VBP104S, VBP104SR www.vishay.com Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: surface mount • Package form: GW, RGW VBP104S • Dimensions (L x W x H in mm): 6.4 x 3.9 x 1.2 • Radiant sensitive area (in mm2): 4.4 • High photo sensitivity • High radiant sensitivity • Suitable for visible and near infrared radiation • Fast response times • Angle of half sensitivity: = ± 65° • Floor life: 168 h, MSL 3, acc. J-STD-020 VBP104SR • Lead (Pb)-free reflow soldering • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC APPLICATIONS DESCRIPTION • High speed photo detector VBP104S and VBP104SR are high speed and high sensitive PIN photodiodes. It is a surface mount device (SMD) including the chip with a 4.4 mm2 sensitive area detecting visible and near infrared radiation. PRODUCT SUMMARY Ira (μA) (deg) 0.1 (nm) VBP104S 35 ± 65 430 to 1100 VBP104SR 35 ± 65 430 to 1100 COMPONENT Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VBP104S Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Gullwing VBP104SR Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Reverse gullwing Note • MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION Reverse voltage Power dissipation Tamb 25 °C Junction temperature SYMBOL VALUE VR 60 UNIT V PV 215 mW Tj 100 °C Operating temperature range Tamb - 40 to + 100 °C Storage temperature range Tstg - 40 to + 100 °C Tsd 260 °C RthJA 350 K/W Soldering temperature Acc. reflow solder profile fig. 8 Thermal resistance junction/ambient Rev. 1.3, 10-Aug-11 1 Document Number: 81170 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBP104S, VBP104SR www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL IF = 50 mA VF TYP. MAX. UNIT 1 1.3 V IR = 100 μA, E = 0 V(BR) VR = 10 V, E = 0 Iro 2 30 nA VR = 0 V, f = 1 MHz, E = 0 CD 48 VR = 3 V, f = 1 MHz, E = 0 CD 17 40 pF Forward voltage Breakdown voltage Reverse dark current Diode capacitance MIN. 60 V pF Open circuit voltage Ee = 1 mW/cm2, = 950 nm Vo 350 mV Temperature coefficient of Vo Ee = 1 mW/cm2, = 950 nm TKVo - 2.6 mV/K Short circuit current Ee = 1 mW/cm2, = 950 nm Ik 32 μA Temperature coefficient of Ik Ee = 1 mW/cm2, = 950 nm TKIk 0.1 %/K Reverse light current Ee = 1 mW/cm2, = 950 nm, VR = 5 V Ira 35 μA 25 Angle of half sensitivity ± 65 deg Wavelength of peak sensitivity p 940 nm Range of spectral bandwidth 0.1 430 to 1100 nm Noise equivalent power VR = 10 V, = 950 nm NEP 4 x 10-14 W/Hz Rise time VR = 10 V, RL = 1 k, = 820 nm tr 100 ns Fall time VR = 10 V, RL = 1 k, = 820 nm tf 100 ns BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) I ra rel - Relative Reverse Light Current Iro - Reverse Dark Current (nA) 1000 100 10 VR = 10 V 1 20 94 8403 40 60 80 VR = 5 V λ = 950 nm 1.2 1.0 0.8 0.6 100 0 Tamb - Ambient Temperature (°C) 94 8409 Fig. 1 - Reverse Dark Current vs. Ambient Temperature Rev. 1.3, 10-Aug-11 1.4 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 2 - Relative Reverse Light Current vs. Ambient Temperature 2 Document Number: 81170 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBP104S, VBP104SR www.vishay.com Vishay Semiconductors S(λ)rel - Relative Spectral Sensitivity 100 10 VR = 5 V λ = 950 nm 1 0.8 0.6 0.4 0.2 0 0.1 0.01 0.1 10 1 350 Ee - Irradiance (mW/cm2) 94 8421 550 750 Fig. 6 - Relative Spectral Sensitivity vs. Wavelength 0° 100 10° 20° 30° Srel - Relative Radiant Sensitivity λ = 950 nm 1 mW/cm2 0.5 mW/cm2 10 1150 950 λ - Wavelength (nm) 94 8420 Fig. 3 - Reverse Light Current vs. Irradiance Ira - Reverse Light Current (µA) 1.0 0.2 mW/cm2 2 0.1 mW/cm 0.05 mW/cm2 40° 1.0 0.9 50° 0.8 60° 70° 0.7 ϕ - Angular Displacement Ira - Reverse Light Current (µA) 1000 80° 1 0.1 1 0.6 100 10 VR - Reverse Voltage (V) 94 8422 0.4 0.2 0 94 8406 Fig. 4 - Reverse Light Current vs. Reverse Voltage Fig. 7 - Relative Radiant Sensitivity vs. Angular Displacement CD - Diode Capacitance (pF) 80 E=0 f = 1 MHz 60 40 20 0 0.1 94 8423 1 100 10 VR - Reverse Voltage (V) Fig. 5 - Diode Capacitance vs. Reverse Voltage Rev. 1.3, 10-Aug-11 3 Document Number: 81170 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBP104S, VBP104SR www.vishay.com Vishay Semiconductors 0.1 - 0.1 0.15 ± 0.02 1.2 ± 0.1 0.75 ± 0.05 (0.47 ref.) PACKAGE DIMENSIONS FOR VBP104S in millimeters Flat area 0.3 min. 4.4 ± 0.1 0.18 ± 0.2 2.2 Chip Size 2.4 x 2.4 Cathode 0.8 ± 0.1 1.6 ± 0.1 3.9 ± 0.1 1.95 Anode 1 ± 0.15 6.4 ± 0.3 technical drawings according to DIN specifications Recommended solder pad 8.9 1.8 5.4 Drawing-No.: 6.541-5088.01-4 Issue: 1; 15.04.10 22107 Rev. 1.3, 10-Aug-11 4 Document Number: 81170 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBP104S, VBP104SR www.vishay.com Vishay Semiconductors 0.1 min. (0.47 ref.) Flat area 0.3 min. 0.15 ± 0.02 1.2 ± 0.1 0.75 ± 0.05 PACKAGE DIMENSIONS FOR VBP104SR in millimeters 4.4 ± 0.1 0.18 ± 0.2 2.2 Chip Size Cathode 0.8 ± 0.1 Anode 3.9 ± 0.1 1.6 ± 0.1 1.95 2.4 x 2.4 1 ± 0.15 6.4 ± 0.3 technical drawings according to DIN Recommended solder pad specifications 8.9 1.8 5.4 Drawing-No.: 6.541-5087.01-4 Issue: 1; 15.04.10 22106 Rev. 1.3, 10-Aug-11 5 Document Number: 81170 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBP104S, VBP104SR www.vishay.com Vishay Semiconductors TAPING DIMENSIONS FOR VBP104S in millimeters 21730 TAPING DIMENSIONS FOR VBP104SR in millimeters 21731 Rev. 1.3, 10-Aug-11 6 Document Number: 81170 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBP104S, VBP104SR www.vishay.com Vishay Semiconductors REEL DIMENSIONS FOR VBP104S AND VBP104SR in millimeters 21732 SOLDER PROFILE DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. 300 255 °C 240 °C 217 °C 250 Temperature (°C) max. 260 °C 245 °C 200 FLOOR LIFE max. 30 s Time between soldering and removing from MBB must not exceed the time indicated in J-STD-020: Moisture sensitivity: level 3 Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 0 0 19841 50 100 150 200 250 DRYING 300 In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or recommended conditions: 192 h at 40 °C (+ 5 °C), RH < 5 % or 96 h at 60 °C (+ 5 °C), RH < 5 %. Time (s) Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 Rev. 1.3, 10-Aug-11 7 Document Number: 81170 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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