VISHAY SI1050X-T1-E3

Si1050X
Vishay Siliconix
N-Channel 8-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
8
RDS(on) (Ω)
ID (A)
0.086 at VGS = 4.5 V
1.34a
0.093 at VGS = 2.5 V
1.29
Qg (Typ.)
1.23
0.120 at VGS = 1.5 V
0.7
RoHS
COMPLIANT
7.1
0.102 at VGS = 1.8 V
• Halogen-free Option Available
• TrenchFET® Power MOSFET
• 100 % Rg Tested
APPLICATIONS
• Load Switch for Portable Devices
SC-89 (6-LEADS)
D
1
6
D
D
5
2
D
Q
XX
YY
Marking Code
Lot Traceability
and Date Code
G
3
4
S
Part # Code
Top View
Ordering Information: Si1050X-T1-E3 (Lead (Pb)-free)
Si1050X-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)a
Pulsed Drain Current
Continuous Source-Drain Diode Current
Maximum Power Dissipationa
Symbol
VDS
VGS
TA = 25 °C
TA = 70 °C
TA = 25 °C
TA = 25 °C
TA = 70 °C
ID
IDM
IS
PD
TJ, Tstg
Operating Junction and Storage Temperature Range
Limit
8
±5
Unit
V
1.34b, c
1.07b, c
6
A
0.2b, c
0.236b, c
0.151b, c
- 55 to 150
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, d
Symbol
t≤5s
Steady State
RthJA
Typical
440
540
Maximum
530
650
Unit
°C/W
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under steady state conditions is 650 °C/W.
Document Number: 73896
S-80641-Rev. B, 24-Mar-08
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Si1050X
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 µA
8
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
ID = 250 µA
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = 250 µA
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 5 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductance
RDS(on)
gfs
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
tr
mV/°C
- 2.55
0.35
0.9
V
± 100
nA
VDS = 8 V, VGS = 0 V
1
nA
VDS = 8 V, VGS = 0 V, TJ = 85 °C
10
µA
VDS = ≥ 5 V, VGS = 4.5 V
VGS = 4.5 V, ID = 1.34 A
6
A
0.071
0.086
VGS = 2.5 V, ID = 1.29 A
0.078
0.093
VGS = 1.8 V, ID = 1.23 A
0.085
0.102
VGS = 1.5 V, ID = 0.76 A
0.092
0.120
VDS = 4 V, ID = 1.34 A
4.12
Ω
S
585
VDS = 4 V, VGS = 0 V, f = 1 MHz
190
pF
130
VDS = 4 V, VGS = 5 V, ID = 1.34 A
VDS = 4 V, VGS = 4.5 V, ID = 1.34 A
7.7
11.6
7.1
10.7
1.14
nC
1.69
f = 1 MHz
td(on)
td(off)
V
18.2
VDD = 4 V, RL = 3.6 Ω
ID ≅ 1.1 A, VGEN = 4.5 V, Rg = 1 Ω
tf
3.5
4.6
6.8
10.2
Ω
35
53
25
37.5
6
9
0.8
1.2
V
18.5
28
nC
3.7
5.7
ns
Drain-Source Body Diode Characteristics
Pulse Diode Forward Currenta
Body Diode Voltage
ISM
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
6
IS = 1.0 A
IF = 1.0 A, di/dt = 100 A/µs
6.7
A
ns
11.8
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 73896
S-80641-Rev. B, 24-Mar-08
Si1050X
Vishay Siliconix
TYPICAL CHARACTERISTICS
TA = 25 °C, unless otherwise noted
6
3.0
VGS = 5 thru 2 V
2.5
VGS = 1.5 V
4
3
2
I D - Drain Current (A)
I D - Drain Current (A)
5
2.0
TC = 125 °C
1.5
1.0
1
TC = 25 °C
0.5
VGS = 1.0 V
0
0.0
0.6
1.2
1.8
TC = - 55 °C
0.0
0.0
2.4
0.4
VDS - Drain-to-Source Voltage (V)
1.2
1.6
2.0
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics curves vs. Temp.
1000
0.15
800
0.12
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
0.8
VGS = 1.8 V
VGS = 1.5 V
VGS = 2.5 V
0.09
VGS = 4.5 V
Ciss
600
400
Coss
0.06
200
Crss
0
0.03
0
1
2
3
4
5
0
6
1
ID - Drain Current (A)
2
3
4
5
6
7
8
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
5
1.6
4
VDS = 4 V
3
VGS = 6.4 V
2
1
(Normalized)
1.4
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
ID = 1.34 A
VGS = 4.5 V, ID = 1.34 A
VGS = 1.5 V, ID = 0.76 A
1.2
1.0
VGS = 2.5 V, ID = 1.30 A
VGS = 1.8 V, ID = 1.23 A
0.8
0
0
2
4
6
Qg - Total Gate Charge (nC)
Qg - Gate Charge
Document Number: 73896
S-80641-Rev. B, 24-Mar-08
8
10
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Si1050X
Vishay Siliconix
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
0.16
10
R DS(on) - On-Resistance (Ω)
ID = 1.34 A
I S - Source Current (A)
1
TJ = 25 °C
TJ = 150 °C
0.1
0.01
0.001
0.0
0.12
TA = 125 °C
0.08
TA = 25 °C
0.04
0.00
0.2
0.6
0.4
0.8
0
1.0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
RDS(on) vs VGS vs Temperature
0.9
5.0
0.8
ID = 250 µA
Power (W)
VGS(th) Variance (V)
4.0
0.7
0.6
0.5
3.0
2.0
0.4
1.0
0.3
0.2
- 50
- 25
0
25
50
75
100
125
0
150
0.001
0.1
0.01
TJ - Temperature (°C)
1
10
100
1000
Time (s)
Threshold Voltage
Single Pulse Power
10
1 ms
Limited by RDS(on)*
10 ms
I D - Drain Current (A)
1
100 ms
1s
0.1
10 s
DC
0.01
TA = 25 °C
Single Pulse
0.001
0.1
BVDSS Limited
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS
minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 73896
S-80641-Rev. B, 24-Mar-08
Si1050X
Vishay Siliconix
TYPICAL CHARACTERISTICS
1
TA = 25 °C, unless otherwise noted
Duty Cycle = 0.5
Normalized Effective Transient
Thermal Impedance
0.2
0.1
0.1
0.05
0.02
Notes:
0.01
PDM
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 540 °C/W
0.001
3. TJM - TA = PDMZthJA (t)
Single Pulse
4. Surface Mounted
0.0001
10-4
10-3
10-2
1
10-1
Square Wave Pulse Duration (s)
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73896.
Document Number: 73896
S-80641-Rev. B, 24-Mar-08
www.vishay.com
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
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(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
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Document Number: 91000
Revision: 18-Jul-08
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