VISHAY SI6466ADQ_08

Si6466ADQ
Vishay Siliconix
N-Channel 2.5-V (G-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
20
RDS(on) (Ω)
ID (A)
0.014 at VGS = 4.5 V
8.1
0.020 at VGS = 2.5 V
6.6
• Halogen-free
• TrenchFET® Power MOSFETs
• 100 % Rg Tested
RoHS
COMPLIANT
D
TSSOP-8
D
1
S
2
S
3
G
4
* Source Pins 2, 3, 6 and 7
must be tied common.
G
8 D
7 S
6 S
5 D
S*
Top View
Ordering Information: Si6466ADQ-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
10 s
Steady State
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
±8
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 70 °C
Continuous Source Current (Diode Conduction)a
IS
TA = 25 °C
TA = 70 °C
PD
6.8
6.6
5.4
30
1.35
0.95
1.5
1.05
1.0
0.67
TJ, Tstg
Operating Junction and Storage Temperature Range
V
8.1
IDM
Pulsed Drain Current (10 µs Pulse Width)
Maximum Power Dissipationa
ID
Unit
- 55 to 150
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot
Symbol
t ≤ 10 s
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
65
83
100
120
43
52
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
Document Number: 71182
S-80682-Rev. C, 31-Mar-08
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Si6466ADQ
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
VGS(th)
VDS = VGS, ID = 250 µA
0.45
IGSS
VDS = 0 V, VGS = ± 8 V
± 100
VDS = 16 V, VGS = 0 V
1
VDS = 16 V, VGS = 0 V, TJ = 70 °C
10
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
a
nA
µA
20
A
VGS = 4.5 V, ID = 8.1 A
0.011
0.014
VGS = 2.5 V, ID = 6.6 A
0.017
0.020
gfs
VDS = 10 V, ID = 8.1 A
30
VSD
IS = 1.35 A, VGS = 0 V
0.65
1.1
18
27
VDS = 10 V, VGS = 5 V, ID = 8.1 A
3.2
RDS(on)
Forward Transconductancea
Diode Forward Voltage
VDS = 5 V, VGS = 4.5 V
V
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Rg
Gate Resistance
0.5
27
VDD = 10 V, RL = 10 Ω
ID ≅ 1 A, VGEN = 4.5 V, RG = 6 Ω
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
Ω
1.8
td(on)
Turn-On Delay Time
nC
4
IF = 1.5 A, di/dt = 100 A/µs
45
34
50
76
120
30
50
35
70
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
30
30
VGS = 5 thru 2.5 V
24
I D - Drain Current (A)
ID - Drain Current (A)
24
2V
18
12
6
18
12
TC = 125 °C
6
1.5 V
25 °C
0
0
2
4
6
8
VDS - Drain-to-Source Voltage (V)
Output Characteristics
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2
10
0
0.0
0.5
1.0
- 5 5 °C
1.5
2.0
2.5
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
Document Number: 71182
S-80682-Rev. C, 31-Mar-08
Si6466ADQ
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
3000
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
0.04
0.03
VGS = 2.5 V
0.02
VGS = 4.5 V
2400
Ciss
1800
1200
0.01
Coss
600
Crss
0
0.00
0
6
12
18
24
0
30
4
8
16
20
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
On-Resistance vs. Drain Current
Capacitance
5
1.8
VDS = 10 V
ID = 8.1 A
VGS = 10 V
ID = 8.1 A
1.6
4
R DS(on) - On-Resistance
(Normalized)
V GS - Gate-to-Source Voltage (V)
12
3
2
1
1.4
1.2
1.0
0.8
0.6
0
0
4
8
12
16
0.4
- 50
20
50
75
100
125
On-Resistance vs. Junction Temperature
150
0.05
R DS(on) - On-Resistance (Ω)
I S - Source Current (A)
25
Gate Charge
TJ = 150 °C
TJ = 25 °C
1
0.0
0
TJ - Junction Temperature (°C)
30
10
- 25
Qg - Total Gate Charge (nC)
0.04
ID = 8.1 A
0.03
0.02
0.01
0.00
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
Document Number: 71182
S-80682-Rev. C, 31-Mar-08
1.2
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
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Si6466ADQ
Vishay Siliconix
0.4
100
0.2
80
ID = 250 µA
Power (W)
V GS(th) Variance (V)
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.0
- 0.2
60
40
20
- 0.4
- 0.6
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
1
10
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 100 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
4. Surface Mounted
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?71182.
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Document Number: 71182
S-80682-Rev. C, 31-Mar-08
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Vishay
Disclaimer
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Document Number: 91000
Revision: 18-Jul-08
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