New Product Si1405BDH Vishay Siliconix P-Channel 1.8-V (G-S) MOSFET FEATURES PRODUCT SUMMARY VDS (V) -8 rDS(on) (Ω) ID (A)c 0.112 at VGS = - 4.5 V - 1.6 0.160 at VGS = - 2.5 V - 1.6 0.210 at VGS = - 1.8 V - 1.6 • TrenchFET® Power MOSFET Qg (Typ) APPLICATIONS 3.67 nC RoHS • Load Switch for Portable Devices COMPLIANT SOT-363 SC-70 (6-LEADS) 1 6 D D 2 5 D G 3 4 S Marking Code BO XX YY D Lot Traceability and Date Code Part # Code Top View Ordering Information: Si1405BDH-T1-E3 (Lead (Pb)-free) ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Limit Drain-Source Voltage VDS -8 Gate-Source Voltage VGS ±8 TC = 70 °C TA = 25 °C - 1.6c ID - 1.6a, b, c - 1.6a, b, c TA = 70 °C TC = 25 °C Continuous Source-Drain Diode Currenta, b TA = 25 °C Maximum Power Dissipationa, b - 1.6c IS - 1.47a, b TC = 25 °C 2.27 TC = 70 °C 1.45 TA = 25 °C PD Soldering Recommendations (Peak Temperature) W 1.47a, b 0.95a, b TA = 70 °C TJ, Tstg Operating Junction and Storage Temperature Range A - 8c IDM Pulsed Drain Current (10 µs Pulse Width) V -1.6c TC = 25 °C Continuous Drain Current (TJ = 150 °C)a, b Unit - 55 to 150 c, d °C 260 THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambienta, d Maximum Junction-to-Foot (Drain) Symbol Typical Maximum t≤5s RthJA 70 85 Steady State RthJF 44 55 Unit °C/W Notes: a. Surface Mounted on 1" x 1" FR4 board. b. t = 5 s. c. Package limited. d. Maximum under Steady State conditions is 125 °C/W. Document Number: 74634 S-71945-Rev. A, 10-Sep-07 www.vishay.com 1 New Product Si1405BDH Vishay Siliconix SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Symbol Test Conditions Min VDS VGS = 0 V, ID = - 250 µA -8 Typ Max Unit Static Drain-Source Breakdown Voltage VDS Temperature Coefficient ΔVDS/TJ VGS(th) Temperature Coefficient ΔVGS(th)/TJ Gate-Source Threshold Voltage ID = - 250 µA VGS(th) VDS = VGS, ID = - 250 µA Gate-Source Leakage IGSS VDS = 0 V, VGS = - 8 V Zero Gate Voltage Drain Current IDSS On-State Drain Currenta ID(on) Drain-Source On-State Resistancea Forward Transconductancea gfs mV/°C 1.98 - 0.45 - 0.95 V - 100 nA VDS = - 8 V, VGS = 0 V -1 VDS = - 8 V, VGS = 0 V, TJ = 55 °C - 10 VDS ≤ 5 V, VGS = - 4.5 V rDS(on) V - 5.4 -8 µA A VGS = - 4.5 V, ID = - 2.8 A 0.091 0.112 VGS = - 2.5 V, ID = - 2.3 A 0.132 0.160 VGS = - 1.8 V, ID = - 0.5 A 0.171 0.205 VDS = - 4 V, ID = - 2.8 A 4.8 Ω S Dynamicb Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Gate Resistance Rg Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time 305 VDS = - 4 V, VGS = 0 V, f = 1 MHz 66 3.67 VDS = - 4 V, VGS = - 4.5 V, ID = - 2.8 A td(off) 5.5 0.61 nC 0.98 Ω f = 1 MHz 6.3 10 15 VDD = - 4 V, RL = 1.78 Ω ID ≅ - 2.25 A, VGEN = - 4.5 V, Rg = 1 Ω 26 39 16 24 7 10.5 td(on) tr pF 108 tf ns Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current TC = 25 °C IS Pulse Diode Forward Current ISM Body Diode Voltage VSD Body Diode Reverse Recovery Time trr Body Diode Reverse Recovery Charge Qrr Reverse Recovery Fall Time ta Reverse Recovery Rise Time tb - 1.6 -8 IS = 1.4 A, VGS = 0 V IF = - 1.4 A, di/dt = 100 A/µs, TJ = 25 °C A - 0.8 - 1.2 V 23 35 ns 5.8 8.7 nC 6 17 ns Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 Document Number: 74634 S-71945-Rev. A, 10-Sep-07 New Product Si1405BDH Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 8 3.0 VGS = 5 V thru 2.5 V 2.4 I D - Drain Current (A) I D - Drain Current (A) 6 VGS = 2 V 4 2 VGS = 1.5 V 1 2 3 TJ = 25 °C 1.2 TJ = 125 °C 0.6 0 0 1.8 TJ = - 55 °C 0.0 0.0 4 0.4 VDS - Drain-to-Source Voltage (V) 1.6 2.0 Transfer Characteristics 500 0.5 0.4 400 C - Capacitance (pF) VGS = 1.8 V 0.3 0.2 VGS = 2.5 V VGS = 4.5 V 0.1 Ciss 300 200 Coss 100 Crss 0 0.0 0 2 4 6 0 8 2 4 6 8 VDS - Drain-to-Source Voltage (V) ID - Drain Current (A) On-Resistance vs. Drain Current and Gate Voltage Capacitance 5 1.8 ID = 2.8 A VDS = 4 V 4 1.5 r DS(on) - On-Resistance (Normalized) VGS - Gate-to-Source Voltage (V) 1.2 VGS - Gate-to-Source Voltage (V) Output Characteristics r DS(on) - D to S On-Resistance (Ω) 0.8 3 VDS = 6.4 V 2 1 VGS = 4.5 V, ID = 2.8 A VGS = 2.5 V, ID = 2.3 A 1.2 VGS = 1.8 V, ID = 0.5 A 0.9 0.6 0 0 1 2 3 Qg - Total Gate Charge (nC) Gate Charge Document Number: 74634 S-71945-Rev. A, 10-Sep-07 4 5 0.3 - 50 - 25 0 25 50 75 100 125 150 TJ - Junction Temperature (°C) On-Resistance vs. Junction Temperature www.vishay.com 3 New Product Si1405BDH Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 0.24 100 ID = 2.8 A r DS(on) - On-Resistance (Ω) I S - Source Current (A) 10 TJ = 150 °C 1 TJ = 25 °C 0.1 0.18 TA = 125 °C 0.12 TA = 25 °C 0.06 0.01 0.001 0.0 0.00 0.2 0.4 0.6 0.8 1.0 0 1.2 1 2 3 4 5 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage On-Resistance vs. Gate-to-Source Voltage 0.9 30 25 0.8 ID = 250 µA Power (W) V GS(th) (V) 20 0.7 0.6 15 10 0.5 0.4 - 50 5 - 25 0 25 50 75 100 125 0 0.001 150 0.01 0.1 TJ - Temperature (°C) 1 10 100 600 Time (s) Single Pulse Power, Junction-to-Ambient Threshold Voltage 10 Limited by r DS(on)* 100 ms 1s I D - Drain Current (A) 1 10 s DC 0.1 0.01 TA = 25 °C Single Pulse 0.001 0.1 BVDSS Limited 1 * VGS 10 VDS - Drain-to-Source Voltage (V) minimum VGS at which rDS(on) is specified Safe Operating Area, Junction-to-Ambient www.vishay.com 4 Document Number: 74634 S-71945-Rev. A, 10-Sep-07 New Product Si1405BDH Vishay Siliconix 5 3.0 4 2.4 3 1.8 Power I D - Drain Current (A) TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 2 1.2 Package Limited 1 0.6 0 0.0 0 25 50 75 100 125 150 0 TC - Case Temperature (°C) 25 50 75 100 125 150 TC - Case Temperature (°C) Power Derating Current Derating* * The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 Notes: 0.1 PDM 0.1 0.05 t1 t2 1. Duty Cycle, D = 0.02 t1 t2 2. Per Unit Base = RthJA =100 °C/W Single Pulse 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted 0.01 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (s) 10 100 600 Normalized Thermal Transient Impedance, Junction-to-Ambient Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?74634. Document Number: 74634 S-71945-Rev. A, 10-Sep-07 www.vishay.com 5 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1