ROHM RU1C002UN

Data Sheet
1.2V Drive Nch MOSFET
RU1C002UN
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
UMT3F
2.0
0.9
0.53
(1)
0.53
0.425
2.1
Features
1) Low on-resistance.
2) Low voltage drive(1.2V drive).
(3)
1.25
0.425
0.32
(2)
0.65 0.65
1.3
0.13
Abbreviated symbol : QR
 Application
Switching
 Packaging specifications
Package
Type
Code
Basic ordering unit (pieces)
RU1C002UN
 Inner circuit
Taping
TCL
3000

(3)
∗1
∗2
(1) Gate
(2) Source
(3) Drain
 Absolute maximum ratings (Ta = 25C)
Symbol
Parameter
Drain-source voltage
VDSS
Gate-source voltage
VGSS
ID
Continuous
Drain current
Pulsed
Power dissipation
Channel temperature
Range of storage temperature
IDP
*1
PD
*2
Limits
Unit
20
8
200
V
V
mA
400
mA
150
mW
Tch
Tstg
150
55 to 150
C
C
Symbol
Limits
Unit
833
C / W
(1)
(2)
1 BODY DIODE
2 ESD PROTECTION DIODE
*1 Pw10s, Duty cycle1%
*2 Each terminal mounted on a reference land.
 Thermal resistance
Parameter
Channel to Ambient
Rth
(ch-a)*
* Each terminal mounted on a reference land.
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1/5
2011.09 - Rev.A
Data Sheet
RU1C002UN
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
Min.
IGSS
Drain-source breakdown voltage V(BR)DSS
Zero gate voltage drain current
Gate threshold voltage
Conditions
Typ.
Max.
Unit
-
-
10
A
VGS=8V, VDS=0V
20
-
-
V
ID=1mA, VGS=0V
IDSS
-
-
1
A
VDS=20V, VGS=0V
VGS (th)
0.3
-
1.0
V
VDS=10V, ID=1mA
-
0.8
1.2
-
1.0
1.4
-
1.2
2.4
*
ID=200mA, VGS=2.5V
ID=200mA, VGS=1.8V
Static drain-source on-state
resistance
RDS (on)
-
1.6
4.8
Forward transfer admittance
l Yfs l *
400
-
-
mS VDS=10V, ID=200mA
Input capacitance
Ciss
-
25
-
pF
VDS=10V

ID=40mA, VGS=1.5V
ID=20mA, VGS=1.2V
Output capacitance
Coss
-
10
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
10
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
5
-
ns
VDD 10V, ID=150mA
Rise time
tr *
td(off) *
-
10
-
ns
VGS=4.0V
-
15
10
-
ns
ns
RL=68
RG=10
Min.
Typ.
Max.
-
-
1.2
Turn-off delay time
Fall time
tf *
*Pulsed
Body diode characteristics (Source-Drain)
Parameter
Forward Voltage
Symbol
VSD *
Unit
V
Conditions
Is=100mA, VGS=0V
*Pulsed
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© 2011 ROHM Co., Ltd. All rights reserved.
2/5
2011.09 - Rev.A
Data Sheet
RU1C002UN
Electrical characteristics
DRAIN CURRENT : ID[A]
0.4
VGS= 1.5V
0.3
VGS= 1.3V
0.2
VGS= 1.2V
VGS= 4.5V
VGS= 2.5V
VGS= 1.8V
0.1
0
0.4
VGS= 1.3V
0.3
VGS= 1.2V
0.2
VGS= 1.5V
0.1
Ta=25°C
Pulsed
0
0.2
0.4
0.6
0.8
1
0
2
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.1 Typical Output Characteristics( Ⅰ)
6
8
1000
100
0.001
0.01
0.1
1
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
VGS= 1.2V
VGS= 1.5V
VGS= 1.8V
VGS= 2.5V
VGS= 4.0V
Ta= 25°C
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
1000
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
100
0.001
0.01
0.1
1
DRAIN-CURRENT : ID[A]
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅲ)
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0.5
1.0
GATE-SOURCE VOLTAGE : VGS (V)
Fig.2 Typical Output Characteristics( Ⅱ)
Fig.3 Typical transfer characteristics
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
1000
1.5
VGS= 2.5V
Pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
1000
100
0.001
0.01
0.1
1
100
0.001
0.01
0.1
1
DRAIN-CURRENT : ID[A]
DRAIN-CURRENT : ID[A]
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅱ)
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅱ)
10000
VGS= 1.8V
Pulsed
0.0001
10000
DRAIN-CURRENT : ID[A]
10000
Ta=125°C
75°C
25°C
−25°C
0.001
DRAIN-SOURCE VOLTAGE : VDS[V]
VGS= 4.0V
Pulsed
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅰ)
0.01
0.00001
0.0
10
10000
10000
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
4
0.1
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
0
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
1 VDS=10V
Pulsed
VGS= 2.5V
VGS= 1.8V
10000
VGS= 1.5V
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
DRAIN CURRENT : ID[A]
0.5
Ta=25°C
Pulsed
DRAIN CURRENT : ID (A)
0.5
1000
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
100
0.001
0.01
0.1
1
DRAIN-CURRENT : ID[A]
Fig.8 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅳ)
3/5
VGS= 1.2V
Pulsed
1000
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
100
0.001
0.01
0.1
1
DRAIN-CURRENT : ID[A]
Fig.9 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅴ)
2011.09 - Rev.A
Data Sheet
RU1C002UN
1
SOURCE CURRENT : IS (A)
FORWARD TRANSFER
ADMITTANCE : |Yfs| [S]
VDS= 10V
Pulsed
Ta= -25°C
Ta=25°C
Ta=75°C
Ta=125°C
0.1
0.01
0.1
Ta=125°C
75°C
25°C
−25°C
0.1
0.01
0.0
1
2.5
VGS=0V
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[Ω]
1
0.5
1
1.5
SOURCE-DRAIN VOLTAGE : VSD (V)
DRAIN-CURRENT : ID[A]
100
Ta=25°C
VDD=10V
VGS=4V
RG=10Ω
Pulsed
CAPACITANCE : C (pF)
SWITHING TIME : t (ns)
1000
100
td(off)
tf
td(on)
10
ID= 0.02A
1.5
1
0.5
0
0
2
4
6
8
GATE-SOURCE VOLTAGE : VGS[V]
Fig.11 Source current vs.
source-drain voltage
Fig.10 Forward Transfer Admittance
vs. Drain Current
Ta=25°C
Pulsed
ID= 0.2A
2
Fig.12 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
Ta=25°C
f=1MHZ
VGS=0V
Ciss
Coss
10
Crss
tr
1
0.01
0.1
1
DRAIN CURRENT : ID (A)
Fig.13 Switching characteristics
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© 2011 ROHM Co., Ltd. All rights reserved.
1
0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS (V)
Fig.14 Typical capacitance vs.
drain-source voltage
4/5
2011.09 - Rev.A
Data Sheet
RU1C002UN
 Measurement circuits
Pulse width
VGS
ID
VDS
RL
50%
10%
D.U.T.
RG
90%
50%
10%
VGS
VDS
VDD
90%
td(on)
tr
ton
Fig.1-1 Switching Time Measurement Circuit
10%
90%
td(off)
tf
toff
Fig.1-2 Switching Waveforms
 Notice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
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© 2011 ROHM Co., Ltd. All rights reserved.
5/5
2011.09 - Rev.A
Notice
Notes
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http://www.rohm.com/contact/
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© 2011 ROHM Co., Ltd. All rights reserved.
R1120A