AOK42S60 600V 39A α MOS TM Power Transistor General Description TM The AOK42S60 has been fabricated using the advanced αMOS high voltage process that is designed to deliver high levels of performance and robustness in switching applications. By providing low RDS(on), Qg and EOSS along with guaranteed avalanche capability this device can be adopted quickly into new and existing offline power supply designs. Features VDS @ Tj,max 700V IDM 166A RDS(ON),max 0.099Ω Qg,typ 40nC Eoss @ 400V 9.2µJ D G S Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage Continuous Drain Current VGS TC=25°C TC=100°C IDM ±30 V 25 A 166 Avalanche Current C IAR 11 A Repetitive avalanche energy C EAR 234 mJ Single pulsed avalanche energy G TC=25°C Power Dissipation B Derate above 25oC MOSFET dv/dt ruggedness Peak diode recovery dv/dt H Junction and Storage Temperature Range EAS 1345 mJ PD dv/dt TJ, TSTG Maximum lead temperature for soldering purpose, 1/8" from case for 5 seconds J TL Thermal Characteristics Parameter Maximum Junction-to-Ambient A,D Symbol RθJA Maximum Case-to-sink A Maximum Junction-to-Case 1/6 Units V 39 ID Pulsed Drain Current C AOK42S60 600 RθCS RθJC 417 W 3.3 100 20 -55 to 150 W/ oC 300 °C AOK42S60 Units V/ns °C 40 °C/W 0.5 0.3 °C/W °C/W www.freescale.net.cn AOK42S60 600V 39A α MOS TM Power Transistor Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units ID=250µA, VGS=0V, TJ=25°C 600 - - ID=250µA, VGS=0V, TJ=150°C 650 700 - V µA STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS Zero Gate Voltage Drain Current VDS=600V, VGS=0V - - 1 VDS=480V, TJ=150°C - 10 - IGSS Gate-Body leakage current VDS=0V, VGS=±30V - - ±100 VGS(th) Gate Threshold Voltage VDS=5V,ID=250µA 2.5 3.2 3.8 nΑ V RDS(ON) Static Drain-Source On-Resistance VSD Diode Forward Voltage VGS=10V, ID=21A, TJ=25°C - 0.085 0.099 Ω VGS=10V, ID=21A, TJ=150°C - 0.24 0.28 Ω IS=21A,VGS=0V, TJ=25°C - 0.84 - V IS Maximum Body-Diode Continuous Current - - 39 A ISM Maximum Body-Diode Pulsed Current - - 166 A - 2154 - pF - 135 - pF - 103 - pF - 344 - pF VGS=0V, VDS=100V, f=1MHz - 2.7 - pF VGS=0V, VDS=0V, f=1MHz - 1.7 - Ω DYNAMIC PARAMETERS Input Capacitance Ciss Coss Output Capacitance Co(er) Effective output capacitance, energy related H Crss Effective output capacitance, time related I Reverse Transfer Capacitance Rg Gate resistance Co(tr) VGS=0V, VDS=100V, f=1MHz VGS=0V, VDS=0 to 480V, f=1MHz SWITCHING PARAMETERS Total Gate Charge Qg Qgs Gate Source Charge VGS=10V, VDS=480V, ID=21A - 40 - nC - 11.7 - nC Qgd Gate Drain Charge - 11.9 - nC tD(on) Turn-On DelayTime - 38.5 - ns tr Turn-On Rise Time - 53 - ns tD(off) Turn-Off DelayTime - 136 - ns tf trr Turn-Off Fall Time - 46 - ns VGS=10V, VDS=400V, ID=21A, RG=25Ω IF=21A,dI/dt=100A/µs,VDS=400V - 473 - ns IF=21A,dI/dt=100A/µs,VDS=400V - 38.5 - Body Diode Reverse Recovery Charge IF=21A,dI/dt=100A/µs,VDS=400V - 10.5 - A µC Irm Body Diode Reverse Recovery Time Peak Reverse Recovery Current Qrr A. The value of R θJA is measured with the device in a still air environment with T A =25°C. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g. G. L=60mH, IAS=6.7A, VDD=150V, Starting TJ=25°C H. Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V(BR)DSS. I. Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% V(BR)DSS. J. Wavesoldering only allowed at leads. 2/6 www.freescale.net.cn AOK42S60 600V 39A α MOS TM Power Transistor TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 60 80 10V 10V 70 7V 50 60 6V ID (A) ID (A) 50 6V 7V 40 40 5.5V 30 5.5V 30 5V 20 20 10 5V VGS=4.5V 10 VGS=4.5V 0 0 0 5 10 15 0 20 5 VDS (Volts) Figure 1: On-Region Characteristics@25°C 1000 20 0.30 0.25 100 125°C RDS(ON) (Ω ) 0.20 ID(A) 10 1 25°C 0.1 VGS=10V 0.15 0.10 0.05 0.00 0.01 2 3 4 5 6 7 8 9 0 10 15 30 45 60 75 90 ID (A) Figure 4: On-Resistance vs. Drain Current and Gate Voltage VGS(Volts) Figure 3: Transfer Characteristics 1.2 3 2.5 VGS=10V ID=21A BVDSS (Normalized) Normalized On-Resistance 15 -55°C VDS=20V 2 1.5 1 1.1 1 0.9 0.5 0 -100 -50 0 50 100 150 Temperature (°C) Figure 5: On-Resistance vs. Junction Temperature 3/6 10 VDS (Volts) Figure 2: On-Region Characteristics@125°C 200 0.8 -100 -50 0 50 100 150 200 TJ (oC) Figure 6: Break Down vs. Junction Temperature www.freescale.net.cn AOK42S60 600V 39A α MOS TM Power Transistor TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 1.0E+02 15 125°C 1.0E+01 12 VDS=480V ID=21A 1.0E+00 25°C VGS (Volts) IS (A) 1.0E-01 1.0E-02 1.0E-03 9 6 3 1.0E-04 1.0E-05 0.0 0.2 0.4 0.6 0.8 0 1.0 0 VSD (Volts) Figure 7: Body-Diode Characteristics (Note E) 15 30 45 60 Qg (nC) Figure 8: Gate-Charge Characteristics 10000 20 Ciss 16 Eoss(uJ) Capacitance (pF) 1000 Coss 100 Eoss 12 8 Crss 10 4 0 1 0 100 200 300 400 500 VDS (Volts) Figure 9: Capacitance Characteristics 600 0 100 200 300 400 VDS (Volts) Figure 10: Coss stroed Energy 500 600 1000 ID (Amps) 100 10µs RDS(ON) limited 10 100µs 1ms 10ms 1s 1 DC TJ(Max)=150°C TC=25°C 0.1 0.01 0.1 1 10 VDS (Volts) 100 1000 Figure 11: Maximum Forward Biased Safe Operating Area for AOK42S60(Note F) 4/6 www.freescale.net.cn AOK42S60 600V 39A α MOS TM Power Transistor TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 1500 40 35 Current rating ID(A) EAS(mJ) 1200 900 600 300 30 25 20 15 10 5 0 0 25 50 75 100 125 150 175 0 TCASE (°C) Figure 12: Avalanche energy 25 50 75 100 125 TCASE (°C) Figure 13: Current De-rating (Note B) 150 Zθ JC Normalized Transient Thermal Resistance 10 1 In Indescending descendingorder order D=0.5, D=0.5,0.3, 0.3,0.1, 0.1,0.05, 0.05,0.02, 0.02,0.01, 0.01,single singlepulse pulse D=Ton on/T TJ,PK J,PK=TC C+PDM DM.ZθJC θJC.RθJC θJC RθJC =0.3°C/W θJC=2.5°C/W 0.1 PD 0.01 Ton T Single Pulse Pulse Single 0.001 0.000001 0.00001 0.00001 0.0001 0.0001 0.001 0.001 0.01 0.01 0.1 0.1 1 10 1 100 10 Pulse Pulse Width Width (s) (s) Figure 14: 15: Normalized Maximum Transient Thermal Impedance for AOK42S60(Note AOTF42S60(NoteF)F) 5/6 www.freescale.net.cn AOK42S60 600V 39A α MOS TM Power Transistor Gate Charge Test Circuit & Waveform Vgs Qg 10V + + Vds VDC - Qgs Qgd VDC DUT - Vgs Ig Charge Res istive Switching Test Circuit & Waveforms RL Vds Vds DUT Vgs + VDC 90% Vdd - Rg 10% Vgs Vgs t d(on) tr t d(off) t on tf t off Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L EAR= 1/2 LI Vds 2 AR BVDSS Vds Id + Vdd Vgs Vgs I AR VDC - Rg Id DUT Vgs Vgs Diode Recovery Tes t Circuit & Waveforms Qrr = - Idt Vds + DUT Vgs Vds - Isd Vgs Ig 6/6 L Isd + VDC - IF trr dI/dt IRM Vdd Vdd Vds www.freescale.net.cn