PANASONIC DMA20101

This product complies with the RoHS Directive (EU 2002/95/EC).
DMA20101
Silicon PNP epitaxial planar type
For general amplification
 Features

Package

Basic Part Number

Code
Mini5-G3-B

Pin Name
1: Base (Tr1)
2: Emitter (Common)
3: Base (Tr2)
 Contributes to miniaturization of sets, reduction of component count.
 Eco-friendly Halogen-free package
Dual DSA2001 (Common emitter)
 Packaging
4: Collector (Tr2)
5: Collector (Tr1)
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)

Marking Symbol: A0

Absolute Maximum Ratings Ta = 25°C

Internal Connection
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
–60
V
Collector-emitter voltage (Base open)
VCEO
–50
V
Emitter-base voltage (Collector open)
VEBO
–7
V
Collector current
IC
–100
mA
Peak collector current
ICP
–200
mA
Total power dissipation
PT
300
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
(C1)
5
(C2)
4
Tr2
Tr1
1
(B1)
2
(E)
3
(B2)

Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Collector-base voltage (Emitter open)
VCBO
IC = –10 µA, IE = 0
–60
V
Collector-emitter voltage (Base open)
VCEO
IC = –2 mA, IB = 0
–50
V
Emitter-base voltage (Collector open)
VEBO
IE = –10 µA, IC = 0
–7
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = –20 V, IE = 0
– 0.1
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = –10 V, IB = 0
–100
µA
Forward current transfer ratio
hFE
VCE = –10 V, IC = –2 mA
210
460

hFE
(Small/Large)
VCE = –10 V, IC = –2 mA
0.50
hFE ratio *
Collector-emitter saturation voltage
Transition frequency
Collector output capacitance
(Common base, input open circuited)
VCE(sat)
fT
Cob
0.99

IC = –100 mA, IB = –10 mA
– 0.2
VCE = –10 V, IC = –2 mA
150
MHz
2
pF
VCB = –10 V, IE = 0, f = 1 MHz
– 0.5
V
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Ratio between 2 elements
Publication date: February 2010
ZJJ00531BED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
DMA20101
DMA20101_PT-Ta
DMA20101_IC-VCE
PT  Ta
IC  VCE
400
IB = −600 µA
300
200
100
40
80
120
160
−400 µA
−60
−40
−200 µA
−20
−100 µA
0
200
−300 µA
Ambient temperature Ta (°C)
0
−2
−4
Collector current IC (mA)
Collector-emitter saturation voltage VCE(sat) (V)
120
IC / IB = 10
−1
Ta = 85°C
−30°C
Ta = 85°C
80
−10
−100
60
−10
−100
IE = 0
f =1 MHz
Ta = 25°C
2.0
40
1.0
0
0
0.2
0.4
0.6
0.8
1.0
Base-emitter voltage VBE (V)
VCE = −10 V
Ta = 25°C
150
100
50
10
−1
Collector current IC (mA)
3.0
−30°C
fT  IC
Transition frequency fT (MHz)
0
− 0.1
4.0
25°C
250
1
100
Cob  VCB
VCE = 10 V
DMA20101_fT-IC
0
0.1
−30°C
DMA20101_Cob-VCB
20
Collector current IC (mA)
200
25°C
200
−12
25°C
−1
300
IC  VBE
100
− 0.01
− 0.1
100
Collector current IC (mA)
2
−10
Ta = 85°C
DMA20101_IC-VBE
VCE(sat)  IC
− 0.1
−8
400
Collector-emitter voltage VCE (V)
DMA20101_VCEsat-IC
−10
−6
500
Collector output capacitance
(Common base, input open circuited) Cob (pF)
0
−500 µA
−80
VCE = −10 V
Forward current transfer ratio hFE
Collector current IC (mA)
Total power dissipation PT (mW)
Ta = 25°C
hFE  IC
600
−120
−100
0
DMA20101_hFE-IC
ZJJ00531BED
1.2
0
1
10
100
Collector-base voltage VCB (V)
This product complies with the RoHS Directive (EU 2002/95/EC).
DMA20101
Mini5-G3-B
(0.65)
0.30
Unit: mm
+0.10
−0.05
0.13
+0.05
−0.02
1
2
(0.95)
(0.95)
2.8
0.4 ±0.2
+0.2
−0.3
6°
+0.25
−0.05
1.50
4
5
3
1.9 ±0.1
2.90
+0.20
−0.05
+0.3
1.1 −0.1
0 to 0.1
1.1 −0.1
+0.2
8°
ZJJ00531BED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
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equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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