DMP210DUDJ-7 - Diodes Incorporated

DMP210DUDJ
DUAL P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features
V(BR)DSS
RDS(ON)
-20V
5.5Ω @ VGS = -4.5V
7.5Ω @ VGS = -2.5V

ID
TA = +25°C
-200mA
-170mA

Dual P-Channel MOSFET
Low On-Resistance

5.5Ω @ -4.5V

7.5Ω @ -2.5V

11.5Ω @ -1.8V


17.5Ω @ -1.5V
Very Low Gate Threshold Voltage VGS(TH) <1.15V
Description

Low Input Capacitance
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching

Fast Switching Speed

ESD Protected Gate

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
performance, making it ideal for high efficiency power management
applications.

Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data

Applications

DC-DC Converters

Power Management Functions

Case: SOT963
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminal Connections: See Diagram

Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208

Weight: 0.0027 grams (approximate)
SOT963
ESD protected
Top View
D2
G1
S1
S2
G2
D1
Internal Schematic
Ordering Information (Note 4)
Part Number
DMP210DUDJ-7
Notes:
Case
SOT963
Packaging
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information (Note 5)
P1
Note:
P1 = Product Type Marking Code
5. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
DMP210DUDJ
Document number: DS31494 Rev. 9 - 2
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November 2013
© Diodes Incorporated
DMP210DUDJ
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TP = 10μs
Continuous Drain Current (Note 6) VGS = -4.5V
Continuous Drain Current (Note 6) VGS = -2.5V
Pulsed Drain Current
Value
-20
±8
-200
-150
ID
IDM
-170
-130
-600
Symbol
PD
RθJA
TJ, TSTG
Value
330
377.16
-55 to +150
ID
Units
V
V
mA
mA
mA
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Operating and Storage Temperature Range
Units
mW
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
-20






-100
-50
V
nA
nA
100
nA
µA
Test Condition
VGS = 0V, ID = -250µA
VDS = -16V, VGS = 0V
VDS = -5.0V, VGS = 0V
VGS = 5.0V, VDS = 0V
VGS = 8.0V, VDS = 0V
Zero Gate Voltage Drain Current
IDSS
Gate-Source Leakage
IGSS


ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(th)
Static Drain-Source On-Resistance
RDS(ON)
|Yfs|
VSD
-0.45





150
-0.5





20
200

-1.15
5.5
7.5
11.5
17.5


-1.2
mS
V
Ciss
Coss
Crss



13.72
4.01
2.34
27.44
8.02
4.68
pF
pF
pF
VDS = -15V, VGS = 0V
f = 1.0MHz
td(on)
tr
td(off)
tf




7.7
19.3
25.9
31.5




ns
VGS = -4.5V, VDD = -15V
ID = -180mA, RG = 2.0Ω
Forward Transfer Admittance
Diode Forward Voltage (Note 7)
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
SWITCHING CHARACTERISTICS (Note 8)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Notes:
1
V
Ω
VDS = VGS, ID = -250µA
VGS = -4.5V, ID = -100mA
VGS = -2.5V, ID = -50mA
VGS = -1.8V, ID = -20mA
VGS = -1.5V, ID = -10mA
VGS = -1.2V, ID = -1mA
VDS = -10V, ID = -0.2A
VGS = 0V, IS = -115mA
6. Device mounted on 1”x1” FR-4 substrate PC board, with minimum recommended pad layout, single sided.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMP210DUDJ
Document number: DS31494 Rev. 9 - 2
2 of 6
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November 2013
© Diodes Incorporated
0.6
0.6
0.5
0.5
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
DMP210DUDJ
0.4
0.3
0.2
0.4
0.3
0.2
0.1
0.1
VDS=5.0V
0.5
1
1.5
2
2.5
3
3.5
VDS, DRAIN-SOURCE VOLTAGE(V)
Fig. 1 Typical Output Characteristics
4
100
RDS(ON) ( ) Ave @ VGS=1.5V
10
RDS(ON) ( ) Ave @ VGS=1.8V
RDS(ON) ( ) Ave @ VGS=2.5V
RDS(ON) () Ave @ VGS=4.5V
1
0.001
0.01
0.1
ID, DRAIN-SOURCE CURRENT
Fig. 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0
0
10
1
Ave RDS(ON) (R) @ 150 C
8
7
Ave RDS(ON) (R) @ 125 C
6
5
4
Ave RDS(ON) (R) @ 85C
3
Ave RDS(ON) (R) @ 25C
2
Ave RDS(ON) (R) @ -55 C
1
0
0
0.1
0.2
0.3
0.4
ID, DRAIN CURRENT (A)
Fig. 4 Typical On-Resistance vs.
Drain Current and Temperature
0.5
12
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Normalized)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Normalized)
1.6
VGS=4.5V
9
RDS(ON)()
@VGS=4.5V, ID=200mA
1.4
1.2
RDS(ON)( )
@VGS=2.5V, ID=50mA
1.0
0.8
0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Fig. 5 On-Resisitance Variation with Temperature
DMP210DUDJ
Document number: DS31494 Rev. 9 - 2
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10
8
RDS(ON)( )
@VGS=2.5V, ID=50mA
6
4
R DS(ON)()
@V GS=4.5V, I D=200mA
2
0
-50
-25
0
25
50
75 100 125
TJ, JUNCTION TEMPERATURE (C)
Fig. 6 On-Resisitance vs.Temperature
150
November 2013
© Diodes Incorporated
DMP210DUDJ
0.6
VSD (V) @ VGS =0V
1.2
TA=25 C
0.5
IS, SOURCE CURRENT (A)
VGS(th), GATE THRESHOLD VOLTAGE (V)
1.4
1
V(th) (V) @ I D= 1mA
0.8
0.6
V(th) (V) @ I D= 250A
0.4
0.4
0.3
0.2
0.1
0.2
0
-50
0
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
100
0
0.2
0.4
0.6
0.8
1
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
10000
IDSS (nA) Ave @ 150 C
IDSS, LEAKAGE CURRENT (nA)
CT, JUNCTION CAPACITANCE (pF)
f=1MHz
CISS Ave(pF)
10
COSS Ave(pF)
C RSS Ave(pF)
1
0
1.2
1000
100
IDSS (nA) Ave @ 85C
10
IDSS (nA) Ave @ 25 C
1
IDSS (nA) Ave @ -55 C
4
8
12
16
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Typical Junction Capacitance
DMP210DUDJ
Document number: DS31494 Rev. 9 - 2
20
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0.1
0
2
4
6
8 10 12 14 16 18 20
VDS, DRAIN-SOURCE VOLTAGE(V)
Fig. 10 Typical Drain-Source Leakage Current vs. Voltage
November 2013
© Diodes Incorporated
DMP210DUDJ
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
D
e1
SOT963
Dim Min
Max Typ
A
0.40
0.50 0.45
A1
0
0.05
c
0.120 0.180 0.150
D
0.95
1.05 1.00
E
0.95
1.05 1.00
E1
0.75
0.85 0.80
L
0.05
0.15 0.10
b
0.10
0.20 0.15
e
0.35 Typ
e1
0.70 Typ
All Dimensions in mm
L
E
E1
e
b (6 places)
c
A
A1
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C
C
Dimensions Value (in mm)
C
0.350
X
0.200
Y
0.200
Y1
1.100
Y1
Y (6X)
X (6X)
DMP210DUDJ
Document number: DS31494 Rev. 9 - 2
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November 2013
© Diodes Incorporated
DMP210DUDJ
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
DMP210DUDJ
Document number: DS31494 Rev. 9 - 2
6 of 6
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November 2013
© Diodes Incorporated