NSR20F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package (CSP) to reduce board space. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. http://onsemi.com Features • • • • • • • Very Low Forward Voltage Drop − 480 mV @ 2.0 A Low Reverse Current − 20 mA @ 10 V VR 2.0 A of Continuous Forward Current Power Dissipation of 665 mW with Minimum Trace ESD Rating − Human Body Model: Class 3B ESD Rating − Machine Model: Class C Very High Switching Speed These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 30 V SCHOTTKY BARRIER DIODE 1 CATHODE 2 MARKING DIAGRAM PIN 1 Typical Applications • • • • • 2 ANODE 1 LCD and Keypad Backlighting Camera Photo Flash Buck and Boost dc−dc Converters Reverse Voltage and Current Protection Clamping & Protection 20F30 YYY DSN2 (0603) CASE 152AB 20F30 YYY = Specific Device Code = Year Code Markets • • • • • Mobile Handsets MP3 Players Digital Camera and Camcorders Notebook PCs & PDAs GPS ORDERING INFORMATION Device NSR20F30NXT5G MAXIMUM RATINGS Rating Symbol Value Unit Reverse Voltage VR 30 V Forward Current (DC) IF 2.0 A Forward Surge Current ESD Rating: (60 Hz @ 1 cycle) Human Body Model Machine Model IFSM ESD Package Shipping† DSN2 5000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. A 28 >8 > 400 kV V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2010 July, 2010 − Rev. 2 1 Publication Order Number: NSR20F30/D NSR20F30NXT5G THERMAL CHARACTERISTICS Characteristic Max Unit RqJA PD 213 586 °C/W mW Thermal Resistance Junction−to−Ambient (Note 2) Total Power Dissipation @ TA = 25°C RqJA PD 80 1.56 °C/W W Storage Temperature Range Tstg −40 to +125 °C Junction Temperature TJ +150 °C Max Unit Thermal Resistance Junction−to−Ambient (Note 1) Total Power Dissipation @ TA = 25°C Symbol Min Typ 1. Mounted onto a 4 in square FR−4 board 50 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state. 2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Characteristic Reverse Leakage (VR = 10 V) (VR = 30 V) IR Forward Voltage (IF = 1.0 A) (IF = 2.0 A) VF IR, REVERSE CURRENT (mA) IF, FORWARD CURRENT (A) TJ = 125°C TJ = 150°C 0.1 0.01 75°C 0.1 25°C 0.2 −25°C 0.4 0.3 150°C 1000 125°C 100 75°C 10 25°C 1 0.1 −25°C 0.01 0 5 10 TA = 25°C 400 350 300 250 200 150 100 50 5 20 25 Figure 2. Typical Reverse Current 450 0 15 VR, REVERSE VOLTAGE (V) Figure 1. Forward Voltage 0 V 0.42 0.48 10000 0.001 0.5 mA 20 150 VF, FORWARD VOLTAGE (V) C, CAPACITANCE (pF) 0.001 0.0 Typ 100000 10 1 Min 10 15 20 VR, REVERSE VOLTAGE (V) Figure 3. Typical Capacitance http://onsemi.com 2 25 30 30 NSR20F30NXT5G PACKAGE DIMENSIONS DSN2, 1.6x0.8, 0.9P, (0603) CASE 152AB−01 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 0.05 C A B D DIM A A1 b D E L L2 L3 E 0.05 C TOP VIEW 0.05 C A 0.05 C A1 C SIDE VIEW CATHODE BAND MONTH CODING SEATING PLANE DEC NOV OCT SEP 0.05 C A B L L/2 MILLIMETERS MIN MAX 0.25 0.31 −−− 0.05 0.55 0.65 1.60 BSC 0.80 BSC 1.45 1.55 0.90 1.00 0.25 0.35 XXXX YYY JUN b 1 MAR FEB JAN 0.05 C A B L2 L3 XXXX Y09 BOTTOM VIEW MOUNTING FOOTPRINT* 1.70 DEVICE CODE YEAR CODE (EXAMPLE) INDICATES AUG 2009 0.52 0.80 PIN 1 0.70 1.05 DIMENSIONS: MILLIMETERS See Application Note AND8398/D for more mounting details *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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