VS-ST733CL Series Datasheet

VS-ST733CL Series
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Vishay Semiconductors
Inverter Grade Thyristors
(Hockey PUK Version), 940 A
FEATURES
• Metal case with ceramic insulator
• All diffused design
• Center amplifying gate
• Guaranteed high dV/dt
• Guaranteed high dI/dt
• International standard case TO-200AC (B-PUK)
• High surge current capability
• Low thermal impedance
• High speed performance
TO-200AC (B-PUK)
• Designed and qualified for industrial level
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT SUMMARY
Package
TO-200AC (B-PUK)
Diode variation
Single SCR
IT(AV)
940 A
VDRM/VRRM
400 V, 800 V
VTM
1.63 V
ITSM at 50 Hz
20 000 A
ITSM at 60 Hz
20 950 A
IGT
200 mA
TC/Ths
55 °C
TYPICAL APPLICATIONS
• Inverters
• Choppers
• Induction heating
• All types of force-commutated converters
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER
TEST CONDITIONS
IT(AV)
Ths
IT(RMS)
Ths
ITSM
I2t
VALUES
UNITS
940
A
55
°C
1900
A
25
°C
50 Hz
20 000
60 Hz
20 950
50 Hz
2000
60 Hz
1820
VDRM/VRRM
400 to 800
tq
Range
TJ
A
kA2s
V
10 to 20
μs
-40 to +125
°C
IDRM/IRRM MAXIMUM
AT TJ = TJ MAXIMUM
mA
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE NUMBER
VS-ST733C..L
VOLTAGE
CODE
VDRM/VRRM, MAXIMUM
REPETITIVE PEAK VOLTAGE
V
VRSM, MAXIMUM
NON-REPETITIVE PEAK
VOLTAGE
V
04
400
500
08
800
900
75
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CURRENT CARRYING CAPABILITY
ITM
FREQUENCY
ITM
ITM
180° el
100 µs
180° el
50 Hz
2200
1900
3580
3100
6800
5920
400 Hz
2050
1660
3600
3130
3750
3240
1000 Hz
1370
1070
2900
2450
2120
1780
2500 Hz
500
370
1220
980
960
770
Recovery voltage VR
Voltage before turn-on VD
50
50
50
VDRM
VDRM
VDRM
50
-
-
Rise of on-state current dI/dt
Heatsink temperature
40
Equivalent values for RC circuit
55
40
10/0.47
UNITS
55
10/0.47
A
V
A/μs
40
55
°C
Ω/μF
10/0.47
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average on-state
current at heatsink temperature
IT(AV)
Maximum RMS on-state current
IT(RMS)
TEST CONDITIONS
180° conduction, half sine wave
double side (single side) cooled
DC at 25 °C heatsink temperature double side cooled
t = 10 ms
Maximum peak, one half cycle,
non-repetitive surge current
ITSM
t = 8.3 ms
t = 10 ms
t = 8.3 ms
t = 10 ms
Maximum I2t for fusing
I2t
t = 8.3 ms
t = 10 ms
t = 8.3 ms
Maximum
I2√t
for fusing
Maximum peak on-state voltage
VALUES
940 (350)
A
55 (85)
°C
1900
No voltage
reapplied
20 000
100 % VRRM
reapplied
16 800
No voltage
reapplied
20 950
Sinusoidal half wave,
initial TJ = TJ maximum
100 % VRRM
reapplied
UNITS
A
17 600
2000
1820
1410
kA2s
1290
I2√t
t = 0.1 ms to 10 ms, no voltage reapplied
VTM
ITM = 1700 A, TJ = TJ maximum,
tp = 10 ms sine wave pulse
1.63
20 000
Low level value of threshold voltage
VT(TO)1
(16.7 % x π x IT(AV) < I < π x IT(AV)), TJ = TJ maximum
1.09
High level value of threshold voltage
VT(TO)2
(I > π x IT(AV)), TJ = TJ maximum
1.20
Low level value of forward slope resistance
rt1
(16.7 % x π x IT(AV) < I < π x IT(AV)), TJ = TJ maximum
0.32
High level value of forward slope
resistance
rt2
(I > π x IT(AV)), TJ = TJ maximum
0.29
Maximum holding current
IH
TJ = 25 °C, IT > 30 A
600
Typical latching current
IL
TJ = 25 °C, VA = 12 V, Ra = 6 Ω, IG = 1 A
1000
kA2√s
V
mΩ
mA
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SWITCHING
PARAMETER
SYMBOL
Maximum non-repetitive rate of rise
of turned-on current
dI/dt
Typical delay time
TJ = TJ maximum, VDRM = Rated VDRM, ITM = 2 x dI/dt
Gate pulse: 20 V 20 Ω, 10 μs 0.5 μs rise time
td
TJ = 25 °C, VDM = Rated VDRM, ITM = 50 A DC, tp = 1 μs
Resistive load, gate pulse: 10 V, 5 Ω source
tq
TJ = TJ maximum, ITM = 550 A, commutating dI/dt = 40 A/μs,
VR = 50 V, tp = 500 μs, dV/dt: see table in device code
minimum
Maximum turn-off time
TEST CONDITIONS
maximum
VALUES
UNITS
1000
A/μs
1.5
10
μs
20
BLOCKING
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum critical rate of rise of off-state voltage
dV/dt
TJ = TJ maximum, linear to 80 % VDRM,
higher value available on request
Maximum peak reverse and off-state leakage current
IRRM,
IDRM
TJ = TJ maximum, rated VDRM/VRRM applied
VALUES
UNITS
500
V/μs
75
mA
VALUES
UNITS
TRIGGERING
PARAMETER
Maximum peak gate power
Maximum average gate power
SYMBOL
PGM
PG(AV)
Maximum peak positive gate current
IGM
Maximum peak positive gate voltage
+VGM
Maximum peak negative gate voltage
-VGM
Maximum DC gate current required to trigger
IGT
Maximum DC gate voltage required to trigger
VGT
Maximum DC gate current not to trigger
IGD
Maximum DC gate voltage not to trigger
VGD
TEST CONDITIONS
TJ = TJ maximum, f = 50 Hz, d% = 50
60
10
10
TJ = TJ maximum, tp ≤ 5 ms
20
5
TJ = 25 °C, VA = 12 V, Ra = 6 Ω
TJ = TJ maximum, rated VDRM applied
W
A
V
200
mA
3
V
20
mA
0.25
V
VALUES
UNITS
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
Maximum operating junction temperature range
Maximum storage temperature range
Maximum thermal resistance, junction to heatsink
Maximum thermal resistance, case to heatsink
SYMBOL
TEST CONDITIONS
TJ
-40 to +125
TStg
-40 to +150
RthJ-hs
RthC-hs
DC operation single side cooled
0.073
DC operation double side cooled
0.031
DC operation single side cooled
0.011
DC operation double side cooled
Mounting force, ± 10 %
Approximate weight
Case style
See dimensions - link at the end of datasheet
°C
K/W
0.005
14 700
(1500)
N
(kg)
255
g
TO-200AC (B-PUK)
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ΔRthJ-hs CONDUCTION
SINUSOIDAL CONDUCTION
CONDUCTION ANGLE
RECTANGULAR CONDUCTION
SINGLE SIDE
DOUBLE SIDE
SINGLE SIDE
DOUBLE SIDE
180°
0.009
0.009
0.006
0.006
120°
0.011
0.011
0.011
0.011
90°
0.014
0.014
0.015
0.015
60°
0.020
0.021
0.021
0.022
30°
0.036
0.036
0.036
0.036
TEST CONDITIONS
UNITS
TJ = TJ maximum
K/W
Note
• The table above shows the increment of thermal resistance RthJ-hs when devices operate at different conduction angles than DC
130
ST733C..L Series
(Single Side Cooled)
R thJ-hs (DC) = 0.073 K/W
120
110
Maximum Allowable Heatsink
Temperature (°C)
Maximum Allowable Heatsink
Temperature (°C)
130
100
90
Conduction Angle
80
30°
70
60°
90°
60
120°
50
180°
40
110
100
90
Conduction Angle
80
70
60
30°
50
60°
90°
40
120°
30
180°
20
0
100
200
300
400
500
600
200
400
600
800
1000 1200 1400
Average On-state Current (A)
Fig. 1 - Current Ratings Characteristics
Fig. 3 - Current Ratings Characteristics
130
110
Maximum Allowable Heatsink
Temperature (°C)
ST733C..L Series
(Single Side Cooled)
R thJ-hs (DC) = 0.073 K/W
120
100
90
Conduction Period
80
70
60
30°
50
0
700
Average On-state Current (A)
130
Maximum Allowable Heatsink
Temperature (°C)
ST733C..L Series
(Double Side Cooled)
R thJ-hs (DC) = 0.031 K/W
120
60°
90°
40
120°
30
180°
DC
20
ST733C..L Series
(Double Side Cooled)
R thJ-hs (DC) = 0.031 K/W
120
110
100
90
Conduction Period
80
70
30°
60
60°
50
90°
40
120°
180°
30
DC
20
0
200
400
600
800
Average On-state Current (A)
Fig. 2 - Current Ratings Characteristics
1000
0
500
1000
1500
2000
Average On-state Current (A)
Fig. 4 - Current Ratings Characteristics
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20 000
180°
120°
90°
60°
30°
2000
RMS Limit
1500
1000
Conduction Angle
500
Peak Half Sine Wave
On-state Current (A)
Maximum Average On-state
Power Loss (W)
2500
400
600
800
16 000
14 000
12 000
ST733C..L Series
0
200
18 000
10 000
ST733C..L Series
TJ = 125°C
0
Maximum Non Repetitive Surge Current
Versus Pulse Train Duration. Control
Of Conduction May Not Be Maintained.
Initial TJ = 125°C
No Voltage Reapplied
Rated VRRM Reapplied
8000
0.01
1000 1200 1400
0.1
Average On-state Current (A)
Pulse Train Duration (s)
Fig. 8 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
Maximum Average On-state
Power Loss (W)
2500
2000
RMS Limit
1500
1000
Conduction Angle
500
ST733C..L Series
TJ = 125°C
0
0
200
400
600
800
1000
1200
Instantaneous On-state Current (A)
Fig. 5 - On-State Power Loss Characteristics
180°
120°
90°
60°
30°
10 000
TJ = 25 °C
1000
TJ = 125 °C
ST733C..L Series
100
0.5
1400
Average On-state Current (A)
14 000
12 000
10 000
ST733C..L Series
8000
1
10
1.5
2
2.5
3
3.5
4
4.5
Fig. 9 - On-State Voltage Drop Characteristics
100
Number Of Equal Amplitude
Half Cycle Current Pulses (N)
Fig. 7 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
ZthJ-hs - Transient Thermal Impedance (K/W)
Peak Half Sine Wave
On-state Current (A)
At Any Rated Load Condition And With
Rated VRRM Applied Following Surge.
Initial TJ = 125°C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
16 000
1
Instantaneous On-state Voltage (V)
Fig. 6 - On-State Power Loss Characteristics
18 000
1
0.1
ST733C..L Series
0.01
Steady State Value
R thJ-hs = 0.073 K/W
(Single Side Cooled)
R thJ-hs = 0.031 K/W
(Double Side Cooled)
(DC Operation)
0.001
0.001
0.01
0.1
1
10
100
Square Wave Pulse Duration (s)
Fig. 10 - Thermal Impedance ZthJC Characteristics
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VS-ST733CL Series
Vishay Semiconductors
450
I TM = 1500 A
ST733C..L Series
TJ = 125 °C
400
350
300
1000 A
250
500 A
200
150
100
50
0
10
20
30
40
50
60
70
80
90
100
dIFdt - Rate of Fall of On-State Current (A/μs)
Irr - Maximum Reverse Recovery Current (A)
Qrr - Maximum Reverse Recovery Charge (μC)
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Fig. 11 - Reverse Recovered Charge Characteristics
50 Hz
400 200100
1000
1500
2500
3000
1E3
5000
tp
ST733C..L Series
Sinusoidal pulse
TC = 40°C
1E2
1E3
500 A
100
ST733C..L Series
TJ = 125 °C
50
0
10
20
30
40
50
60
70
80
90
100
dIFdt - Rate of Fall of Forward Current (A/μs)
Snubber circuit
RS = 10 Ω
CS = 0.47 μF
VD = 80 % VDRM
1E4
400 200 100 50 Hz
1000
1500
2500
1E3
3000
5000
1E2
1E1
1000 A
150
1E5
Peak On-state Current (A)
Peak On-state Current (A)
1E4
I TM= 1500 A
200
Fig. 12 - Reverse Recovered Current Characteristics
1E5
Snubber circuit
RS = 10 Ω
CS = 0.47 μF
VD = 80 % VDRM
250
tp
ST733C..L Series
Sinusoidal pulse
TC = 55 °C
1E2
1E4
1E1
Pulse Basewidth (μs)
1E2
1E3
1E4
Pulse Basewidth (μs)
Fig. 13 - Frequency Characteristics
1E5
Snubber circuit
RS = 10 Ω
CS = 0.47 μF
VD = 80 % VDRM
tp
ST733C..L Series
Trapezoidal pulse
TC = 40°C
di/dt = 50A/μs
1E4
50 Hz
500 400 200 100
1000
1500
2000
2500
3000
1E3
Peak On-state Current (A)
Peak On-state Current (A)
1E5
Snubber circuit
RS = 10 Ω
CS = 0.47 μF
VD = 80 % VDRM
1E4
1000
1500
1E3
500 400
50 Hz
200100
2000
2500
3000
5000
1E2
tp
ST733C..L Series
Trapezoidal pulse
TC = 55 °C
di/dt = 50 A/μs
1E2
1E1
1E2
1E3
1E4
1E1
Pulse Basewidth (μs)
1E2
1E3
1E4
Pulse Basewidth (μs)
Fig. 14 - Frequency Characteristics
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1E5
Snubber circuit
RS = 10 Ω
CS = 0.47 μF
VD = 80 % VDRM
ST733C..L Series
Trapezoidal pulse
TC = 40°C
di/dt = 50A/μs
tp
1E4
500
1000
1500
2000
2500
3000
5000
1E3
400 200
100
Snubber circuit
RS = 10 Ω
CS = 0.47 μF
VD = 80 % VDRM
Peak On-state Current (A)
Peak On-state Current (A)
1E5
50 Hz
ST733C..L Series
Trapezoidal pulse
T = 55 °C
di/dt = 50A/μs
tp
1E4
500
100 50 Hz
1000
1500
2000
2500
3000
1E3
1E2
400 200
1E2
1E1
1E2
1E3
1E4
1E1
1E2
1E3
1E4
Pulse Basewidth (μs)
Pulse Basewidth (μs)
Fig. 15 - Frequency Characteristics
1E5
tp
ST733C..L Series
Sinusoidal pulse
1E4
2
3
5
Peak On-state Current (A)
Peak On-state Current (A)
1E5
20 joules per pulse
10
1
1E3
0.5
0.4
0.3
1E2
tp
1E4
1E2
1E3
20 joules per pulse
10
5
3
1E3
2
1
0.5
1E2
0.4
0.3
1E1
1E1
ST733C..L Series
Rectangular pulse
di/dt = 50 A/μs
1E1
1E4
1E1
Pulse Basewidth (μs)
1E2
1E3
1E4
Pulse Basewidth (μs)
Fig. 16 - Maximum On-State Energy Power Loss Characteristics
(1) PGM = 10 W, tp = 20 ms
(2) PGM = 20 W, tp = 10 ms
(3) PGM = 40 W, tp = 5 ms
(4) PGM = 60 W, tp = 3.3 ms
Rectangular gate pulse
a) Recommended load line for
rated di/dt : 20 V, 10 Ω; tr<= 1 μs
10
(a)
TJ = 40 °C
1
(b)
TJ = 25 °C
b) Recommended load line for
<= 30 % rated di/dt : 10 V, 10 Ω
tr <= 1 μs
TJ = 125 °C
Instantaneous Gate Voltage (V)
100
(1)
(2)
(3) (4)
VGD
IGD
0.1
0.001
Device: ST733C..L Series
0.01
0.1
Frequency Limited by PG (AV)
1
10
100
Instantaneous Gate Current (A)
Fig. 17 - Gate Characteristics
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ORDERING INFORMATION TABLE
Device code
VS-
ST
73
3
C
08
L
H
K
1
-
1
2
3
4
5
6
7
8
9
10
11
1
-
Vishay Semiconductors product
2
-
Thyristor
3
-
Essential part number
4
-
3 = fast turn-off
5
-
C = ceramic PUK
6
-
Voltage code x 100 = VRRM
(see Voltage Ratings table)
7
-
L = PUK case TO-200AC (B-PUK)
dV/dt - tq combinations available
8
-
Reapplied dV/dt code (for tq test condition)
9
-
tq code
10
-
0 = eyelet terminals
(gate and auxiliary cathode unsoldered leads)
dV/dt (V/µs)
10
12
tq (µs)
15
18
20
20
CN
CM
CL
CP
CK
50
DN
DM
DL
DP
DK
100
EN
EM
EL
EP
EK
200 400
FM* FL* HL
FP HP
FK H
1 = fast-on terminals
* Standard part number.
(gate and auxiliary cathode unsoldered leads) All other types available only on request.
2 = eyelet terminals
(gate and auxiliary cathode soldered leads)
3 = fast-on terminals
(gate and auxiliary cathode soldered leads)
11
-
Critical dV/dt:
None = 500 V/µs (standard value)
L = 1000 V/µs (special selection)
LINKS TO RELATED DOCUMENTS
Dimensions
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Outline Dimensions
Vishay Semiconductors
TO-200AC (B-PUK)
DIMENSIONS in millimeters (inches)
Creepage distance: 36.33 (1.430) minimum
Strike distance: 17.43 (0.686) minimum
0.7 (0.03) MIN.
34 (1.34) DIA. MAX.
2 places
27 (1.06) MAX.
Pin receptacle
AMP. 60598-1
0.7 (0.03) MIN.
53 (2.09) DIA. MAX.
6.2 (0.24) MIN.
20° ± 5°
58.5 (2.3) DIA. MAX.
4.7 (0.18)
36.5 (1.44)
2 holes DIA. 3.5 (0.14) x 2.5 (0.1) deep
Quote between upper and lower pole pieces has to be considered after
application of mounting force (see thermal and mechanical specification)
Document Number: 95076
Revision: 01-Aug-07
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contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
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Document Number: 91000