X RP 2 9 9 7 2 A D D R I / I I / I I I B u s Te r m i n a t i o n Re g u l a t o r October 2012 Rev. 1.2.0 GENERAL DESCRIPTION APPLICAT IONS The XRP2997 is a Double Data Rate (DDR) termination voltage regulator supporting all power requirements of DDR I, II and III memories and is capable of sinking or sourcing 2A continuously. x DDR I/II/III Memory Termination x Active Termination Buses x Audio - Video Equipments x Video - Graphics Cards Tightly regulating its output voltage within ±2 0mV, the XRP2997 converts input voltages as low as 1.1V while the output voltage is adjustable through an external resistor divider or by forcing the V REF pin vo ltage. It maintains a fast line and load transient response and only requires an output capacit ance of 22µF to operate. An enable function via an external MOSFET and a soft start feature allow for a controlled implementation of power - up sequencing . FEATURES x DDR1, DDR2 and DDR3 Support 0.75V TT Generation ±20mV Output Voltage Offset x 2 Amps Continuous Current Sourcing & Sinking 1.1V to 5.5V Wide Inp ut Voltage Range x Adjustable Output Voltage Built - in source/sink over current, over temperature and under - voltage lockout pr otection s insure safe o peration under abnormal operating conditions. x Suspend to RAM(STR), Enable & Soft Start Functions x Stable with 22 µF Ceramic Capacitor The XRP2997 meets JEDEC SSTL - 2, SSTL -18, HSTL, SCSI -1 and SCSI -3 specifications for DDR S DRAM memories. x UVLO, Over Temperature and Over Current Protections The XRP2997 is offered in a RoHS compliant, ³JUHHQ´KDORJHQ free 8 - pin Exposed Pad SOIC package. x Pin/Function Compatible TYPICAL APPLICATION x Minimal External Components with SP2996B x RoHS Comp OLDQW³*UHHQ´+DORJHQ 8 - Pin SOIC Packag e DIAGRAM Fig. 1: XRP2997 DDRIII V Exar Corporation 48720 Kato Road, Fremont CA 94538, USA TT Application Diagram www.exar.com Tel. +1 510 668 - 70 00 ±Fax. +1 510 668 - 70 01 X RP 2 9 9 7 2 A D D R I / I I / I I I B u s Te r m i n a t i o n Re g u l a t o r ABSOLUTE MAXIMUM RAT INGS OPERATING RATINGS These are stress ratings only and functional operation o the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. f Operating Temperature Range ................. 7KHUPDO5HVLVWDQFHLJ JA ................................ 7KHUPDO5HVLVWDQFHLJ JC ................................ - 40°C to +85 °C ...... 60 °C/W ...... 16 °C/W VIN , V REF, V CNTL ................................ .......... - 0. 3V to 6.0V Junction Temperature Range .................. - 40°C to +1 50 °C Storage Temperature ............................ - 65°C to + 150°C Lead Temperature (Soldering, 10 sec) .................... 260 °C ELECTRICAL SPECIFICA TIONS Specifications are for an Operating Ambient Temperature of T A = 25°C only; limits applying over the full Operating Junction 7HPSHUDWXUHUDQJHDUHGHQRWHGE\D³´0LQLPXPDQG0D[LPXPOLPLWVDUH r statistical correlation. Typical values represent the most likely parametric norm at T A = 25°C, and are provided for reference purposes only. Unless otherwise indicated, V IN = 1.8V/ 1.5 V, V CNTL = 3.3 V, V REF = 0.5x V IN , COUT = 22 µF (ceramic) , T A = 25 °C. Para meter VIN , Input Voltage Range VCNTL, Input Voltage Range Min. Typ. Max. 1. 1 1.8 /1. 5 5.5 V Keep V CNTL9IN during power on and power off sequences (note 4) 2.375 3.3 5.5 V Keep V CNTL9IN during power on and power off sequences (not e 4) V I OUT = 0mA - 20 +20 mV I OUT = 0mA (note 1) - 20 +20 mV I OUT = 0.1mA to +2A - 20 +20 mV I OUT = 0.1mA to 2 90 µA VREF < 0.2V, V 1 2.5 mA I OUT = 0mA 1 µA VREF = 1.25V VOUT, Output Voltage VOS, Output Voltage VREF Offset οVLOR, Load Regulation I Q, Quiescent Current I CNTL, Operating Current of V I REF, Bias Current of V REF I IL , Current Limit CNTL 0 2. 4 RDSCHG , Output Discharge Resistance Units Conditions - 2A OUT = OFF A Source: V OUT=0.33xV REF Sink: V OUT=0.95xV IN (n ote 3 ) VREF=0V, V 160 °C 99 CNTL 9JXDUDQWHHGE\GH (note 4) 30 °C Guaranteed by design 3 18 25 OUT= 0.3V Thermal Protection TSD , Thermal Shutdown Temperature Thermal Shutdown Hysteresis Shutdown Specifications 0. 6 VTRIGGER , Shutdown Threshold V 0.2 Output ON VREF = 0V Æ 1.25V Output OFF VREF = 1.25V Note 1: VOS offset is the voltage measurement defined as V OUT subtracted from V REF. Note 2: Load regulation is measured at constant junction temperature, using pulse testing with a Note 3: Current limit is measured by applying a short duration current pulse . Note 4: In order to safely operate your system, V CNTL must be > V IN . © 2012 Exar Corporation 2/ 8 Æ 0V short ON time. Rev. 1.2.0 X RP 2 9 9 7 2 A D D R I / I I / I I I B u s Te r m i n a t i o n Re g u l a t o r BLOCK DIAGRAM Fig. 2: XRP2997 Block Diagram PIN ASSIGNMENT Fig. 3: XRP2997 Pin Assignment PIN DESCRIPTION Name Pin Number 1 2 Exposed Pad VIN GND Description Power Input Voltage Ground Signal 3 Reference Input Voltage. This input can also be used as an enable signal; pulling this pin low shuts down the XRP2997. Refer to typical application circuit. VOUT 4 Output Voltage NC 5, 7, 8 VCNTL 6 VREF NC Voltage for the driver circuit and all analog blocks ORDERING INFORMATION Part Number XRP2997ID BTR- F ³<<´ Temperature Range - &7 A& <HDU ±³::´ © 2012 Exar Corporation Marking XRP2997I YYWWF XXXXXX Package Packing Quantity Exposed pad SOIC - 8 2.5 K/Tape & Reel :RUN:HHN ±³ L´Lead Free Indicator - ³;´ 3/ 8 Note 1 Note 2 RoHS Compliant Halogen Free /RW1XPEHUZKHQDSSOLFDEOH Rev. 1.2.0 X RP 2 9 9 7 2 A D D R I / I I / I I I B u s Te r m i n a t i o n Re g u l a t o r TYPICAL PERFORMANCE CHARACTERISTICS All data t aken at VIN = 1.8 V/1.5V , V CNTL = 3.3 V, VREF = 0.5x VIN , COUT = 22 µF (ceramic) , T A= 25 °C , unless otherwise specified - Schematic and BOM from Application Information section of this datasheet. Fig. 4: Turn on and turn off Fig. 6: Current Fig. 5: Output Voltage vs . Temper ature Fig. 7: Current limit (sinking) vs limit ( sourcing ) vs . Temperature © 2012 Exar Corporation vs . Temperature 4/ 8 . Temperature Rev. 1.2.0 X RP 2 9 9 7 2 A D D R I / I I / I I I B u s Te r m i n a t i o n Re g u l a t o r Fig. 8: VIN =1.5V, V REF=0.75V Fig. 10 : VIN =2.5V, V Fig. 9: VIN =1.8V, V © 2012 Exar Corporation REF=1.2 source response Fig. 9: V 5V source response REF=0.9V sink response 5/ 8 IN =1.8V, V REF=0.9V source response Fig. 11 : VIN =1.5V, V REF=0.75V sink response Fig. 10 : VIN =2.5V, V REF=1.25V sink response Rev. 1.2.0 X RP 2 9 9 7 2 A D D R I / I I / I I I B u s Te r m i n a t i o n Re g u l a t o r Fig. 14: V IN =1.5V, V REF=0.75V Fig. 11 : VIN =2.5V, V REF=1.25V Fig. 13 : V IN =1.8V, V © 2012 Exar Corporation Fig. 15: V source short circuit source short cir REF=0.9V cuit s ink short circuit 6/ 8 IN =1.8V, V REF=0.9V source short circuit Fig. 12 : VIN =1.5V, V REF=0.75V sink short circuit Fig. 14 : V IN =2.5V, V REF=1.25V sink short circuit Rev. 1.2.0 X RP 2 9 9 7 2 A D D R I / I I / I I I B u s Te r m i n a t i o n Re g u l a t o r APPLICATION INFORMAT ION recommended for optimum transient response pe rformance. I NPUT CAPACITOR CIN L AYOUT CONSIDERATIONS Select the input capacitor CIN for voltage The XRP299 7 is offered in the 8 - pin exposed rating, RMS current rating and capacitance. pad SOIC package in order to facilitate power The voltage rating should be at least 50% dissipation (heat dissipation) . Power KLJKHU WKDQ WKH UHJXODWRU¶V PD[LPXP LQSXW dissipation can be maximized by soldering the voltage. The value o f this capacitor , its charge, exposed pad to a large land area on top layer should be select ed in order to be able to of PCB and by using vias to connect the supply enough current to the XRP2997 in the exposed pad to an interlayer (s) or bottom event of a transient increase of source current layer. All capacitors should be placed as close required. A minimum value of 10 µF is advised as possible to the respective pins. while a recomm ended value of 47 µF is PACKAGE SPECIFICATIO N 8 - P IN SOIC EXPOSED P AD Unit: mm (inch) Eject hole, oriented hole and mold mark are optional. © 2012 Exar Corporation 7/ 8 Rev. 1.2.0 X RP 2 9 9 7 2 A D D R I / I I / I I I B u s Te r m i n a t i o n Re g u l a t o r REVISION HISTORY Revision Date Description 1.0.0 07 / 22 /2011 Initial release of datasheet 1.1.0 01/09/201 2 Corrected part number in ordering information 1.1.1 03/29/2012 Corrected turn on threshold from 0.8V to 0.6V. Typographical error. 1.2.0 10/29/2012 Reformat of datasheet Updated typical application schematics (figure 1) Addition of CIN selection under Application Informat FOR FURTHER ASSISTAN Email: ion section CE [email protected] [email protected] Exar Technical Documentation: http://www.exar.com/TechDoc/default.aspx? EXAR CORPORATION H EADQUARTERS AND SALES O FFICES 48720 Kato Road Fremont, CA 94538 ±USA Tel.: +1 (510) 668 - 7000 Fax: +1 (510) 668 -7030 www.exar.com NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corpor ation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Char ts and schedules contained here in are only for illustration purposes and may vary depending upon a XVHU¶VVSHFLILFDSSOLFDWLRQ:KLOHWKHLQIRUPDWLRQLQWKLVSXEOLFDWLRQ , is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writi ng, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Reproduction, in part or whole, © 2012 Exar Corporation or its without the prior written consent of EXAR Corporation is prohibited. 8/ 8 Rev. 1.2.0