IRF IRF7103QTRPBF

PD - 96101C
IRF7103QPbF
HEXFET® Power MOSFET
Benefits
l
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Advanced Process Technology
Dual N-Channel MOSFET
Ultra Low On-Resistance
175°C Operating Temperature
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
Description
This HEXFET® Power MOSFET's in a Dual SO-8 package
utilize the lastest processing techniques to achieve extremely
low on-resistance per silicon area. Additional features of
these HEXFET Power MOSFET's are a 175°C junction
operating temperature, fast switching speed and improved
repetitive avalanche rating. These benefits combine to make
this design an extremely efficient and reliable device for use
in a wide variety of applications.
VDSS
RDS(on) max (mW)
ID
130@VGS = 10V
3.0A
200@VGS = 4.5V
1.5A
50V
1
8
D1
G1
2
7
D1
S2
3
6
D2
4
5
D2
S1
G2
SO-8
Top View
The efficient SO-8 package provides enhanced thermal
characteristics and dual MOSFET die capability making it
ideal in a variety of power applications. This dual, surface
mount SO-8 can dramatically reduce board space and is
also available in Tape & Reel.
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TA = 25°C
Continuous Drain Current, VGS @ 4.5V
3.0
ID @ TA = 70°C
Continuous Drain Current, VGS @ 4.5V
Pulsed Drain Current
2.5
PD @TA = 25°C
Power Dissipation
2.4
W
VGS
16
± 20
W/°C
V
EAS
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
22
mJ
IAR
Avalanche Current
EAR
Repetitive Avalanche Energy
dv/dt
TJ
Operating Junction and
TSTG
Storage Temperature Range
IDM
c
e
c
h
Peak Diode Recovery dv/dt g
A
25
f
See Fig. 16c, 16d, 19, 20
A
mJ
12
-55 to + 175
V/ns
°C
Thermal Resistance
Typ.
Max.
Units
RθJL
Junction-to-Drain Lead
Parameter
–––
20
°C/W
RθJA
Junction-to-Ambient
–––
62.5
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fg
1
08/02/10
IRF7103QPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
∆V(BR)DSS/∆TJ
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
gfs
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
V(BR)DSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min.
50
–––
–––
–––
1.0
3.4
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
0.057
–––
–––
–––
–––
–––
–––
–––
–––
10
1.2
2.8
5.1
1.7
15
2.3
255
69
29
Max. Units
Conditions
–––
V
VGS = 0V, ID = 250µA
––– V/°C Reference to 25°C, ID = 1mA
130
VGS = 10V, ID = 3.0A ‚
mΩ
200
VGS = 4.5V, ID = 1.5A ‚
3.0
V
VDS = VGS, ID = 250µA
–––
S
VDS = 15V, ID = 3.0A
2.0
VDS = 40V, VGS = 0V
µA
25
VDS = 40V, VGS = 0V, TJ = 55°C
100
VGS = 20V
nA
-100
VGS = -20V
15
ID = 2.0A
–––
nC
VDS = 40V
–––
VGS = 10V
–––
VDD = 25V ‚
–––
ID = 1.0A
ns
–––
RG = 6.0Ω
–––
RD = 25Ω
–––
VGS = 0V
–––
pF
VDS = 25V
–––
ƒ = 1.0MHz
Source-Drain Ratings and Characteristics
IS
ISM
VSD
trr
Qrr
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) 
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Min. Typ. Max. Units
–––
–––
3.0
–––
–––
12
–––
–––
–––
–––
35
45
1.2
53
67
A
V
ns
nC
Conditions
MOSFET symbol
showing the
G
integral reverse
p-n junction diode.
TJ = 25°C, IS = 1.5A, VGS = 0V
TJ = 25°C, IF = 1.5A
di/dt = 100A/µs ‚
D
S
‚
Notes:
 Repetitive rating; pulse width limited by
„ Starting TJ = 25°C, L = 4.9mH
max. junction temperature.
‚ Pulse width ≤ 400µs; duty cycle ≤ 2%.
ƒ Surface mounted on 1 in square Cu board
… ISD ≤ 2.0A, di/dt ≤ 155A/µs, VDD ≤ V(BR)DSS,
RG = 25Ω, IAS = 3.0A. (See Figure 12).
TJ ≤ 175°C
† Limited by TJmax , see Fig.16c, 16d, 19, 20 for typical repetitive
avalanche performance.
2
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IRF7103QPbF
100
100
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
TOP
TOP
4.5V
10
20µs PULSE WIDTH
Tj = 25°C
1
10
1
20µs PULSE WIDTH
Tj = 175°C
0.1
0.1
1
10
100
0.1
VDS , Drain-to-Source Voltage (V)
RDS(on) , Drain-to-Source On Resistance
(Normalized)
2.5
T J = 175°C
T J = 25°C
VDS = 25V
20µs PULSE WIDTH
1.00
3.0
6.0
9.0
12.0
VGS, Gate-to-Source Voltage (V)
Fig 3. Typical Transfer Characteristics
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10
100
Fig 2. Typical Output Characteristics
100.00
10.00
1
VDS, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
ID, Drain-to-Source Current (Α)
4.5V
15.0
ID = 3.0A
2.0
1.5
1.0
0.5
0.0
-60 -40 -20 0
VGS = 10V
20 40 60 80 100 120 140 160 180
TJ , Junction Temperature ( °C)
Fig 4. Normalized On-Resistance
Vs. Temperature
3
IRF7103QPbF
10000
12
VGS = 0V,
f = 1 MHZ
Ciss = Cgs + Cgd , Cds SHORTED
Crss = Cgd
1000
Ciss
Coss
100
Crss
6
3
10
1
10
0
100
0
100
ID, Drain-to-Source Current (A)
ISD , Reverse Drain Current (A)
10
TJ = 175 ° C
1
TJ = 25 ° C
V GS = 0 V
0.6
0.8
1.0
VSD ,Source-to-Drain Voltage (V)
Fig 7. Typical Source-Drain Diode
Forward Voltage
6
9
12
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
4
3
QG, Total Gate Charge (nC)
VDS , Drain-to-Source Voltage (V)
0.1
0.4
VDS = 40V
VDS = 25V
VDS = 10V
9
VGS , Gate-to-Source Voltage (V)
C, Capacitance(pF)
Coss = Cds + Cgd
I D = 2.0A
1.2
OPERATION IN THIS AREA
LIMITED BY R DS(on)
10
1
100µsec
1msec
0.1
Tc = 25°C
Tj = 175°C
Single Pulse
0.01
0
1
10msec
10
100
1000
VDS , Drain-toSource Voltage (V)
Fig 8. Maximum Safe Operating Area
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IRF7103QPbF
3.0
RD
VDS
VGS
ID , Drain Current (A)
2.4
D.U.T.
RG
+
-V DD
1.8
VGS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
1.2
Fig 10a. Switching Time Test Circuit
0.6
VDS
0.0
90%
25
50
75
100
125
150
175
TC , Case Temperature ( °C)
10%
VGS
Fig 9. Maximum Drain Current Vs.
Case Temperature
td(on)
tr
t d(off)
tf
Fig 10b. Switching Time Waveforms
Thermal Response ( Z thJA ) °C/W
100
D = 0.50
0.20
0.10
0.05
10
0.02
0.01
1
0.1
SINGLE PULSE
( THERMAL RESPONSE )
0.01
1E-006
1E-005
0.0001
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + T A
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 11. Typical Effective Transient Thermal Impedance, Junction-to-Ambient
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5
0.15
RDS (on) , Drain-to-Source On Resistance (Ω)
RDS(on) , Drain-to -Source On Resistance (Ω)
IRF7103QPbF
0.14
0.13
0.12
ID = 3.0A
0.11
0.10
0.09
4.5
6.0
7.5
9.0
10.5
12.0
13.5
15.0
2.500
2.000
1.000
0.500
0
5
10
15
20
25
30
35
40
ID , Drain Current (A)
Fig 13. Typical On-Resistance Vs. Drain
Current
Fig 12. Typical On-Resistance Vs. Gate
Voltage
2.0
70
60
1.8
50
ID = 250µA
Power (W)
V GS(th) Gate threshold Voltage (V)
VGS = 10V
0.000
-V GS, Gate -to -Source Voltage (V)
1.5
40
30
20
1.3
10
1.0
-75
-50
-25
0
25
50
75
100
125
150
TJ , Temperature ( °C )
6
VGS = 4.5V
1.500
Fig 14. Typical Threshold Voltage Vs.
Junction Temperature
0
1.00
10.00
100.00
1000.00
Time (sec)
Fig 15. Typical Power Vs. Time
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EAS , Single Pulse Avalanche Energy (mJ)
IRF7103QPbF
60
TOP
48
BOTTOM
ID
1.2A
2.5A
3.0A
15V
36
D.U.T
RG
24
DRIVER
L
VDS
+
V
- DD
IAS
20V
12
tp
A
0.01Ω
Fig 16c. Unclamped Inductive Test Circuit
0
25
50
75
100
125
150
175
Starting TJ , Junction Temperature ( °C)
V(BR)DSS
Fig 16a. Maximum Avalanche Energy
Vs. Drain Current
tp
I AS
Fig 16d. Unclamped Inductive Waveforms
Current Regulator
Same Type as D.U.T.
QG
50KΩ
12V
VGS
.2µF
.3µF
D.U.T.
QGS
+
V
- DS
QGD
VG
VGS
3mA
IG
ID
Current Sampling Resistors
Fig 17. Gate Charge Test Circuit
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Charge
Fig 18. Basic Gate Charge Waveform
7
IRF7103QPbF
1000
Duty Cycle = Single Pulse
Avalanche Current (A)
100
Allowed avalanche Current vs
avalanche pulsewidth, tav
assuming ∆ Tj = 25°C due to
avalanche losses
10
1
0.01
0.1
0.05
0.10
0.01
1.0E-08
1.0E-07
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
tav (sec)
Fig 19. Typical Avalanche Current Vs.Pulsewidth
EAR , Avalanche Energy (mJ)
25
TOP
Single Pulse
BOTTOM 10% Duty Cycle
ID = 3.0A
20
15
10
5
0
25
50
75
100
125
150
Starting T J , Junction Temperature (°C)
Fig 20. Maximum Avalanche Energy
Vs. Temperature
8
175
Notes on Repetitive Avalanche Curves , Figures 15, 16:
(For further info, see AN-1005 at www.irf.com)
1. Avalanche failures assumption:
Purely a thermal phenomenon and failure occurs at a
temperature far in excess of Tjmax. This is validated for
every part type.
2. Safe operation in Avalanche is allowed as long asTjmax is
not exceeded.
3. Equation below based on circuit and waveforms shown in
Figures 12a, 12b.
4. PD (ave) = Average power dissipation per single
avalanche pulse.
5. BV = Rated breakdown voltage (1.3 factor accounts for
voltage increase during avalanche).
6. Iav = Allowable avalanche current.
7. ∆T = Allowable rise in junction temperature, not to exceed
Tjmax (assumed as 25°C in Figure 15, 16).
tav = Average time in avalanche.
D = Duty cycle in avalanche = t av ·f
ZthJC(D, tav ) = Transient thermal resistance, see figure 11)
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC
Iav = 2DT/ [1.3·BV·Zth]
EAS (AR) = PD (ave) ·tav
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IRF7103QPbF
SO-8 Package Outline
Dimensions are shown in millimeters (inches)
D
DIM
B
5
A
8
6
7
6
H
E
1
2
3
0.25 [.010]
4
A
MIN
.0532
.0688
1.35
1.75
A1 .0040
.0098
0.10
0.25
b
.013
.020
0.33
0.51
c
.0075
.0098
0.19
0.25
D
.189
.1968
4.80
5.00
E
.1497
.1574
3.80
4.00
e
.050 BASIC
1.27 BASIC
e1
6X
e
e1
MAX
.025 BASIC
0.635 BASIC
H
.2284
.2440
5.80
6.20
K
.0099
.0196
0.25
0.50
L
.016
.050
0.40
1.27
y
0°
8°
0°
8°
K x 45°
C
y
0.10 [.004]
A1
8X b
0.25 [.010]
A
MILLIMETERS
MAX
A
5
INCHES
MIN
8X L
8X c
7
C A B
FOOT PRINT
NOT ES :
1. DIMENSIONING & T OLERANCING PER AS ME Y14.5M-1994.
8X 0.72 [.028]
2. CONT ROLLING DIMENS ION: MILLIMET ER
3. DIMENSIONS ARE SHOWN IN MILLIMET ERS [INCHES].
4. OUT LINE CONFORMS T O JEDEC OUT LINE MS -012AA.
5 DIMENSION DOES NOT INCLUDE MOLD PROT RUSIONS .
MOLD PROT RUSIONS NOT T O EXCEED 0.15 [.006].
6 DIMENSION DOES NOT INCLUDE MOLD PROT RUSIONS .
MOLD PROT RUSIONS NOT T O EXCEED 0.25 [.010].
6.46 [.255]
7 DIMENSION IS T HE LENGT H OF LEAD FOR SOLDERING T O
A S UBST RAT E.
3X 1.27 [.050]
8X 1.78 [.070]
SO-8 Part Marking
EXAMPLE: T HIS IS AN IRF 7101 (MOS FET )
INT ERNATIONAL
RECT IF IER
LOGO
YWW
XXXX
F7101
DAT E CODE (YWW)
Y = LAS T DIGIT OF T HE YEAR
WW = WEEK
LOT CODE
PART NUMBER
Notes:
1. For an Automotive Qualified version of this part please seehttp://www.irf.com/product-info/auto/
2. For the most current drawing please refer to IR website at http://www.irf.com/package/
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9
IRF7103QPbF
SO-8 Tape and Reel
TERMINAL NUMBER 1
12.3 ( .484 )
11.7 ( .461 )
8.1 ( .318 )
7.9 ( .312 )
FEED DIRECTION
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
330.00
(12.992)
MAX.
14.40 ( .566 )
12.40 ( .488 )
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
Data and specifications subject to change without notice.
This product has been designed and qualified for the Industrial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.08/2010
10
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