VISHAY SI4406DY-T1-E3

Si4406DY
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
RDS(on) (Ω)
ID (A)
0.0045 at VGS = 10 V
20
0.0055 at VGS = 4.5 V
17
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET® Power MOSFET
• Optimized for “Low Side” Synchronous
Rectifier Operation
• 100 % Rg Tested
APPLICATIONS
• DC/DC Converters
• Synchronous Rectifiers
SO-8
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
D
G
Top View
S
Ordering Information: Si4406DY-T1-E3 (Lead (Pb)-free)
Si4406DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
VDS
Gate-Source Voltage
VGS
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 70 °C
Steady State
30
Continuous Source Current (Diode Conduction)a
IS
TA = 25 °C
TA = 70 °C
PD
20
13
15
10
60
2.9
1.3
3.5
1.6
2.2
1
TJ, Tstg
Operating Junction and Storage Temperature Range
Unit
V
± 20
IDM
Pulsed Drain Current (10 µs Pulse Width)
Maximum Power Dissipationa
ID
10 s
A
W
°C
- 55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambienta
t ≤ 10 s
Steady State
RthJA
29
67
35
80
°C/W
Maximum Junction-to-Foot (Drain)
Steady State
RthJF
13
16
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
Document Number: 71824
S09-0221-Rev. E, 09-Feb-09
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Si4406DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
1.0
1.95
Max.
Unit
Static
VGS(th)
VDS = VGS, ID = 250 µA
3.0
V
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
nA
Zero Gate Voltage Drain Current
IDSS
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 55 °C
5
On-State Drain Currenta
ID(on)
Gate Threshold Voltage
Drain-Source On-State Resistancea
RDS(on)
Forward Transconductancea
Diode Forward Voltage
VDS ≥ 5 V, VGS = 10 V
a
µA
30
A
VGS = 10 V, ID = 20 A
0.0035
0.0045
VGS = 4.5 V, ID = 19 A
0.0043
0.0055
gfs
VDS = 15 V, ID = 20 A
95
VSD
IS = 2.9 A, VGS = 0 V
0.72
1.1
34
50
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
VDS = 15 V, VGS = 4.5 V, ID = 20 A
10
0.5
td(on)
Turn-On Delay Time
VDD = 15 V, RL = 15 Ω
ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
tf
Source-Drain Reverse Recovery
Time
trr
nC
15
IF = 2.9 A, dI/dt = 100 A/µs
1.3
2.2
21
35
15
25
100
150
30
45
50
80
Ω
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
60
60
VGS = 10 V thru 4 V
50
I D - Drain Current (A)
I D - Drain Current (A)
50
40
30
20
3V
40
30
20
TC = 125 °C
10
10
25 °C
- 55 °C
0
0
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2
1
2
3
4
5
0
0.0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
3.0
3.5
Document Number: 71824
S09-0221-Rev. E, 09-Feb-09
Si4406DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.010
7000
0.008
5600
C - Capacitance (pF)
R DS(on) - On-Resistance ( Ω)
Ciss
0.006
VGS = 4.5 V
0.004
VGS = 10 V
2800
0.002
1400
0.000
0
0
10
20
30
40
50
Coss
Crss
0
6
18
24
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Capacitance
30
1.8
VDS = 15 V
ID = 20 A
VGS = 10 V
ID = 20 A
1.6
R DS(on) - On-Resistance
(Normalized)
5
4
3
2
1
1.4
1.2
1.0
0.8
0
0
10
20
30
40
0.6
- 50
50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
Qg - Total Gate Charge (nC)
On-Resistance vs. Junction Temperature
Gate Charge
0.020
R DS(on) - On-Resistance (Ω)
50
I S - Source Current (A)
12
On-Resistance vs. Drain Current
6
VGS - Gate-to-Source Voltage (V)
4200
TJ = 150 °C
10
TJ = 25 °C
0.016
ID = 20 A
0.012
0.008
0.004
0.000
1
0
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
Document Number: 71824
S09-0221-Rev. E, 09-Feb-09
10
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Si4406DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.6
60
0.4
50
0.2
40
Power (W)
V GS(th) Variance (V)
ID = 250 µA
0.0
- 0.2
30
20
- 0.4
10
- 0.6
- 0.8
- 50
- 25
0
25
50
75
100
TJ - Temperature (°C)
125
150
0
10 - 2
10 - 1
1
10
100
600
Time (s)
Threshold Voltage
Single Pulse Power
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 67 °C/W
0.02
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10 - 4
10 - 3
10 - 2
4. Surface Mounted
10 - 1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 - 4
10 - 3
10 - 2
10 - 1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71824.
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Document Number: 71824
S09-0221-Rev. E, 09-Feb-09
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
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Document Number: 91000
Revision: 18-Jul-08
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