PANASONICBATTERY 2SC3938GQL

This product complies with the RoHS Directive (EU 2002/95/EC).
Transistors
2SC3938G
Silicon NPN epitaxial planar type
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For high-speed switching
■ Package
• Low collector-emitter saturation voltage VCE(sat)
• S-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing
• Code
SMini3-F2
• Marking Symbol: 2Y
• Pin Name
1. Base
2. Emitter
3. Collector
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■ Features
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
40
V
Collector-emitter voltage (E-B short)
VCES
40
V
Emitter-base voltage (Collector open)
VEBO
5
V
Collector current
IC
100
mA
Peak collector current
ICP
300
mA
Collector power dissipation
PC
150
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
■ Electrical Characteristics Ta = 25°C ± 3°C
Symbol
ICBO
VCB = 40 V, IE = 0
Emitter-base cutoff current (Collector open)
IEBO
VEB = 4 V, IC = 0
hFE
VCE = 1 V, IC = 10 mA
VCE(sat)
IC = 10 mA, IB = 1 mA
VBE(sat)
IC = 10 mA, IB = 1 mA
on
tin
Forward current transfer ratio *
ue
Parameter
Collector-base cutoff current (Emitter open)
Di
sc
Collector-emitter saturation voltage
Transition frequency
e/
Base-emitter saturation voltage
Conditions
VCB = 10 V, IE = −10 mA, f = 200 MHz
fT
Min
Typ
60
0.17
Max
Unit
0.1
µA
0.1
µA
200

0.25
V
1
V
450
MHz
Cob
VCB = 10 V, IE = 0, f = 1 MHz
2
Turn-on time
ton
Refer to the measurement circuit
17
ns
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Collector output capacitance
(Common base, input open circuited)
6
pF
Turn-off time
toff
17
ns
Storage time
tstg
10
ns
Pl
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank
Q
R
hFE
60 to 120
90 to 200
Publication date: April 2007
SJC00364AED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SC3938G
PC  Ta
Measurement circuit
tstg test circuit
0.1 µF
200
0.1 µF
VOUT
VOUT
A
220 Ω
50 Ω
VIN = 10 V 3.3 kΩ
VCC = 3 V
3.3 kΩ
50 Ω
VIN = 10 V 0.1 µF
1 kΩ
910 Ω
90 Ω
500 Ω
VCC = 10 V
500 Ω
50 Ω
VBB = 2 V
160
120
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VBB = −3 V
Collector power dissipation PC (mW)
ton , toff test circuit
10%
VIN
10%
VIN
10%
90%
VOUT
VOUT
ton
toff
10%
40
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90%
80
tstg
(Waveform at A)
0
0
20
40
60
80 100 120 140 160
Ambient temperature Ta (°C)
VCE(sat)  IC
Ta = 25°C
100
IB = 3.0 mA
2.5 mA
80
2.0 mA
1.5 mA
60
1.0 mA
40
0.5 mA
20
0
0
0.2
0.4
0.6
0.8
1.0
1.2
VBE(sat)  IC
IC / IB = 10
10
1
25°C
Ta = 75°C
−25°C
0.1
100
10
1
10
Ta = −25°C
25°C
75°C
1
0.1
0.01
0.01
0.1
100
1
10
100
1 000
Collector current IC (mA)
Collector current IC (mA)
Di
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hFE  IC
600
nc
Ta = 75°C
200
25°C
−25°C
100
0
0.1
1
10
Collector current IC (mA)
2
500
400
300
Pl
300
Cob  VCB
VCB = 10 V
Ta = 25°C
Transition frequency fT (MHz)
400
te
na
500
M
ain
Forward current transfer ratio hFE
e/
VCE = 1 V
fT  I E
600
100
200
100
0
−1
−10
−100
Emitter current IE (mA)
SJC00364AED
−1 000
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
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Collector-emitter voltage VCE (V)
100
Base-emitter saturation voltage VBE(sat) (V)
Collector current IC (mA)
Collector-emitter saturation voltage VCE(sat) (V)
IC  VCE
120
6
IE = 0
f = 1 MHz
Ta = 25°C
5
4
3
2
1
0
1
10
Collector-base voltage VCB (V)
100
1.25 ±0.10
1
(0.65)
±0.050
+0.05
3
2
(0.65)
0.13 −0.02
+0.05
1.30 ±0.10
0 to 0.10
±0.10
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This product complies with the RoHS Directive (EU 2002/95/EC).
SMini3-F2
Unit: mm
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.