TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors High Power Infrared Emitting Diode, RoHS Compliant, 940 nm, GaAlAs/GaAs FEATURES TSML1020 TSML1000 • Package type: surface mount • Package form: GW, RGW, yoke, axial • Dimensions (L x W x H in mm): 2.5 x 2 x 2.7 TSML1030 • Peak wavelength: p = 940 nm • High radiant power • High radiant intensity • Angle of half intensity: = ± 12° TSML1040 • Low forward voltage • Suitable for high pulse current operation • Good spectral matching with Si photodetectors 16852 • Versatile terminal configurations • Package matches with detector TEMT1000 • Floor life: 168 h, MSL 3, acc. J-STD-020 • Compliant to RoHS Directive 2002/95/EC and in accordance with WEEE 2002/96/EC DESCRIPTION TSML1000 is an infrared, 940 nm emitting diode in GaAlAs/GaAs with high radiant power molded in a clear, untinted plastic package (with lens) for surface mounting (SMD). APPLICATIONS • For remote control • Punched tape readers • Encoder • Photointerrupters PRODUCT SUMMARY Ie (mW/sr) (deg) P (nm) tr (ns) TSML1000 7 ± 12 940 800 TSML1020 7 ± 12 940 800 TSML1030 7 ± 12 940 800 TSML1040 7 ± 12 940 800 COMPONENT Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM TSML1000 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Reverse gullwing TSML1020 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Gullwing TSML1030 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Yoke TSML1040 Bulk MOQ: 1000 pcs, 1000 pcs/bulk Axial leads Note • MOQ: minimum order quantity Rev. 2.0, 30-Jun-11 1 Document Number: 81033 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current IF 100 mA Peak forward current tp/T = 0.5, tp 100 μs IFM 200 mA Surge forward current tp = 100 μs IFSM 1.0 A PV 190 mW Power dissipation Junction temperature Tj 100 °C Operating temperature range Tamb - 40 to + 85 °C Storage temperature range Tstg - 40 to + 100 °C t5s Tsd < 260 °C Soldered on PCB, pad dimensions: 4 mm x 4 mm RthJA 400 °C Soldering temperature Thermal resistance junction/ambient 120 180 100 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 200 140 120 100 80 60 40 20 0 0 16187 80 60 40 20 0 10 20 30 40 50 60 70 80 90 100 10 20 30 40 50 60 70 80 90 100 0 T amb - Ambient Temperature (°C) Tamb - Ambient Temperature (°C) 16188 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) TEST CONDITION SYMBOL TYP. MAX. UNIT IF = 20 mA, tp = 20 ms VF 1.2 1.5 V IF = 1 A, tp = 100 μs VF 2.6 Temperature coefficient of VF IF = 1 mA TKVF - 1.8 Reverse current VR = 5 V IR VR = 0 V, f = 1 MHz, E = 0 Cj Radiant intensity IF = 20 mA, tp = 20 ms Ie Radiant power IF = 100 mA, tp = 20 ms e 35 mW IF = 20 mA TKe - 0.6 %/K ± 12 deg IF = 100 mA p 940 nm PARAMETER Forward voltage Junction capacitance Temperature coefficient of e Angle of half intensity Peak wavelength MIN. V mV/K 10 μA 15 mW/sr 25 3 7 pF Spectral bandwidth IF = 100 mA 50 nm Temperature coefficient of p IF = 100 mA TKp 0.2 nm/K Rise time IF = 100 mA tr 800 ns Fall time IF = 100 mA tf 800 ns d 1.2 mm Virtual source diameter Rev. 2.0, 30-Jun-11 2 Document Number: 81033 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1000 0.1 0.05 0.02 1000 Φ e - Radiant Power (mW) I F - Forward Current (mA) 10 000 tp / T = 0.01 0.2 0.5 100 1.0 10 0.01 0.10 1.00 10.00 1 0.1 10 0 13602 1.6 103 1.2 Ie rel; Φe rel 104 10 4 102 tP = 100 µs tP/T = 0.001 IF = 20 mA 0.8 0.4 101 0 - 10 0 10 100 0 1 2 3 4 VF - Forward Voltage (V) 13600 Φe rel - Relative Radiant Power 10 1 101 102 103 1.0 0.75 0.5 0.25 IF = 100 mA 0 104 890 IF - Forward Current (mA) 14291 990 940 λ - Wavelength (nm) Fig. 8 - Relative Radiant Power vs. Wavelength Fig. 5 - Radiant Intensity vs. Forward Current Rev. 2.0, 30-Jun-11 140 1.25 100 16189 100 Fig. 7 - Relative Radiant Intensity/Power vs. Ambient Temperature 1000 0.1 100 50 T amb - Ambient Temperature (°C) 94 7993 Fig. 4 - Forward Current vs. Forward Voltage Ie - Radiant Intensity (mW/sr) 10 1 10 2 10 3 I F - Forward Current (mA) Fig. 6 - Radiant Power vs. Forward Current Fig. 3 - Pulse Forward Current vs. Pulse Duration IF - Forward Current (mA) 10 100.00 t p - Pulse Duration (ms) 14335 100 3 Document Number: 81033 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors REFLOW SOLDER PROFILE 0° 10° 20° 30° 260 220 1.0 0.9 50° 0.8 60° 0.7 70° Temperature (°C) Ie rel - Relative Intensity 240 40° 80° 0.6 0.4 0.2 0 0.2 0.4 200 - 5 °C/s + 5 °C/s 180 160 140 120 60 s to 120 s 5s 100 80 0.6 18234 60 0 Fig. 9 - Relative Radiant Intensity vs. Angular Displacement 20 40 60 80 100 120 140 160 180 200 220 Time (s) 17172 Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile PRECAUTIONS FOR USE 1. Over-current-proof 1 °C/s to 5 °C/s Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (burn out will happen). Pre-heating 180 °C to 200 °C 260 °C max. 10 s max. 60 s max. above 220 °C 2. Storage 120 s max. 2.1 Storage temperature and rel. humidity conditions are: 5 °C to 35 °C, R.H. 60 %. 1 °C/s to 5 °C/s 2.2 Floor life must not exceed 168 h, acc. to JEDEC level 3, J-STD-020. Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with desiccant. Considering tape life, we suggest to use products within one year from production date. 22566 Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020 2.3 If opened more than one week in an atmosphere 5 °C to 35 °C, R.H. 60 %, devices should be treated at 60 °C ± 5 °C for 15 h. 2.4 If humidity indicator in the package shows pink color (normal blue), then devices should be treated with the same conditions as 2.3. Rev. 2.0, 30-Jun-11 4 Document Number: 81033 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: TSML1000 16159 PACKAGE DIMENSIONS in millimeters: TSML1020 3.8 ± 0.2 2.7 ± 0.2 0.75 0.15 ± 0.05 1.4 0.85 Ø 1.9 ± 0.2 0.3 0.4 0.5 2 ± 0.2 C Rev. 2.0, 30-Jun-11 4.5 ± 0.1 2.3 ± 0.1 1 ± 0.1 2.5 ± 0.2 1.1 16160 A 5 Document Number: 81033 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: TSML1030 16228 PACKAGE DIMENSIONS in millimeters: TSML1040 16760 Rev. 2.0, 30-Jun-11 6 Document Number: 81033 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors 16 ±0.2 Unreel direction X 2. 60.2 ±0.5 REEL DIMENSIONS in millimeters 5 ±0 178 ±1 .5 0. 5 Tape position coming out from reel 13 ± X 13.2 ±1.5 Label posted here Leader and trailer tape: Empty leader (400 mm, min.) Parts mounted Drawing-No.: 9.800-5080.01-4 Direction of pulling out Issue: 3; 11.06.08 Empty trailer (200 mm, min.) 18033 TAPING DIMENSIONS in millimeters: TSML1000 3.05 ± 0.1 Top tape Anode 12 ± 0.3 1.75 ± 0.1 2 ± 0.05 Ø 1.55 ± 0.05 5.5 ± 0.05 0.3 4 ± 0.1 4 ± 0.1 Feed direction Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs Rev. 2.0, 30-Jun-11 7 18030 Document Number: 81033 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors TAPING DIMENSIONS in millimeters: TSML1020 3.05 ± 0.1 4 ± 0.1 Feed direction Top tape 12 ± 0.3 2 ± 0.05 1.75 ± 0.1 Ø 1.55 ± 0.05 5.5 ± 0.05 0.3 4 ± 0.1 Anode Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs 18031 TAPING DIMENSIONS in millimeters: TSML1030 3.05 ± 0.1 Feed direction Top tape 4 ± 0.1 Anode Push pin through hole Rev. 2.0, 30-Jun-11 12 ± 0.3 1.75 ± 0.1 2 ± 0.05 Ø 1.55 ± 0.05 5.5 ± 0.05 0.3 4 ± 0.1 18032 Quantity per reel: 1000 pcs or 5000 pcs 8 Document Number: 81033 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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