8 Bit Microcontroller 870C Series TMP86FS49FG TMP86FS49FG The information contained herein is subject to change without notice. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. The Toshiba products listed in this document are intended for usage in general electronics applications ( computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed in this document shall be made at the customer’s own risk. The products described in this document may include products subject to the foreign exchange and foreign trade laws. TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. For a discussion of how the reliability of microcontrollers can be predicted, please refer to Section 1.3 of the chapter entitled Quality and Reliability Assurance/Handling Precautions. © 2004 TOSHIBA CORPORATION All Rights Reserved Page 2 TMP86FS49FG TENTATIVE CMOS 8-Bit Microcontroller TMP86FS49FG Product No. FLASH RAM PACKAGE Mask MCU TMP86FS49FG 60K bytes 2K bytes P-QFP64-1414-0.80A TMP86CH49/CM49 1.1 Features 1. 8-bit single chip microcomputer TLCS-870/C series - Instruction execution time : 0.25 µs (at 16 MHz) 122 µs (at 32.768 kHz) - 132 types & 731 basic instructions 2. 24interrupt sources (External : 5 Internal : 19) 3. Input / Output ports (56pins) 4. Time Base Timer 5. Watchdog Timer 6. 16-bit timer counter: 1 ch - Timer, External trigger, Window, Pulse width measurement, Event counter, PPG(Programmable Pulse Generator) output modes 7. 16-bit timer counter : 1ch - Timer, Event counter, Window modes 8. 8-bit timer counter : 4ch Timer, Event counter, PWM(Pulse width modulation) output, PDO(Programmable Divider Output) output and PPG(Programmable Pulse Generator) modes 9. 8-bit UART: 2ch 10. High-Speed SIO: 2ch 11. Serial Bus Interface(I2C Bus): 1ch This product uses the Super Flash technology under the licence of Sillicon Storage Technology,Inc. Super Flash is registered trademark of Sillicon Storage Technology,Inc. Purchase of TOSHIBA I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. 030619EBP1 • The information contained herein is subject to change without notice. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,”or “TOSHIBA Semiconductor Reliability Handbook”etc.. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. • The products described in this document are subject to the foreign exchange and foreign trade laws. • TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. • For a discussion of how the reliability of microcontrollers can be predicted, please refer to Section 1.3 of the chapter entitled Quality and Reliability Assurance/Handling Precautions. Page 1 1.1 Features TENTATIVE TMP86FS49FG 12. 10-bit successive approximation type AD converter Analog inputs: 16ch 13. Key On Wake Up : 4ch 14. Clock operation Single clock mode Dual clock mode 15. Low power consumption operation STOP mode: Oscillation stops. (Battery/Capacitor back-up.) SLOW1 mode: Low power consumption operation using low-frequency clock.(High-frequency clock stop.) SLOW2 mode: Low power consumption operation using low-frequency clock.(High-frequency clock oscillate.) IDLE0 mode: CPU stops, and only the Time-Based-Timer(TBT) on peripherals operate using high frequency clock. Release by falling edge of the source clock which is set by TBTCR<TBTCK>. IDLE1 mode: CPU stops and peripherals operate using high frequency clock. Release by interruputs(CPU restarts). IDLE2 mode: CPU stops and peripherals operate using high and low frequency clock. Release by interruputs. (CPU restarts). SLEEP0 mode: CPU stops, and only the Time-Based-Timer(TBT) on peripherals operate using low frequency clock.Release by falling edge of the source clock which is set by TBTCR<TBTCK>. SLEEP1 mode: CPU stops, and peripherals operate using low frequency clock. Release by interruput.(CPU restarts). SLEEP2 mode: CPU stops and peripherals operate using high and low frequency clock. interruput. 16. Wide operation voltage: 4.5 V~5.5 V at 16.0MHz /32.768 kHz 3.0 V~3.6 V at 8 MHz /32.768 kHz Page 2 Release by TMP86FS49FG TENTATIVE 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 RESET (STOP/INT5) P20 (INT0) P00 (BOOT/RxD1) P01 (TxD1) P02 (INT1) P03 (SI1) P04 (SO1) P05 (SCK1) P06 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 VSS XIN XOUT TEST VDD (XTIN) P21 (XTOUT) P22 (INT3/TC2) P15 (PDO5/PWM5/TC5) P16 (PDO6/PWM6/PPG6/TC6) P17 (SCL) P50 (SDA) P51 P52 P53 P54 P30 P31 P32 P33 P34 P35 P36 P37 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 P14 (TC4/PDO4/PWM4/PPG4) P13 (TC3/PDO3/PWM3) P12 (PPG) P11 (DVO) P10 (TC1) P47 P46 (SCK2) P45 (SO2) P44 (SI2) P43 P42 (TxD2) P41 (RxD2) P40 P77 (AIN17) P76 (AIN16) P75 (AIN15) 1.2 Pin Assignment Figure 1-1 Pin Assignment Page 3 P74(AIN14) P73(AIN13) P72(AIN12) P71(AIN11) P70(AIN10) P67(AIN07/STOP3) P66(AIN06/STOP2) P65(AIN05/STOP1) P64(AIN04/STOP0) P63(AIN03) P62(AIN02) P61(AIN01) P60(AIN00) AVDD VAREF P07(INT2) 1.3 Block Diagram TENTATIVE 1.3 Block Diagram Figure 1-2 Block Diagram Page 4 TMP86FS49FG TMP86FS49FG TENTATIVE 1.4 Pin Names and Functions Table 1-1 Pin Names and Functions（1/3） Pin Name P07 INT2 Pin Number Input/Output Functions 17 IO I PORT07 External interrupt 2 input 16 IO IO PORT06 Serial clock input/output 1 P05 SO1 15 IO O PORT05 Serial data output 1 P04 SI1 14 IO I PORT04 Serial data input 1 P03 INT1 13 IO I PORT03 External interrupt 1 input P02 TxD1 12 IO O PORT02 UART data output 1 P01 RxD1 BOOT 11 IO I I PORT01 UART data input 1 Serial PROM mode control input 10 IO I PORT00 External interrupt 0 input 51 IO I O PORT17 Timer counter 6 input PDO6/PWM6/PPG6 output 50 IO I O PORT16 Timer counter 5 input PDO5/PWM5 output 49 IO I I PORT15 Timer counter 2 input External interrupt 3 input 48 IO I O PORT14 Timer counter 4 input PDO4/PWM4/PPG4 output 47 IO I O PORT13 Timer counter 3 input PDO3/PWM3 output 46 IO I PORT12 PPG Output 45 IO O PORT11 Divider output P10 TC1 44 IO I PORT10 Timer counter 1 input P22 XTOUT 7 IO O PORT22 Resonator connecting pins(32.768kHz) for inputting external clock P21 XTIN 6 IO I PORT21 Resonator connecting pins(32.768kHz) for inputting external clock 9 IO I I PORT20 External interrupt 5 input STOP mode release signal input P06 SCK1 P00 INT0 P17 TC6 PDO6/PWM6/PPG6 P16 TC5 PDO5/PWM5 P15 TC2 INT3 P14 TC4 PDO4/PWM4/PPG4 P13 TC3 PDO3/PWM3 P12 PPG P11 DVO P20 INT5 STOP Page 5 1.4 Pin Names and Functions TMP86FS49FG TENTATIVE Table 1-1 Pin Names and Functions（2/3） Pin Name Pin Number Input/Output Functions P37 64 IO PORT37 P36 63 IO PORT36 P35 62 IO PORT35 P34 61 IO PORT34 P33 60 IO PORT33 P32 59 IO PORT32 P31 58 IO PORT31 P30 57 IO PORT30 P47 43 IO PORT47 42 IO IO PORT46 Serial clock input/output 2 P45 SO2 41 IO O PORT45 Serial data output 2 P44 SI2 40 IO I PORT44 Serial data input 2 P43 39 IO PORT43 P42 TxD2 38 IO O PORT42 UART data output 2 P41 RxD2 37 IO I PORT41 UART data input 2 P40 36 IO PORT40 P54 56 IO PORT54 P53 55 IO PORT53 P52 54 IO PORT52 P51 SDA 53 IO IO PORT51 I2C bus serial data input/output P50 SCL 52 IO IO PORT50 I2C bus serial clock input/output P67 AIN07 STOP3 27 IO I I PORT67 AD converter analog input 7 STOP3 input P66 AIN06 STOP2 26 IO I I PORT66 AD converter analog input 6 STOP2 input P65 AIN05 STOP1 25 IO I I PORT65 AD converter analog input 5 STOP1 input P64 AIN04 STOP0 24 IO I I PORT64 AD converter analog input 4 STOP0 input P63 AIN03 23 IO I PORT63 AD converter analog input 3 P62 AIN02 22 IO I PORT62 AD converter analog input 2 P46 SCK2 Page 6 TMP86FS49FG TENTATIVE Table 1-1 Pin Names and Functions（3/3） Pin Name Pin Number Input/Output Functions P61 AIN01 21 IO I PORT61 AD converter analog input 1 P60 AIN00 20 IO I PORT60 AD converter analog input 0 P77 AIN17 35 IO I PORT77 AD converter analog input 17 P76 AIN16 34 IO I PORT76 AD converter analog input 16 P75 AIN15 33 IO I PORT75 AD converter analog input 15 P74 AIN14 32 IO I PORT74 AD converter analog input 14 P73 AIN13 31 IO I PORT73 AD converter analog input 13 P72 AIN12 30 IO I PORT72 AD converter analog input 12 P71 AIN11 29 IO I PORT71 AD converter analog input 11 P70 AIN10 28 IO I PORT70 AD converter analog input 10 XIN 2 I Resonator connecting pins for high-frequency clock XOUT 3 O Resonator connecting pins for high-frequency clock RESET 8 I Reset signal input TEST 4 I Test pin for out-going test and the Serial PROM mode control pin. Usually fix to low level. Fix to high level when the Serial PROM mode starts. VAREF 18 I Analog reference voltage input (High) AVDD 19 I AD circuit power supply VDD 5 I +5V VSS 1 I 0(GND) Page 7 1.4 Pin Names and Functions TENTATIVE Page 8 TMP86FS49FG TENTATIVE TMP86FS49FG 2. Operational Description 2.1 CPU Core Functions The CPU core consists of a CPU, a system clock controller, and an interrupt controller. This section provides a description of the CPU core, the program memory, the data memory, and the reset circuit. 2.1.1 Memory Address Map The TMP86FS49FG memory consists of 4 blocks: FLASH, RAM, DBR (Data buffer register) and SFR (Special function register). They are all mapped in 64-Kbyte address space. Figure 2-1 shows the TMP86FS49FG memory address map. The general-purpose registers are not assigned to the RAM address space. 0000H SFR 64 byte 003FH 0040H 2Kbyte RAM FLASH: includes; 083FH RAM: 0F80H SFR: 128byte DBR 0FFFH DBR: Program memory Vector table Random access memory includes: Data memory Stack Special function register includes: I/O ports Peripheral control registers Peripheral status registers System control registers Program status word Databuffer register includes: Peripheral status registers 1000H 60Kbyte FLASH FFA0H FFFFH Figure 2-1 Memory Address Map Page 9 2. Operational Description 2.2 System Clock Controller 2.1.2 TMP86FS49FG TENTATIVE Program Memory (FLASH) The TMP86FS49FG has a 60K × 8 bits (Address 1000H to FFFFH) of program memory (FLASH ). A program code placed on the internal RAM can be excutable when a certain procedure is executed ( See "2.3.2 Address trap reset "). 2.1.3 Data Memory (RAM) Data memory consists of internal data memory (Internal FLASH or RAM). The TMP86FS49FG has 2Kbyte (Address 0040H to 083FH) of internal RAM. The first 192 bytes (0040H to 00FFH) of the internal RAM are located in the direct area; instructions with shorten operations are available against such an area. The data memory contents become unstable when the power supply is turned on; therefore, the data memory should be initialized by an initialization routine. Example :Clears RAM to “00H”. (TMP86FS49FG) SRAMCLR: LD HL, 0040H ; Start address setup LD A, H ; Initial value (00H) setup ; LD BC, 07FFH LD (HL), A INC HL DEC BC JRS F, SRAMCLR 2.2 System Clock Controller The system clock controller consists of a clock generator, a timing generator, and a standby controller. Timing generator control register TBTCR 0036H Clock generator XIN fc High-frequency clock oscillator Timing generator XOUT Standby controller 0038H XTIN Low-frequency clock oscillator SYSCR1 fs System clocks XTOUT Clock generator control Figure 2-2 System Colck Control Page 10 0039H SYSCR2 System control registers TMP86FS49FG TENTATIVE 2.2.1 Clock Generator The clock generator generates the basic clock which provides the system clocks supplied to the CPU core and peripheral hardware. It contains two oscillation circuits: One for the high-frequency clock and one for the low-frequency clock. Power consumption can be reduced by switching of the standby controller to low-power operation based on the low-frequency clock. The high-frequency (fc) clocks and low-frequency (fs) clock can easily be obtained by connecting a resonator between the XIN/XOUT and XTIN/XTOUT pins respectively. Clock input from an external oscillator is also possible. In this case, external clock is applied to XIN/XTIN pin with XOUT/XTOUT pin not connected. Low-frequency clock High-frequency clock XIN XOUT XIN XOUT XTIN XTOUT (Open) (a) Crystal/Ceramic resonator XTIN XTOUT (Open) (c) Crystal (b) External oscillator (d) External oscillator Figure 2-3 Examples of Resonator Connection Note:The function to monitor the basic clock directly at external is not provided for hardware, however, with disabling all interrupts and watchdog timers, the oscillation frequency can be adjusted by monitoring the pulse which the fixed frequency is outputted to the port by the program. The system to require the adjustment of the oscillation frequency should create the program for the adjustment in advance. 2.2.2 Timing Generator The timing generator generates the various system clocks supplied to the CPU core and peripheral hardware from the basic clock (fc or fs). The timing generator provides the following functions. 1. Generation of main system clock 2. Generation of divider output (DVO) pulses 3. Generation of source clocks for time base timer 4. Generation of source clocks for watchdog timer 5. Generation of internal source clocks for timer/counters 6. Generation of warm-up clocks for releasing STOP mode 2.2.2.1 Configuration of timing generator The timing generator consists of a 2-stage prescaler, a 21-stage divider, a main system clock generator, and machine cycle counters. An input clock to the 7th stage of the divider depends on the operating mode, DV7CK (Bit4 in TBTCR), that is shown in Figure 1-5. As reset and STOP mode started/canceled, the prescaler and the divider are cleared to “0”. Page 11 2. Operational Description 2.2 System Clock Controller TMP86FS49FG TENTATIVE fc or fs Main system clock generator Machine cycle counters SYSCK DV7CK High-frequency clock fc 1 2 fc/4 S A Divider Y 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 B Multiplexer Low-frequency clock fs S B0 Multiplexer B1 A0 Y0 A1 Y1 Warm-up controller Watchdog timer Timer/ counters Time base timer Serial interface Divider output circuit Figure 2-4 Configuration of Timing Generator Timing Generator Control Register TBTCR (0036H) 7 6 (DVOEN) DV7CK 5 (DVOCK) 4 3 DV7CK (TBTEN) Selection of input to the 7th stage of the divider 2 1 0 (TBTCK) (Initial value: 0000 0000) 0: fc/28 [Hz] 1: fs R/W Note 1: In single clock mode, do not set DV7CK to “1”. Note 2: Do not set “1” on DV7CK while the low-frequency clock is not operated stably. Note 3: fc: High-frequency clock [Hz], fs: Low-frequency clock [Hz], *: Don’t care Note 4: In SLOW1/2 and SLEEP1/2 modes, the DV7CK setting is ineffective, and fs is input to the 7th stage of the divider. Note 5: When STOP mode is entered from NORMAL1/2 mode, the DV7CK setting is ineffective during the warm-up period after release of STOP mode, and the 6th stage of the divider is input to the 7th stage during this period. 2.2.2.2 Machine cycle Instruction execution and peripheral hardware operation are synchronized with the main system clock. The minimum instruction execution unit is called an “machine cycle”. There are a total of 10 different types of instructions for the TLCS-870/C Series: Ranging from 1-cycle instructions which require one machine cycle for execution to 10-cycle instructions which require 10 machine cycles for execution. A machine cycle consists of 4 states (S0 to S3), and each state consists of one main system clock. Page 12 TMP86FS49FG TENTATIVE 1/fc or 1/fs [s] Main system clock (fm) State S0 S1 S2 S3 S0 S1 S2 S3 Machine cycle Figure 2-5 Machine Cycle 2.2.3 Operation Mode Control Circuit The operation mode control circuit starts and stops the oscillation circuits for the high-frequency and lowfrequency clocks, and switches the main system clock. There are two operating modes: Single clock and dual clock. These modes are controlled by the system control registers (SYSCR1 and SYSCR2). Figure 2-6 shows the operating mode transition diagram. 2.2.3.1 Single-clock mode Only the oscillation circuit for the high-frequency clock is used, and P21 (XTIN) and P22 (XTOUT) pins are used as input/output ports. The main-system clock is obtained from the high-frequency clock. In the single-clock mode, the machine cycle time is 4/fc [s]. (1) NORMAL1 mode In this mode, both the CPU core and on-chip peripherals operate using the high-frequency clock. The TMP86FS49FG is placed in this mode after reset. (2) IDLE1 mode In this mode, the internal oscillation circuit remains active. The CPU and the watchdog timer are halted; however on-chip peripherals remain active (Operate using the high-frequency clock). IDLE1 mode is started by SYSCR2<IDLE>, and IDLE1 mode is released to NORMAL1 mode by an interrupt request from the on-chip peripherals or external interrupt inputs. When the IMF (Interrupt master enable flag) is “1” (Interrupt enable), the execution will resume with the acceptance of the interrupt, and the operation will return to normal after the interrupt service is completed. When the IMF is “0” (Interrupt disable), the execution will resume with the instruction which follows the IDLE1 mode start instruction. (3) IDLE0 mode In this mode, all the circuit, except oscillator and the timer-base-timer, stops operation. This mode is enabled by setting “1” on bit TGHALT on the system control register 2 (SYSCR2). When IDLE0 mode starts, the CPU stops and the timing generator stops feeding the clock to the peripheral circuits other than TBT. Then, upon detecting the falling edge of the source clock selected with TBTCR<TBTCK>, the timing generator starts feeding the clock to all peripheral circuits. Page 13 2. Operational Description 2.2 System Clock Controller TENTATIVE TMP86FS49FG When returned from IDLE0 mode, the CPU restarts operating, entering NORMAL1 mode back again. IDLE0 mode is entered and returned regardless of how TBTCR<TBTEN> is set. When IMF = “1”, EF6 (TBT interrupt individual enable flag) = “1”, and TBTCR<TBTEN> = “1”, interrupt processing is performed. When IDLE0 mode is entered while TBTCR<TBTEN> = “1”, the INTTBT interrupt latch is set after returning to NORMAL1 mode. 2.2.3.2 Dual-clock mode Both the high-frequency and low-frequency oscillation circuits are used in this mode. P21 (XTIN) and P22 (XTOUT) pins cannot be used as input/output ports. The main system clock is obtained from the high-frequency clock in NORMAL2 and IDLE2 modes, and is obtained from the low-frequency clock in SLOW and SLEEP modes. The machine cycle time is 4/fc [s] in the NORMAL2 and IDLE2 modes, and 4/fs [s] (122 ms at fs = 32.768 kHz) in the SLOW and SLEEP modes. The TLCS-870/C is placed in the signal-clock mode during reset. To use the dual-clock mode, the lowfrequency oscillator should be turned on at the start of a program. (1) NORMAL2 mode In this mode, the CPU core operates with the high-frequency clock. On-chip peripherals operate using the high-frequency clock and/or low-frequency clock. (2) SLOW2 mode In this mode, the CPU core operates with the low-frequency clock, while both the high-frequency clock and the low-frequency clock are operated. On-chip peripherals are triggered by the low-frequency clock. As the SYSCK on SYSCR2 becomes “0”, the hardware changes into NORMAL2 mode. As the XEN on SYSCR2 becomes “0”, the hardware changes into SLOW1 mode. Do not clear XTEN to “0” during SLOW2 mode. (3) SLOW1 mode This mode can be used to reduce power-consumption by turning off oscillation of the high-frequency clock. The CPU core and on-chip peripherals operate using the low-frequency clock. Switching back and forth between SLOW1 and SLOW2 modes are performed by XEN bit on the system control register 2 (SYSCR2). In SLOW1 and SLEEP modes, the input clock to the 1st stage of the divider is stopped; output from the 1st to 6th stages is also stopped. (4) IDLE2 mode In this mode, the internal oscillation circuit remain active. The CPU and the watchdog timer are halted; however, on-chip peripherals remain active (Operate using the high-frequency clock and/or the low-frequency clock). Starting and releasing of IDLE2 mode are the same as for IDLE1 mode, except that operation returns to NORMAL2 mode. (5) SLEEP1 mode In this mode, the internal oscillation circuit of the low-frequency clock remains active. The CPU, the watchdog timer, and the internal oscillation circuit of the high-frequency clock are halted; however, on-chip peripherals remain active (Operate using the low-frequency clock). Starting and releasing of SLEEP mode are the same as for IDLE1 mode, except that operation returns to SLOW mode. In SLOW and SLEEP modes, the input clock to the 1st stage of the divider is stopped; output from the 1st to 6th stages is also stopped. Page 14 TMP86FS49FG TENTATIVE (6) SLEEP2 mode The SLEEP2 mode is the idle mode corresponding to the SLOW2 mode. The status under the SLEEP2 mode is same as that under the SLEEP1 mode, except for the oscillation circuit of the highfrequency clock. (7) SLEEP0 mode In this mode, all the circuit, except oscillator and the timer-base-timer, stops operation. This mode is enabled by setting “1” on bit TGHALT on the system control register 2 (SYSCR2). When SLEEP0 mode starts, the CPU stops and the timing generator stops feeding the clock to the peripheral circuits other than TBT. Then, upon detecting the falling edge of the source clock selected with TBTCR<TBTCK>, the timing generator starts feeding the clock to all peripheral circuits. When returned from SLEEP0 mode, the CPU restarts operating, entering SLOW1 mode back again. SLEEP0 mode is entered and returned regardless of how TBTCR<TBTEN> is set. When IMF = “1”, EF6 (TBT interrupt individual enable flag) = “1”, and TBTCR<TBTEN> = “1”, interrupt processing is performed. When SLEEP0 mode is entered while TBTCR<TBTEN> = “1”, the INTTBT interrupt latch is set after returning to SLOW1 mode. 2.2.3.3 STOP mode In this mode, the internal oscillation circuit is turned off, causing all system operations to be halted. The internal status immediately prior to the halt is held with a lowest power consumption during STOP mode. STOP mode is started by the system control register 1 (SYSCR1), and STOP mode is released by a inputting (Either level-sensitive or edge-sensitive can be programmably selected) to the STOP pin. After the warm-up period is completed, the execution resumes with the instruction which follows the STOP mode start instruction. IDLE0 mode IDLE1 mode (a) Single-clock mode Reset release Note 2 SYSCR2<TGHALT> = "1" SYSCR1<STOP> = "1" SYSCR2<IDLE> = "1" NORMAL1 mode Interrupt STOP pin input SYSCR2<XTEN> = "0" SYSCR2<XTEN> = "1" SYSCR2<IDLE> = "1" IDLE2 mode RESET SYSCR1<STOP> = "1" NORMAL2 mode Interrupt STOP pin input SYSCR2<SYSCK> = "0" SYSCR2<SYSCK> = "1" STOP SYSCR2<IDLE> = "1" SLEEP2 mode SLOW2 mode Interrupt SYSCR2<XEN> = "0" SYSCR2<XEN> = "1" SYSCR2<IDLE> = "1" SLEEP1 mode (b) Dual-clock mode SYSCR1<STOP> = "1" SLOW1 mode Interrupt STOP pin input SYSCR2<TGHALT> = "1" Note 2 SLEEP0 mode Note 1: NORMAL1 and NORMAL2 modes are generically called NORMAL; SLOW1 and SLOW2 are called SLOW; IDLE0, IDLE1 and IDLE2 are called IDLE; SLEEP0, SLEEP1 and SLEEP2 are called SLEEP. Page 15 2. Operational Description 2.2 System Clock Controller TMP86FS49FG TENTATIVE Note 2: The mode is released by falling edge of TBTCR<TBTCK> setting. Figure 2-6 Operating Mode Transition Diagram Oscillator Operating Mode High Frequency Low Frequency CPU Core TBT Other Peripherals Reset Reset Reset RESET NORMAL1 Single clock IDLE1 Operate Oscillation Stop Operate IDLE0 Halt STOP Stop – Operate with high frequency 4/fc [s] Halt Oscillation Operate with low frequency SLOW2 Dual clock 4/fc [s] Operate Halt Halt NORMAL2 IDLE2 Machine Cycle Time Oscillation SLEEP2 Operate Halt Operate 4/fs [s] Operate with low frequency SLOW1 SLEEP1 Stop SLEEP0 Halt STOP Stop Halt Halt – System Control Register 1 SYSCR1 (0038H) 7 6 5 4 STOP RELM RETM OUTEN 3 2 1 0 WUT (Initial value: 0000 00**) STOP STOP mode start 0: CPU core and peripherals remain active 1: CPU core and peripherals are halted (Start STOP mode) RELM Release method for STOP mode 0: Edge-sensitive release 1: Level-sensitive release RETM Operating mode after STOP mode 0: Return to NORMAL1/2 mode 1: Return to SLOW1 mode Port output during STOP mode 0: High impedance 1: Output kept OUTEN R/W Return to NORMAL mode 00 WUT Warm-up time at releasing STOP mode 3× Return to SLOW mode 216/fc 3 × 213/fs 01 216/fc 213/fs 10 3 × 214/fc 3 × 26/fs 11 214/fc 26/fs Note 1: Always set RETM to “0” when transiting from NORMAL mode to STOP mode. Always set RETM to “1” when transiting from SLOW mode to STOP mode. Note 2: When STOP mode is released with RESET pin input, a return is made to NORMAL1 regardless of the RETM contents. Note 3: fc: High-frequency clock [Hz], fs: Low-frequency clock [Hz], *; Don’t care Note 4: Bits 1 and 0 in SYSCR1 are read as undefined data when a read instruction is executed. Note 5: As the hardware becomes STOP mode under OUTEN = “0”, input value is fixed to “0”; therefore it may cause interrupt request on account of falling edge. Note 6: When the key-on wakeup is used, the edge realease can not function according to some conditions. It is recommended to set the level realease (RELM = “1”). Note 7: Port P20 is used as STOP pin. Therefore, when stop mode is started, OUTEN does not affect to P20, and P20 becomes High-Z mode. Note 8: The warmig-up time should be set correctly for using oscillator. Page 16 TMP86FS49FG TENTATIVE System Control Register 2 SYSCR2 (0039H) 7 6 5 4 XEN XTEN SYSCK IDLE 3 2 1 TGHALT 0 (Initial value: 1000 *0**) XEN High-frequency oscillator control 0: Turn off oscillation 1: Turn on oscillation XTEN Low-frequency oscillator control 0: Turn off oscillation 1: Turn on oscillation SYSCK Main system clock select (Write)/main system clock monitor (Read) 0: High-frequency clock 1: Low-frequency clock IDLE CPU and watchdog timer control (IDLE1/2 and SLEEP1/2 modes) 0: CPU and watchdog timer remain active 1: CPU and watchdog timer are stopped (Start IDLE1/2 and SLEEP1/2 modes) TGHALT TG control (IDLE0 and SLEEP0 modes) 0: Feeding clock to all peripherals from TG 1: Stop feeding clock to peripherals except TBT from TG. (Start IDLE0 and SLEEP0 modes) R/W Note 1: A reset is applied if both XEN and XTEN are cleared to “0”, XEN is cleared to “0” when SYSCK = “0”, or XTEN is cleared to “0” when SYSCK = “1”. Note 2: *: Don’t care, TG: Timing generator Note 3: Bits 3, 1 and 0 in SYSCR2 are always read as undefined value. Note 4: Do not set IDLE and TGHALT to “1” simultaneously. Note 5: Because returning from IDLE0/SLEEP0 to NORMAL1/SLOW1 is executed by the asynchronous internal clock, the period of IDLE0/SLEEP0 mode might be shorter than the period setting by TBTCR<TBTCK>. Note 6: When IDLE1/2 or SLEEP1/2 mode is released, IDLE is automatically cleared to “0”. Note 7: When IDLE0 or SLEEP0 mode is released, TGHALT is automatically cleared to “0”. Note 8: Before setting TGHALT to “1”, be sure to stop peripherals. If peripherals are not stopped, the interrupt latch of peripherals may be set after IDLE0 or SLEEP0 mode is released. 2.2.4 Operating Mode Control 2.2.4.1 STOP mode STOP mode is controlled by the system control register 1, the STOP pin input . The STOP pin is also used both as a port P20 and an INT5 (external interrupt input 5) pin. STOP mode is started by setting STOP (Bit7 in SYSCR1) to “1”. During STOP mode, the following status is maintained. 1. Oscillations are turned off, and all internal operations are halted. 2. The data memory, registers, the program status word and port output latches are all held in the status in effect before STOP mode was entered. 3. The prescaler and the divider of the timing generator are cleared to “0”. 4. The program counter holds the address 2 ahead of the instruction (e.g., [SET (SYSCR1).7]) which started STOP mode. STOP mode includes a level-sensitive mode and an edge-sensitive mode, either of which can be selected with the RELM (Bit6 in SYSCR1). Note 1: During STOP period (from start of STOP mode to end of warm up), due to changes in the external interrupt pin signal, interrupt latches may be set to “1” and interrupts may be accepted immediately after STOP mode is released. Before starting STOP mode, therefore, disable interrupts. Also, before enabling interrupts after STOP mode is released, clear unnecessary interrupt latches. (1) Level-sensitive release mode (RELM = “1”) In this mode, STOP mode is released by setting the STOP pin high. This mode is used for capacitor backup when the main power supply is cut off and long term battery backup. Page 17 2. Operational Description 2.2 System Clock Controller TMP86FS49FG TENTATIVE When the STOP pin input is high, executing an instruction which starts STOP mode will not place in STOP mode but instead will immediately start the release sequence (Warm up). Thus, to start STOP mode in the level-sensitive release mode, it is necessary for the program to first confirm that the STOP pin input is low. The following two methods can be used for confirmation. 1. Testing a port P20. 2. Using an external interrupt input INT5 (INT5 is a falling edge-sensitive input). Example 1 :Starting STOP mode from NORMAL mode by testing a port P20. SSTOPH: LD (SYSCR1), 01010000B ; Sets up the level-sensitive release mode TEST (P2PRD). 0 ; Wait until the STOP pin input goes low level JRS F, SSTOPH ; IMF ← 0 DI SET (SYSCR1). 7 ; Starts STOP mode Example 2 :Starting STOP mode from NORMAL mode with an INT5 interrupt. PINT5: TEST (P2PRD). 0 JRS F, SINT5 ; To reject noise, STOP mode does not start if LD (SYSCR1), 01010000B port P20 is at high ; IMF ← 0 DI SET SINT5: ; Sets up the level-sensitive release mode. (SYSCR1). 7 ; Starts STOP mode RETI VIH STOP pin XOUT pin NORMAL operation STOP operation Warm up Confirm by program that the STOP pin input is low and start STOP mode. NORMAL operation STOP mode is released by the hardware. Always released if the STOP pin input is high. Figure 2-7 Level-sensitive Release Mode Note 1: In this case of changing to the level-sensitive mode from the edge-sensitive mode, the release mode is not switched until a rising edge of the STOP pin input is detected. (2) Edge-sensitive release mode (RELM = “0”) In this mode, STOP mode is released by a rising edge of the STOP pin input. This is used in applications where a relatively short program is executed repeatedly at periodic intervals. This periodic signal (for example, a clock from a low-power consumption oscillator) is input to the STOP pin. In the edge-sensitive release mode, STOP mode is started even when the STOP pin input is high level. Example :Starting STOP mode from NORMAL mode ; IMF ← 0 DI LD (SYSCR1), 10010000B Page 18 ; Starts after specified to the edge-sensitive release mode TMP86FS49FG TENTATIVE VIH STOP pin XOUT pin NORMAL operation STOP operation Warm up NORMAL operation STOP mode started by the program. STOP operation STOP mode is released by the hardware at the rising edge of STOP pin input. Figure 2-8 Edge-sensitive Release Mode STOP mode is released by the following sequence. 1. In the dual-clock mode, when returning to NORMAL2, both the high-frequency and lowfrequency clock oscillators are turned on; when returning to SLOW1 mode, only the lowfrequency clock oscillator is turned on. In the single-clock mode, only the high-frequency clock oscillator is turned on. 2. A warm-up period is inserted to allow oscillation time to stabilize. During warm up, all internal operations remain halted. Four different warm-up times can be selected with the WUT (Bits 2 and 3 in SYSCR1) in accordance with the resonator characteristics. 3. When the warm-up time has elapsed, normal operation resumes with the instruction following the STOP mode start instruction. The start is made after the prescaler and the divider of the timing generator are cleared to “0”. Table 2-1 Warm-up Time Example (at fc = 16.0 MHz, fs = 32.768 kHz) Warm-up Time [ms] WUT Return to NORMAL Mode Return to SLOW Mode 00 12.288 750 01 4.096 250 10 3.072 5.85 11 1.024 1.95 Note: The warm-up time is obtained by dividing the basic clock by the divider. Therefore, the warm-up time may include a certain amount of error if there is any fluctuation of the oscillation frequency when STOP mode is released. Thus, the warm-up time must be considered as an approximate value. STOP mode can also be released by inputting low level on the RESET pin, which immediately performs the normal reset operation. Note: When STOP mode is released with a low hold voltage, the following cautions must be observed. The power supply voltage must be at the operating voltage level before releasing STOP mode. The RESET pin input must also be “H” level, rising together with the power supply voltage. In this case, if an external time constant circuit has been connected, the RESET pin input voltage will increase at a slower pace than the power supply voltage. At this time, there is a danger that a reset may occur if input voltage level of the RESET pin drops below the non-inverting high-level input voltage (Hysteresis input). Page 19 Page 20 Figure 2-9 STOP Mode Start/Release Divider Instruction execution Program counter Main system clock Oscillator circuit STOP pin input Divider Instruction execution Program counter Main system clock Oscillator circuit 0 Halt Turn off Turn on Turn on n Count up a+3 Warm up a+2 n+2 n+3 n+4 0 (b) STOP mode release 1 Instruction address a + 2 a+4 2 Instruction address a + 3 a+5 (a) STOP mode start (Example: Start with SET (SYSCR1). 7 instruction located at address a) n+1 SET (SYSCR1). 7 a+3 3 Instruction address a + 4 a+6 0 Halt Turn off 2.2 System Clock Controller 2. Operational Description TENTATIVE TMP86FS49FG TMP86FS49FG TENTATIVE 2.2.4.2 IDLE1/2 mode and SLEEP1/2 mode IDLE1/2 and SLEEP1/2 modes are controlled by the system control register 2 (SYSCR2) and maskable interrupts. The following status is maintained during these modes. 1. Operation of the CPU and watchdog timer (WDT) is halted. On-chip peripherals continue to operate. 2. The data memory, CPU registers, program status word and port output latches are all held in the status in effect before these modes were entered. 3. The program counter holds the address 2 ahead of the instruction which starts these modes. Starting IDLE1/2 and SLEEP1/2 modes by instruction CPU and WDT are halted Yes Reset input Reset No No Interrupt request Normal release mode No Yes IMF = 1 Yes (Interrupt release mode) Interrupt processing Execution of the instruction which follows the IDLE1/2 and SLEEP1/2 modes start instruction Figure 2-10 IDLE1/2 and SLEEP1/2 Modes (1) Start the IDLE1/2 and SLEEP1/2 modes When IDLE1/2 and SLEEP1/2 modes start, set SYSCR2<IDLE> to “1”. After IMF is set to "0", set the individual interrupt enable flag (EF) which releases IDLE1/2 and SLEEP1/2. (2) Release the IDLE1/2 and SLEEP1/2 modes IDLE1/2 and SLEEP1/2 modes include a normal release mode and an interrupt release mode. These modes are selected by interrupt master enable flag (IMF). After releasing IDLE1/2 and SLEEP1/2 modes, the SYSCR2<IDLE> is automatically cleared to “0” and the operation mode is returned to the mode preceding IDLE1/2 and SLEEP1/2 modes. IDLE1/2 and SLEEP1/2 modes can also be released by inputting low level on the RESET pin. After releasing reset, the operation mode is started from NORMAL1 mode. Page 21 2. Operational Description 2.2 System Clock Controller TENTATIVE (3) TMP86FS49FG Normal release mode (IMF = “0”) IDLE1/2 and SLEEP1/2 modes are released by any interrupt source enabled by the individual interrupt enable flag (EF). After the interrupt is generated, the program operation is resumed from the instruction following the IDLE1/2 and SLEEP1/2 modes start instruction. Normally, the interrupt latches (IL) of the interrupt source used for releasing must be cleared to “0” by load instructions. (4) Interrupt release mode (IMF = “1”) IDLE1/2 and SLEEP1/2 modes are released by any interrupt source enabled with the individual interrupt enable flag (EF) and the interrupt processing is started. After the interrupt is processed, the program operation is resumed from the instruction following the instruction, which starts IDLE1/2 and SLEEP1/2 modes. Note: When a watchdog timer interrupts is generated immediately before IDLE1/2 and SLEEP1/2 mode are started, the watchdog timer interrupt will be processed but IDLE1/2 and SLEEP1/2 mode will not be started. Page 22 Page 23 Figure 2-11 IDLE1/2 and SLEEP1/2 Modes Start/Release Watchdog timer Instruction execution Program counter Interrupt request Main system clock Watchdog timer Instruction execution Program counter Interrupt request Main system clock Watchdog timer Instruction execution Program counter Interrupt request Main system clock Halt Halt Halt Halt Operate Operate Operate a+4 Acceptance of interrupt Instruction address a + 2 (b) IDLE1/2 and SLEEP1/2 modes release Interrupt release mode a+3 Normal release mode a+3 (a) IDLE1/2 and SLEEP1/2 modes start (Example: Starting with the SET instruction located at address a) Operate SET (SYSCR2). 4 a+2 Halt a+3 TENTATIVE TMP86FS49FG 2. Operational Description 2.2 System Clock Controller 2.2.4.3 TMP86FS49FG TENTATIVE IDLE0 and SLEEP0 modes (IDLE0, SLEEP0) IDLE0 and SLEEP0 modes are controlled by the system control register 2 (SYSCR2) and the time base timer control register (TBTCR). The following status is maintained during IDLE0 and SLEEP0 modes. 1. Timing generator stops feeding clock to peripherals except TBT. 2. The data memory, CPU registers, program status word and port output latches are all held in the status in effect before IDLE0 and SLEEP0 modes were entered. 3. The program counter holds the address 2 ahead of the instruction which starts IDLE0 and SLEEP0 modes. Note: Before starting IDLE0 or SLEEP0 mode, be sure to stop (Disable) peripherals. Stopping peripherals by instruction Starting IDLE0 and SLEEP0 modes by instruction CPU and WDT are halted Reset input Yes Reset No No TBT source clock falling edge Yes No TBTCR<TBTEN> = "1" Yes No TBT interrupt enable Yes (Normal release mode) No IMF = "1" Yes (Interrupt release mode) Interrupt processing Execution of the instruction which follows the IDLE0 and SLEEP0 modes start instruction Figure 2-12 IDLE0 and SLEEP0 Modes (1) Start the IDLE0 and SLEEP0 modes Stop (Disable) peripherals such as a timer counter. Page 24 TENTATIVE TMP86FS49FG When IDLE0 and SLEEP0 modes start, set SYSCR2<TGHALT> to “1”. (2) Release the IDLE0 and SLEEP0 modes IDLE0 and SLEEP0 modes include a normal release mode and an interrupt release mode. These modes are selected by interrupt master flag (IMF), the individual interrupt enable flag of TBT and TBTCR<TBTEN>. After releasing IDLE0 and SLEEP0 modes, the SYSCR2<TGHALT> is automatically cleared to “0” and the operation mode is returned to the mode preceding IDLE0 and SLEEP0 modes. Before starting the IDLE0 or SLEEP0 mode, when the TBTCR<TBTEN> is set to “1”, INTTBT interrupt latch is set to “1”. IDLE0 and SLEEP0 modes can also be released by inputting low level on the RESET pin. After releasing reset, the operation mode is started from NORMAL1 mode. Note: IDLE0 and SLEEP0 modes start/release without reference to TBTCR<TBTEN> setting. (3) Normal release mode (IMF・EF7・TBTCR<TBTEN> = “0”) IDLE0 and SLEEP0 modes are released by the source clock falling edge, which is setting by the TBTCR<TBTCK> without reference to individual interrupt enable flag (EF). After the falling edge is detected, the program operation is resumed from the instruction following the IDLE0 and SLEEP0 modes start instruction. (4) Interrupt release mode (IMF・EF7・TBTCR<TBTEN> = “1”) IDLE0 and SLEEP0 modes are released by the source clock falling edge, which is setting by the TBTCR<TBTCK> at INTTBT interrupt source enabled with the individual interrupt enable flag (EF) and INTTBT interrupt processing is started. Note 1: Because returning from IDLE0, SLEEP0 to NORMAL1, SLOW1 is executed by the asynchronous internal clock, the period of IDLE0, SLEEP0 mode might be the shorter than the period setting by TBTCR<TBTCK>. Note 2: When a watchdog timer interrupt is generated immediately before IDLE0/SLEEP0 mode is started, the watchdog timer interrupt will be processed but IDLE0/SLEEP0 mode will not be started. Page 25 Page 26 Figure 2-13 IDLE0 and SLEEP0 Modes Start/Release Watchdog timer Instruction execution Program counter TBT clock Halt Halt Halt Watchdog timer Main system clock Halt Instruction execution Program counter TBT clock Main system clock Watchdog timer Instruction execution Program counter Interrupt request M ain system clock Operate Operate Acceptance of interrupt Instruction address a + 2 a+4 a+3 Halt TENTATIVE (b) IDLE0 and SLEEP0 modes release Interrupt release mode a+3 Normal release mode a+3 (a) IDLE0 and SLEEP0 modes start (Example: Starting with the SET instruction located at address a) Operate SET (SYSCR2). 2 a+2 2.2 System Clock Controller 2. Operational Description TMP86FS49FG TENTATIVE 2.2.4.4 TMP86FS49FG SLOW mode SLOW mode is controlled by the system control register 2 (SYSCR2). The following is the methods to switch the mode with the warm-up counter (TC4, TC3). (1) Switching from NORMAL2 mode to SLOW1 mode First, set SYSCK (Bit5 in SYSCR2) to switch the main system clock to the low-frequency clock for SLOW2 mode. Next, clear XEN (Bit7 in SYSCR2) to turn off high-frequency oscillation. Note: The high-frequency clock can be continued oscillation in order to return to NORMAL2 mode from SLOW mode quickly. Always turn off oscillation of high-frequency clock when switching from SLOW mode to stop mode. When the low-frequency clock oscillation is unstable, wait until oscillation stabilizes before performing the above operations. The timer/counter 6, 5, 4, 3 (TC6, TC5, TC4, TC3) can conveniently be used to confirm that low-frequency clock oscillation has stabilized. Example 1 :Switching from NORMAL2 mode to SLOW1 mode. SET ; SYSCR2<SYSCK> ← 1 (SYSCR2). 5 (Switches the main system clock to the low-frequency clock for SLOW2) CLR ; SYSCR2<XEN> ← 0 (SYSCR2). 7 (Turns off high-frequency oscillation) Example 2 :Switching to the SLOW1 mode after low-frequency clock has stabilized. (SYSCR2). 6 ; SYSCR2<XTEN> ← 1 LD (TC3CR), 43H ; Sets mode for TC4, TC3 (16-bit TC, fs for source) LD (TC4CR), 05H LDW (TTREG3), 8000H SET ; IMF ← 0 DI SET (EIRH). 1 ; Enables INTTC4 ; IMF ← 1 EI SET ; Sets warm-up time (Depend on oscillator accompanied) (TC4CR). 3 ; Starts TC4, 3 CLR (TC4CR). 3 ; Stops TC4, 3 SET (SYSCR2). 5 ; SYSCR2<SYSCK> ← 1 : PINTTC4: (Switches the main system clock to the low-frequency clock) CLR ; SYSCR2<XEN> ← 0 (SYSCR2). 7 (Turns off high-frequency oscillation) RETI : VINTTC4: (2) DW PINTTC4 ; INTTC4 vector table Switching from SLOW1 mode to NORMAL2 mode First, set XEN (Bit7 in SYSCR2) to turn on the high-frequency oscillation. When time for stabilization (Warm up) has been taken by the timer/counter 4, 3 (TC4, TC3), clear SYSCK (Bit5 in SYSCR2) to switch the main system clock to the high-frequency clock. Page 27 2. Operational Description 2.2 System Clock Controller TENTATIVE TMP86FS49FG Note: After SYSCK is cleared to “0”, executing the instructions is continiued by the low-frequency clock for the period synchronized with low-frequency and high-frequency clocks. High-frequency clock Low-frequency clock Main system clock SYSCK Note: SLOW mode can also be released by inputting low level on the RESET pin, which immediately performs the reset operation. After reset, TMP86FS49FG are placed in NORMAL1 mode. Example :Switching from the SLOW1 mode to the NORMAL2 mode (fc = 16 MHz, warm-up time is 4.0 ms). (SYSCR2). 7 ; SYSCR2<XEN> ← 1 (Starts high-frequency oscillation) LD (TC3CR), 63H ; Sets mode for TC4, TC3 (16-bit TC, fc for source) LD (TC4CR), 05H LD (TTREG4), 0F8H SET ; Sets warm-up time ; IMF ← 0 DI SET (EIRH). 1 ; Enables INTTC4 ; IMF ← 1 EI SET (TC4CR). 3 ; Starts TC4, 3 CLR (TC4CR). 3 ; Stops TC4, 3 CLR (SYSCR2). 5 ; SYSCR2<SYSCK> ← 0 : PINTTC4: (Switches the main system clock to the high-frequency clock) RETI : VINTTC4: DW PINTTC4 ; INTTC4 vector table Page 28 Page 29 Figure 2-14 Switching between the NORMAL2 and SLOW Modes SET (SYSCR2). 7 SET (SYSCR2). 5 SLOW1 mode Instruction execution XEN SYSCK Highfrequency clock Lowfrequency clock Main system clock NORMAL2 mode Instruction execution XEN SYSCK Highfrequency clock Lowfrequency clock Main system clock (b) Switching to the NORMAL2 mode Warm up during SLOW2 mode CLR (SYSCR2). 5 (a) Switching to the SLOW mode SLOW2 mode CLR (SYSCR2). 7 NORMAL2 mode SLOW1 mode Turn off TENTATIVE TMP86FS49FG 2. Operational Description 2.3 Reset Circuit TMP86FS49FG TENTATIVE 2.3 Reset Circuit The TMP86FS49FG have four types of reset generation procedures: An external reset input, an address trap reset, a watchdog timer reset and a system clock reset. Table 2-2 shows on-chip hardware initialization by reset action. The malfunction reset circuit such as watchdog timer reset, address trap reset and system clock reset is not initialized when power is turned on. The RESET pin can reset state at the maximum 24/fc [s] (1.5 µs at 16.0 MHz) when power is turned on. Table 2-2 Initializing Internal Status by Reset Action On-chip Hardware Initial Value Program counter (PC) (FFFEH) Stack pointer (SP) Not initialized General-purpose registers (W, A, B, C, D, E, H, L, IX, IY) (JF) Not initialized Zero flag (ZF) Not initialized Carry flag (CF) Not initialized Half carry flag (HF) Not initialized Sign flag (SF) Not initialized Overflow flag (VF) Not initialized (IMF) 0 (EF) 0 Interrupt individual enable flags Interrupt latches 2.3.1 Initial Value Prescaler and divider of timing generator 0 Not initialized Jump status flag Interrupt master enable flag On-chip Hardware (IL) Watchdog timer Enable Output latches of I/O ports Refer to I/O port circuitry Control registers Refer to each of control register RAM Not initialized 0 External Reset Input The RESET pin contains a Schmitt trigger (Hysteresis) with an internal pull-up resistor. When the RESET pin is held at “L” level for at least 3 machine cycles (12/fc [s]) with the power supply voltage within the operating voltage range and oscillation stable, a reset is applied and the internal state is initialized. When the RESET pin input goes high, the reset operation is released and the program execution starts at the vector address stored at addresses FFFEH to FFFFH. VDD RESET Internal reset Watchdog timer reset Malfunction reset output circuit Address trap reset System clock reset Figure 2-15 Reset Circuit Page 30 TMP86FS49FG TENTATIVE 2.3.2 Address trap reset If the CPU should start looping for some cause such as noise and an attempt be made to fetch an instruction from the on-chip RAM (when WDTCR1<ATAS> is set to “1”), DBR or the SFR area, address trap reset will be generated. The reset time is about 8/fc to 24/fc [s] (0.5 to 1.5 µs at 16.0 MHz). Note:The operating mode under address trapped is alternative of reset or interrupt. The address trap area is alternative. Instruction execution JP Reset release a Instruction at address r Address trap is occurred Internal reset 4/fc to 12/fc [s] 8/fc to 24/fc [s] 16/fc [s] Note 1: Address “a” is in the SFR or on-chip RAM (WDTCR1<ATAS> = “1”) space. Note 2: During reset release, reset vector “r” is read out, and an instruction at address “r” is fetched and decoded. Figure 2-16 Address Trap Reset 2.3.3 Watchdog timer reset Refer to 2.4 “Watchdog Timer”. 2.3.4 System clock reset Clearing both XEN and XTEN (Bits 7 and 6 in SYSCR2) to “0”, clearing XEN to “0” when SYSCK = “0”, or clearing XTEN to “0” when SYSCK = “1” stops system clock, and causes the microcomputer to deadlock. This can be prevented by automatically generating a reset signal whenever XEN = XTEN = “0”, XEN = SYSCK = “0”, or XTEN = “0”/SYSCK = “1” is detected to continue the oscillation. The reset time is about 8/ fc to 24/fc [s] (0.5 to 1.5 µs at 16.0 MHz). Page 31 2. Operational Description 2.3 Reset Circuit TENTATIVE Page 32 TMP86FS49FG TMP86FS49FG TENTATIVE 22. Electrical Characteristics 22.1 Absolute Maximum Ratings The absolute maximum ratings are rated values which must not be exceeded during operation, even for an instant. Any one of the ratings must not be exceeded. If any absolute maximum rating is exceeded, a device may break down or its performance may be degraded, causing it to catch fire or explode resulting in injury to the user. Thus, when designing products which include this device, ensure that no absolute maximum rating value will ever be exceeded. (VSS = 0 V) Parameter Symbol Pins Ratings Supply voltage VDD -0.3 to 6.5 Input voltage VIN -0.3 to VDD + 0.3 VOUT1 -0.3 to VDD + 0.3 Output voltage Output current (Per 1 pin) Output current (Total) IOUT1 P0, P1, P4, P6, P7 ports -1.8 IOUT2 P0, P1, P4, P6, P7 ports 3.2 IOUT3 P3, P5 ports 30 Σ IOUT1 P0, P1, P4, P6, P7 ports 60 Σ IOUT2 P3, P5 ports V mA 80 Power dissipation [Topr = 85 °C] PD 250 Soldering temperature (time) Tsld 260 (10 s) Storage temperature Tstg -55 to 125 Operating temperature Topr -40 to 85 Page 255 Unit mW °C 22. Electrical Characteristics 22.1 Absolute Maximum Ratings TMP86FS49FG TENTATIVE 22.2 Recommended Operating Conditions The recommended operating conditions for a device are operating conditions under which it can be guaranteed that the device will operate as specified. If the device is used under operating conditions other than the recommended operating conditions (supply voltage, operating temperature range, specified AC/DC values etc.), malfunction may occur. Thus, when designing products which include this device, ensure that the recommended operating conditions for the device are always adhered to. 22.2.1 MCU mode (Flash Programming or erasing) (VSS = 0 V, Topr = -10 to 40°C) Parameter Symbol Pins Ratings VDD Supply voltage Input high level Input low level Clock frequency NORMAL1, 2 modes VIH1 Except hysteresis input VIH2 Hysteresis input VIL1 Except hysteresis input VIL2 Except hysteresis input fc VDD ≥ 4.5 V VDD ≥ 4.5 V XIN, XOUT Min Max 4.5 5.5 VDD × 0.70 Unit VDD VDD × 0.75 V VDD × 0.30 0 VDD × 0.25 1.0 16.0 MHz 22.2.2 MCU mode (Except Flash Programming or erasing) (VSS = 0 V, Topr = -40 to 85°C) Parameter Symbol Pins Supply voltage (Condition 1) Ratings fc = 16 MHz NORMAL1, 2 modes IDLE0, 1, 2 modes fs = 32.768 KHz SLOW1, 2 modes SLEEP0, 1, 2 modes Min Max 4.5 5.5 3.0 3.6 Unit STOP mode VDD Supply voltage (Condition 2) fc = 8 MHz NORMAL1, 2 modes IDLE0, 1, 2 modes fs = 32.768 KHz SLOW1, 2 modes SLEEP0, 1, 2 modes V STOP mode Input high level VIH1 Except hysteresis input VIH2 Hysteresis input VDD < 4.5 V VIH3 Input low level VIL1 Except hysteresis input VIL2 Hysteresis input VDD ≥ 4.5 V VDD × 0.70 VDD × 0.75 VDD VDD × 0.90 VDD × 0.30 0 VDD × 0.25 VDD × 0.10 VDD < 4.5 V VIL3 XIN, XOUT VDD = 3.0 to 3.6 V, 4.5 to 5.5V 1.0 8.0 fc XIN, XOUT VDD = 4.5 to 5.5 V 1.0 16.0 fs XTIN, XTOUT VDD = 3.0 to 3.6 V, 4.5 to 5.5V 30.0 34.0 fc Clock frequency VDD ≥ 4.5 V MHz Note 1: The Supply voltage (VDD) is divided into two different voltage areas. Do not change VDD from Condition 1 to Condition 2 and vice versa while the MCU is operationg. If you wish to use VDD in a continuous range of 3.0V to 5.5V without stopping the MCU, please contact your local Toshiba office. Page 256 kHz TMP86FS49FG TENTATIVE 22.2.3 Serial PROM mode (VSS = 0 V, Topr = -10 to 40 °C) Parameter Supply voltage Input high voltage Input low voltage Clock frequency Symbol Pins VDD VIH1 NORMAL1, 2 modes Except hysteresis input VIH2 Hysteresis input VIL1 Except hysteresis input VIL2 Hysteresis input fc Condition VDD ≥ 4.5 V VDD ≥ 4.5 V XIN, XOUT Min Max 4.5 5.5 VDD × 0.70 VDD × 0.75 0 2.0 Page 257 VDD Unit V VDD × 0.30 VDD × 0.25 16.0 MHz 22. Electrical Characteristics 22.1 Absolute Maximum Ratings TMP86FS49FG TENTATIVE 22.3 DC Characteristics (VSS = 0 V, Topr = -40 to 85 °C) Parameter Symbol Pins Condition Min Typ. Max Unit – 0.9 – V – – ±2 µA 100 220 450 kΩ VHS Hysteresis input IIN1 TEST IIN2 Sink open drain, tri–state port IIN3 RESET, STOP RIN RESET pull–up ILO1 Sink open drain port VDD = 5.5 V, VOUT = 5.5 V – – 2 ILO2 Tri–state port VDD = 5.5 V, VOUT = 5.5 V/0 V – – ±2 Output high voltage VOH Tri–state port VDD = 4.5 V, IOH = -0.7 mA 4.1 – – Output low voltage VOL Except XOUT, P3, P5 VDD = 4.5 V, IOL = 1.6 mA – – 0.4 Output low curren IOL High current port (P3, P5 Port) VDD = 4.5 V, VOL = 1.0 V – 20 – – 12.6 20 – 6.3 7.5 – 7.6 10 When a program operates on flash memory – 0.9 3 When a program operates on RAM – 10 21 – 4.5 16 – 3.5 12 – 0.5 10 Hysteresis voltage Input current Input resistance Output leakage current Supply current in NORMAL1, 2 modes VDD = 5.5 V When a program operates on flash memory VIN = 5.3 V/0.2 V Supply current in IDLE0 mode fc = 16 MHz fs = 32.768 kHz Supply current in IDLE 1, 2 modes Supply current in SLOW1 mode VDD = 5.5 V, VIN = 5.5 V/0 V IDD VDD = 3.0 V VIN = 2.8 V/0.2 V Supply current in SLEEP1 mode fs = 32.768 kHz V mA µA Supply current in SLEEP0 mode Supply current in STOP mode µA VDD = 5.5 V VIN = 5.3 V/0.2 V Note 1: Typical values show those at Topr = 25°C and VDD = 5 V. Note 2: Input current (IIN1, IIN3): The current through pull-up or pull-down resistor is not included. Note 3: IDD does not include IREF. Note 4: The supply currents of SLOW2 and SLEEP2 modes are equivalent to those of IDLE1 and IDLE2 modes. Page 258 TMP86FS49FG TENTATIVE 22.4 AD Characteristics (VSS = 0.0 V, 4.5 V ≤ VDD ≤ 5.5 V, Topr = -40 to 85 °C) Paramete Symbol Analog reference voltage VAREF Power supply voltage of analog control circuit AVDD Condition Min Typ. Max AVDD - 1.0 – AVDD VDD V ∆ VAREF 3.5 – – Analog input voltage VAIN VSS – VAREF Power supply current of analog reference voltage IREF – 0.6 1.0 – – ±2 – – ±2 – – ±2 – – ±2 Analog reference voltage range (Note 4) VDD = AVDD = VAREF = 5.5 V VSS = AVSS = 0.0 V Non linearity error VDD = AVDD = 5.0 V, Zero point error VSS = AVSS = 0.0 V Full scale error VAREF = 5.0 V Total error Unit mA LSB (VSS = 0 V, 3.0 V ≤ VDD ≤ 3.6 V, Topr = -40 to 85°C) Parameter Symbol Analog reference voltage VAREF Power supply voltage of analog control circuit AVDD Condition Min Typ. Max AVDD - 1.0 – AVDD VDD V ∆ VAREF 2.5 – – Analog input voltage VAIN VSS – VAREF Power supply current of analog reference voltage IREF – 0.5 0.8 – – ±2 – – ±2 – – ±2 – – ±2 Analog reference voltage range (Note 4) VDD = AVDD = VAREF =3.6 V VSS = AVSS = 0.0 V Non linearity error Zero point error Full scale error VDD = AVDD = 3.0 V VSS = AVSS = 0.0 V VAREF = 3.0 V Total error Unit mA LSB Note 1: The total error includes all errors except a quanitization error, and is defined as a maximum deviation from the ideal conversion line. Note 2: Conversion time is defferent in recommended value by power supply voltage. Note 3: The voltage to be input on the AIN input pin must not exceed the range between VAREF and VSS. If a voltage outside this range is input, conversion values will become unstable and conversion values of other channels will also be affected. Note 4: Analog reference voltage range: ∆VAREF = VAREF - VSS Note 5: When AD converter is not used, fix the AVDD and VAREF pin on the VDD level. Page 259 22. Electrical Characteristics 22.6 Flash Characteristics TMP86FS49FG TENTATIVE 22.5 AC Characteristics (VSS = 0 V, VDD = 4.5 V to 5.5 V, Topr = -40 to 85°C) Parameter Symbol Condition Min Typ. Max 0.25 – 4 117.6 – 133.3 For external clock operation (XIN input) fc = 16 MHz – 31.25 – ns For external clock operation (XTIN input) fs = 32.768 kHz – 15.26 – µs NORMAL1, 2 modes Machine cycle time tcy IDLE0, 1, 2 modes SLOW1, 2 modes SLEEP0, 1, 2 modes High-level clock pulse width tWCH Low-level clock pulse width tWCL High-level clock pulse width tWSH Low-level clock pulse width tWSL Unit µs (VSS = 0 V, VDD = 3.0 V to 3.6 V, Topr = -40 to 85°C) Paramete Symbol Condition Min Typ. Max 0.5 – 4 117.6 – 133.3 For external clock operation (XIN input) fc = 8 MHz – 62.5 – ns For external clock operation (XTIN input) fs = 32.768 kHz – 15.26 – µs NORMAL1, 2 modes tcy Machine cycle time IDLE0, 1, 2 modes SLOW1, 2 modes SLEEP0, 1, 2 modes High-level clock pulse width tWCH Low-level clock pulse width tWCL High-level clock pulse width tWSH Low-level clock pulse width tWSL Unit µs 22.6 Flash Characteristics 22.6.1 Write/Retention Characteristics (VSS = 0 V) Paramete Number of guaranteed writes to flash memory Condition VSS = 0 V, Topr = -10 to 40°C Page 260 Min Typ. Max. Unit – – 100 Times TMP86FS49FG TENTATIVE 22.7 Recommended Oscillating Conditions XIN XOUT XTIN C2 C1 (1) High-frequency Oscillation XTOUT C1 C2 (2) Low-frequency Oscillation Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these factors are greatly affected by board patterns, please be sure to evaluate operation on the board on which the device will actually be mounted. Note 2: The product numbers and specifications of the resonators by Murata Manufacturing Co., Ltd. are subject to change. For up-to-date information, please refer to the following URL: http://www.murata.co.jp/search/index.html 22.8 Handling Precaution - The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown below. 1. When using the Sn-63Pb solder bath Solder bath temperature = 230 °C Dipping time = 5 seconds Number of times = once R-type flux used 2. When using the Sn-3.0Ag-0.5Cu solder bath Solder bath temperature = 245 °C Dipping time = 5 seconds Number of times = once R-type flux used Note: The pass criteron of the above test is as follows: Solderability rate until forming ≥ 95 % - When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we recommend electrically shielding the package in order to maintain normal operating condition. Page 261 22. Electrical Characteristics 22.8 Handling Precaution TENTATIVE Page 262 TMP86FS49FG