VISHAY SUM90N10-8M2P

SUM90N10-8m2P
Vishay Siliconix
N-Channel 100-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
V(BR)DSS (V)
rDS(on) (Ω)
ID (A)
Qg (Typ)
100
0.0082 at VGS = 10 V
90d
97
• TrenchFET® Power MOSFETS
• 175 °C Junction Temperature
• 100 % Rg and UIS Tested
RoHS
COMPLIANT
APPLICATIONS
• Power Supply
- Secondary Synchronous Rectification
• Industrial
• Primary Switch
D
TO-263
G
G
D S
Top View
S
N-Channel MOSFET
Ordering Information: SUM90N10-8m2P-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
100
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 175 °C)
TC = 25 °C
TC = 70 °C
ID
IDM
Pulsed Drain Current
Avalanche Current
a
L = 0.1 mH
Single Avalanche Energy
TC = 25 °C
Maximum Power Dissipationa
TA = 25
Operating Junction and Storage Temperature Range
°Cc
Unit
V
90d
90d
240
IAS
60
EAS
180
A
mJ
b
PD
300
3.75
W
TJ, Tstg
- 55 to 175
°C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB Mount)
c
Junction-to-Case (Drain)
RthJA
40
RthJC
0.5
°C/W
Notes:
a. Duty cycle ≤ 1 %.
b. See SOA curve for voltage derating.
c. When Mounted on 1" square PCB (FR-4 material).
d. Package limited.
Document Number: 74643
S-71690-Rev. A, 13-Aug-07
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SUM90N10-8m2P
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
V(BR)DSS
VDS = 0 V, ID = 250 µA
100
VGS(th)
VDS = VGS, ID = 250 µA
2.5
IGSS
VDS = 0 V, VGS = ± 20 V
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
IDSS
4.5
± 250
VDS = 100 V, VGS = 0 V
1
VDS = 100 V, VGS = 0 V, TJ = 125 °C
50
VDS = 100 V, VGS = 0 V, TJ = 150 °C
250
ID(on)
rDS(on)
gfs
VDS ≥ 10 V, VGS = 10 V
70
V
nA
µA
A
VGS = 10 V, ID = 20 A
0.0067
0.0082
VGS = 10 V, ID = 20 A, TJ = 125 °C
0.0127
0.0170
VDS = 15 V, ID = 20 A
62
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
182
Total Gate Chargec
Qg
97
Gate-Source
Chargec
Gate-Drain Chargec
VDS = 50 V, VGS = 10 V, ID = 85 A
td(on)
c
td(off)
tr
Fall Timec
pF
535
150
nC
32
25
Rg
c
Rise Timec
Turn-Off Delay Time
VGS = 0 V, VDS = 50 V, f = 1 MHz
Qgd
Gate Resistance
Turn-On Delay Time
Qgs
6290
f = 1 MHz
VDD = 50 V, RL = 0.588 Ω
ID ≅ 85 A, VGEN = 10 V, Rg = 1 Ω
tf
1.4
2.8
23
35
17
26
34
52
9
18
Ω
ns
Source-Drain Diode Ratings and Characteristics (TC = 25 °C)b
IS
85
Pulsed Current
ISM
240
Forward Voltagea
VSD
Continuous Current
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 30 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = 75 A, di/dt = 100 A/µs
A
0.85
1.5
V
61
100
ns
3.0
4.5
A
91
130
µC
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 74643
S-71690-Rev. A, 13-Aug-07
SUM90N10-8m2P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
120
180
VGS = 10 thru 7 V
150
g fs - Transconductance (S)
ID - Drain Current (A)
100
80
60
6V
40
20
TC = - 55 °C
120
TC = 25 °C
90
TC = 125 °C
60
30
5V
0
0
0
1
2
3
4
5
0
12
24
36
VDS - Drain-to-Source Voltage (V)
I D - Drain Current (A)
Output Characteristics
Transconductance
48
60
0.05
100
ID = 20 A
r DS(on) - On-Resistance (Ω)
I D - Drain Current (A)
80
60
40
TC = 125 °C
TC = 25 °C
20
2
4
6
8
0.03
0.02
TA = 150 °C
0.01
TA = 25 °C
TC = - 55 °C
0.00
4.0
0
0
0.04
10
5.2
6.4
7.6
8.8
10.0
VGS - Gate-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
On-resistance vs. Gate-to-Source Voltage
Transfer Characteristics
0.0073
8000
0.0071
6400
0.0069
C - Capacitance (pF)
r DS(on) - On-Resistance (Ω)
Ciss
VGS = 10 V
0.0067
0.0065
4800
3200
1600
Coss
0.0063
Crss
0
0
20
40
60
80
ID - Drain Current (A)
On-Resistance vs. Drain Current
Document Number: 74643
S-71690-Rev. A, 13-Aug-07
100
0
20
40
60
80
100
VDS - Drain-to-Source Voltage (V)
Capacitance
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SUM90N10-8m2P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.7
2.5
ID = 20 A
VGS(th) Variance (V)
VGS = 10 V
(Normalized)
r DS(on) - On-Resistance
0.2
2.0
1.5
- 0.3
ID = 5 mA
- 0.8
- 1.3
1.0
ID = 250 µA
- 1.8
0.5
- 50
- 25
0
25
50
75
100
125
150
- 2.3
- 50
175
- 25
0
75
100
125
150
175
125
150
175
Threshold Voltage
On-Resistance vs. Junction Temperature
130
10
ID = 85 A
ID = 1 mA
VDS = 50 V
VDS = 30 V
8
124
V(BR)DSS (normalized)
VGS - Gate-to-Source Voltage (V)
50
TJ - Temperature (°C)
TJ - Junction Temperature (°C)
VDS = 70 V
6
4
118
112
106
2
100
- 50
0
0
22
44
66
88
110
- 25
0
25
50
75
100
TJ - Junction Temperature (°C)
Qg - Total Gate Charge (nC)
Drain Source Breakdown vs. Junction Temperature
Gate Charge
140
100
TJ = 150 °C
112
ID - Drain Current (A)
10
I S - Source Current (A)
25
TJ = 25 °C
1
0.1
0.01
Package Limited
84
56
28
0
0.001
0
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
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1.2
0
25
50
75
100
125
150
TC - Case Temperature (°C)
Maximum Drain Current vs. Case Temperature
Document Number: 74643
S-71690-Rev. A, 13-Aug-07
SUM90N10-8m2P
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
1000
*Limited by r DS(on)
I D - Drain Current (A)
I DAV (A)
100
TJ = 25 °C
TJ = 150 °C
10
100 µs
10
1 ms
10 ms
100 ms
DC
1
TC = 25 °C
Single Pulse
1
10-5
10-4
10-3
10-2
10-1
0.1
0.1
1
1
t AV (sec)
*VGS
Single Pulse Avalanche Current Capability vs. Time
10
100
VDS - Drain-to-Source Voltage (V)
minimum VGS at which rDS(on) is specified
Safe Operating Area
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?74643.
Document Number: 74643
S-71690-Rev. A, 13-Aug-07
www.vishay.com
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
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document or by any conduct of Vishay.
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Document Number: 91000
Revision: 18-Jul-08
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