fs (typ).
Table 3. Typical Output Nontransition Bit
Amplitude
DE_
AMPLITUDE (mVP-P)
N.C*
640
0
840
1
940
*Not connected.
Table 2. Typical Output Transition
Bit Amplitude (Refer to the Electrical
Characteristics Table)
Table 4. Typical Output Deemphasis
CONTROL LOGIC
OS_ = 0
OS_ = 1, N.C.*
DE_ = 0
-2.5dB
-3.0dB
OS_
AMPLITUDE (mVP-P)
DE_ = N.C.
-3.3dB
-3.9dB
N.C.*, 1
1010 to 1270
DE_ = 1
-2.2dB
-2.7dB
0
940 to 1210
*Not connected.
*Not connected.
����������������������������������������������������������������� Maxim Integrated Products 9
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
Receiver Detection
The device features independent receiver detection on
each channel. Upon initial power-up, if ENRXD is high,
receiver detection initializes. If the device is in a powered-up state, the receiver detection is initiated on the
rising edge of ENRXD. During receiver detection, the part
remains in low-power mode 23mW (typ) and the outputs
and inputs are in a common-mode high-impedance state.
The receiver detection repeats every 12ms (typ) until the
receiver is detected. The receiver must be detected on
both channels to exit the receiver detection state.
Dynamic Power-Down
The device enters dynamic power-down state when a
receiver has been detected and no signal is present at
the input. The device exits this state when a signal is
detected at the input. The device consumes less than
82.5mW (typ) power in dynamic power-down state.
The device enters dynamic power-down after 30Fs idle
detection. If no signal is detected for more than 12ms
(typ), the part enters receiver detection state.
Active State
The device automatically enters active state after a
receiver is detected and an input signal is present. The
part can be forced into the active state by setting CM = 1
as shown in Table 5. The device consumes less than
304mW (typ) of power in this state.
USB 3.0 Compliance Mode
The MAX14972 features a USB 3.0 compliance mode
that forces the device to remain in the active state. The
device redrives signals to test the transmitter for voltage and timing specifications compliance as required
by USB 3.0 specifications. Drive ENRXD high or leave
unconnected, and CM high to activate USB 3.0 compliance mode. Drive ENRXD high or leave unconnected,
and CM low or leave unconnected for normal operation
(Table 5). Receiver detection and dynamic power-down
are disabled in compliance mode (CM = 1), while the part
remains in the active state with functional LFPS support.
Applications Information
Layout
Circuit-board layout and design can significantly affect
the performance of the device. Use good high-frequency
design techniques, including minimizing ground inductance and using controlled-impedance transmission lines
on data signals. Power-supply decoupling capacitors
must be placed as close as possible to VCC. Always connect VCC to a power plane.
Exposed-Pad Package
The exposed pad, 24-pin TQFN package incorporates
features that provide a very low thermal resistance path for
heat removal from the IC. The exposed pad on the device
must be soldered to the PCB ground plane for proper
electrical and thermal performance. For more information on exposed-pad packages, refer to Application Note
862: HFAN-08.1: Thermal Considerations of QFN and
Other Exposed-Paddle Packages.
Power-Supply Sequencing
Caution: Do not exceed the absolute maximum ratings
because stresses beyond the listed ratings may cause
permanent damage to the device.
Proper power-supply sequencing is recommended for all
devices. Always apply GND then VCC before applying
signals, especially if the signal is not current limited.
Ordering Information
Table 5. Digital Control Truth Table
ENRXD
CM
0
0
Power-Down
0
1
Power-Down
1 or N.C.*
DESCRIPTION
0 or N.C.* Normal Operation
1 or N.C.*
1
Compliance Mode (Active)
PART
MAX14972CTG+
TEMP RANGE
PIN-PACKAGE
0NC to +70NC
24 TQFN-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
*Not connected.
���������������������������������������������������������������� Maxim Integrated Products 10
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
Package Information
Chip Information
PROCESS: BiCMOS
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
24 TQFN-EP
T2444+3
21-0139
90-0021
���������������������������������������������������������������� Maxim Integrated Products 11
MAX14972
Dual SuperSpeed USB 3.0 Equalizer/Redriver
Revision History
REVISION
NUMBER
REVISION
DATE
0
10/11
Initial release
—
1
3/12
Updated Electrical Characteristics table
14
DESCRIPTION
PAGES
CHANGED
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2012
Maxim Integrated Products 12
Maxim is a registered trademark of Maxim Integrated Products, Inc.