VS-ST183CSeries Datasheet

VS-ST183C Series
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Vishay Semiconductors
Inverter Grade Thyristors
(Hockey PUK Version), 370 A
FEATURES
• Metal case with ceramic insulator
• All diffused design
• Center amplifying gate
• International standard case TO-200AB (A-PUK)
• Guaranteed high dV/dt
• Guaranteed high dI/dt
• High surge current capability
• Low thermal impedance
TO-200AB (A-PUK)
• High speed performance
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT SUMMARY
Package
TO-200AB (A-PUK)
Diode variation
Single SCR
IT(AV)
370 A
VDRM/VRRM
400 V, 800 V
VTM
1.80 V
ITSM at 50 Hz
4900 A
ITSM at 60 Hz
5130 A
IGT
200 mA
TC/Ths
55 °C
TYPICAL APPLICATIONS
•
•
•
•
Inverters
Choppers
Induction heating
All types of force-commutated converters


MAJOR RATINGS AND CHARACTERISTICS
PARAMETER
TEST CONDITIONS
IT(AV)
Ths
IT(RMS)
Ths
ITSM
I2t
A
55
°C
690
A
25
°C
4900
60 Hz
5130
50 Hz
120
60 Hz
110
Range
TJ
UNITS
370
50 Hz
VDRM/VRRM
tq
VALUES
A
kA2s
400 to 800
V
10 to 20
μs
-40 to 125
°C
IDRM/IRRM MAXIMUM
AT TJ = TJ MAXIMUM
mA
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE NUMBER
VS-ST183C..C
VOLTAGE
CODE
VDRM/VRRM, MAXIMUM
REPETITIVE PEAK VOLTAGE
V
VRSM, MAXIMUM
NON-REPETITIVE PEAK VOLTAGE
V
04
400
500
08
800
900
40
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CURRENT CARRYING CAPABILITY
ITM
FREQUENCY
ITM
180° el
ITM
UNITS
100 µs
180° el
50 Hz
770
660
1220
1160
5450
4960
400 Hz
730
600
1270
1090
2760
2420
1000 Hz
600
490
1210
1040
1600
1370
2500 Hz
350
270
860
730
800
680
Recovery voltage Vr
Voltage before turn-on Vd
50
50
50
VDRM
VDRM
VDRM
50
-
-
Rise of on-state current dI/dt
Heatsink temperature
Equivalent values for RC circuit
40
55
47/0.22
40
55
47/0.22
40
A
V
A/μs
55
°C
μF
47/0.22
ON-STATE CONDUCTION
PARAMETER
Maximum average on-state current 
at heatsink temperature
Maximum RMS on-state current
SYMBOL
IT(AV)
IT(RMS)
TEST CONDITIONS
180° conduction, half sine wave
double side (single side) cooled
DC at 25 °C heatsink temperature double side cooled
t = 10 ms
Maximum peak, one half cycle, 
non-repetitive surge current
ITSM
t = 8.3 ms
t = 10 ms
t = 8.3 ms
t = 10 ms
Maximum I2t for fusing
I2t
t = 8.3 ms
t = 10 ms
t = 8.3 ms
VALUES
UNITS
370 (130)
A
55 (85)
°C
690
4900
No voltage 
reapplied
5130
100 % VRRM
reapplied
4310
No voltage 
reapplied
A
4120
Sinusoidal half wave,
initial TJ = TJ maximum
100 % VRRM
reapplied
120
110
85
kA2s
78
Maximum I2t for fusing
I2t
t = 0.1 to 10 ms, no voltage reapplied
1200
Maximum peak on-state voltage
VTM
ITM = 600 A, TJ = TJ maximum, 
tp = 10 ms sine wave pulse
1.80
Low level value of threshold voltage
VT(TO)1
(16.7 % x  x IT(AV) < I <  x IT(AV)), TJ = TJ maximum
1.40
High level value of threshold voltage
VT(TO)2
(I >  x IT(AV)), TJ = TJ maximum
1.45
Low level value of forward slope resistance
rt1
(16.7 % x  x IT(AV) < I <  x IT(AV)), TJ = TJ maximum
0.67
High level value of forward slope
resistance
rt2
(I >  x IT(AV)), TJ = TJ maximum
0.58
Maximum holding current
IH
TJ = 25 °C, IT > 30 A
600
Typical latching current
IL
TJ = 25 °C, VA = 12 V, Ra = 6 , IG = 1 A
1000
kA2s
V
m
mA
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SWITCHING
PARAMETER
SYMBOL
Maximum non-repetitive rate of rise
of turned on current
Typical delay time
dI/dt
TJ = TJ maximum, VDRM = Rated VDRM
ITM = 2 x dI/dt
td
TJ = 25 °C, VDM = Rated VDRM, ITM = 50 A DC, tp = 1 μs
Resistive load, gate pulse: 10 V, 5  source
tq
TJ = TJ maximum,
ITM = 300 A, commutating dI/dt = 20 A/μs
VR = 50 V, tp = 500 μs, dV/dt: See table in device code
minimum
Maximum turn-off time
TEST CONDITIONS
maximum
VALUES
UNITS
1000
A/μs
1.1
10
μs
20
BLOCKING
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
500
V/μs
Maximum critical rate of rise of off-state voltage
dV/dt
TJ = TJ maximum, linear to 80 % VDRM,
higher value available on request
Maximum peak reverse and off-state leakage current
IRRM,
IDRM
TJ = TJ maximum, rated VDRM/VRRM applied
40
mA
SYMBOL
TEST CONDITIONS
VALUES
UNITS
TRIGGERING
PARAMETER
Maximum peak gate power
Maximum average gate power
PGM
PG(AV)
Maximum peak positive gate current
IGM
Maximum peak positive gate voltage
+ VGM
Maximum peak negative gate voltage
- VGM
Maximum DC gate currrent required to trigger
IGT
Maximum DC gate voltage required to trigger
VGT
Maximum DC gate current not to trigger
IGD
Maximum DC gate voltage not to trigger
VGD
TJ = TJ maximum, f = 50 Hz, d% = 50
60
10
10
TJ = TJ maximum, tp  5 ms
20
5
TJ = 25 °C, VA = 12 V, Ra = 6 
TJ = TJ maximum, rated VDRM applied
200
W
A
V
mA
3
V
20
mA
0.25
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
Maximum operating junction temperature range
Maximum storage temperature range
Maximum thermal resistance, junction to heatsink
Maximum thermal resistance, case to heatsink
SYMBOL
TEST CONDITIONS
- 40 to 125
TStg
- 40 to 150
RthJ-hs
RthC-hs
DC operation single side cooled
0.08
DC operation single side cooled
0.033
DC operation double side cooled
0.017
Approximate weight
See dimensions - link at the end of datasheet
UNITS
°C
0.17
DC operation double side cooled
Mounting force, ± 10 %
Case style
VALUES
TJ
K/W
4900
(500)
N
(kg)
50
g
TO-200AB (A-PUK)
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RthJ-hs CONDUCTION
SINUSOIDAL CONDUCTION
CONDUCTION ANGLE
RECTANGULAR CONDUCTION
Single Side
Double Side
Single Side
Double Side
180°
0.015
0.016
0.011
0.011
120°
0.018
0.019
0.019
0.019
90°
0.024
0.024
0.026
0.026
60°
0.035
0.035
0.036
0.037
30°
0.060
0.060
0.060
0.061
TEST CONDITIONS
UNITS
TJ = TJ maximum
K/W
Note
• The table above shows the increment of thermal resistance RthJ-hs when devices operate at different conduction angles than DC

130
ST183C..C Series
(Single side cooled)
RthJ-hs (DC) = 0.17 K/W
120
110
100
90
Ø
Conduction angle
80
70
60
30°
50
60°
180°
90°
Maximum Allowable
Heatsink Temperature (°C)
Maximum Allowable
Heatsink Temperature (°C)
130
ST183C..C Series
(Double side cooled)
RthJ-hs (DC) = 0.08 K/W
120
110
100
90
Ø
80
Conduction angle
70
60
50
30°
120°
30
40
0
80
40
120
160
200
0
240
100 150 200 250 300 350 400 450
50
Average On-State Current (A)
Average On-State Current (A)
Fig. 1 - Current Ratings Characteristics
Fig. 3 - Current Ratings Characteristics
130
130
ST183C..C Series
(Single side cooled)
RthJ-hs (DC) = 0.17 K/W
110
100
90
Ø
80
Conduction period
70
60
50
30° 60° 90°
40
DC
120° 180°
30
ST183C..C Series
(Double side cooled)
RthJC (DC) = 0.08 K/W
120
Maximum Allowable
Heatsink Temperature (°C)
120
Maximum Allowable
Heatsink Temperature (°C)
180°
90°
60°
40
120°
110
100
90
Ø
80
Conduction period
70
60
50
90°
40
30°
30
20
180°
60°
DC
120°
20
0
50
100
150
200
250
300
350
Average On-State Current (A)
Fig. 2 - Current Ratings Characteristics
400
0
100
200
300
400
500
600
700
Average On-State Current (A)
Fig. 4 - Current Ratings Characteristics
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5000
1000
180°
120°
90°
60°
30°
800
700
600
RMS limit
500
400
Ø
300
Conduction angle
200
3500
3000
ST183C..C Series
2000
0.01
0
100 150 200 250 300 350 400 450
50
4000
2500
ST183C..C Series
TJ = 125 °C
100
0
Maximum non-repetitive surge current
versus pulse train duration. Control
of conduction may not be maintained.
Initial TJ = 125 °C
No voltage reapplied
Rated VRRM reapplied
4500
Peak Half Sine Wave
On-State Current (A)
Maximum Average
On-State Power Loss (W)
900
0.1
Pulse Train Duration (s)
Average On-State Current (A)
Fig. 5 - On-State Power Loss Characteristics
Fig. 8 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
DC
180°
120°
90°
60°
30°
1200
1000
800
RMS limit
600
Ø
400
Conduction period
200
ST183C..C Series
TJ = 125 °C
0
0
100
200
400
300
500
600
Instantaneous On-State Voltage (A)
Maximum Average
On-State Power Loss (W)
1400
10 000
ST183C..C Series
1000
TJ = 25 °C
TJ = 125 °C
100
1
700
1.5
2
2.5
3
3.5
4
4.5
Instantaneous On-State Voltage (V)
Average On-State Current (A)
Fig. 6 - On-State Power Loss Characteristics
Fig. 9 - On-State Voltage Drop Characteristics
4500
1
At any rated load condition and with
rated VRRM applied following surge.
Initial TJ = 125 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
4000
3500
3000
2500
ST183C..C Series
2000
1
10
100
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 7 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
ST183C..C Series
ZthJ-hs - Transient
Themal Impedance (K/W)
Peak Half Sine Wave On-State
Current (A)
1
0.1
Steady state value
RthJ-hs = 0.17 K/W
(Single side cooled)
RthJ-hs = 0.08 K/W
(Double side cooled)
(DC operation)
0.01
0.001
0.001
0.01
0.1
1
10
Square Wave Pulse Duration (s)
Fig. 10 - Thermal Impedance ZthJC Characteristics
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160
ITM = 500 A
ST183C..C Series
TJ = 125 °C
200
200 A
150
100 A
100
50 A
50
120
100
80
60
40
ST183C..C Series
TJ = 125 °C
20
0
0
0
20
40
60
80
100
0
20
40
60
80
100
dI/dt - Rate of Fall of On-State Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 11 - Reverse Recovered Charge Characteristics
Fig. 12 - Reverse Recovery Current Characteristics
Snubber circuit
Rs = 47 Ω
Cs = 0.22 µF
VD = 80 % VDRM
1000
500
50 Hz
400
200 100
1500
1000
2500
3000
5000
ST183C..C Series
Sinusoidal pulse
TC = 40 °C
tp
10 000
10 000
Peak On-State Current (A)
10 000
Peak On-State Current (A)
ITM = 500 A
ITM = 300 A
ITM = 200 A
ITM = 100 A
ITM = 50 A
140
300 A
Irr - Maximum Reverse
Recovery Current (A)
Qrr - Maximum Reverse Recovery
Charge (µC)
250
100
1000
500
1000
50 Hz
400 200 100
1500
1000
2500
3000
5000
tp
10 000
100
10
Snubber circuit
Rs = 47 Ω
Cs = 0.22 µF
VD = 80 % VDRM
ST183C..C Series
Sinusoidal pulse
TC = 55 °C
100
10 000
10
100
Pulse Basewidth (µs)
1000
10 000
Pulse Basewidth (µs)
Fig. 13 - Frequency Characteristics
10 000
Snubber circuit
Rs = 47 Ω
Cs = 0.22 µF
VD = 80 % VDRM
400 200 100
50 Hz
500
1000
1500 1000
2500
3000
5000
tp
ST183C..C Series
Trapezoidal pulse
TC = 40 °C
dI/dt = 50 A/µs
100
10
100
1000
10 000
Peak On-State Current (A)
Peak On-State Current (A)
10 000
Snubber circuit
Rs = 47 Ω
Cs = 0.22 µF
VD = 80 % VDRM
500 400 200
100
50 Hz
1000
1500 1000
2500
3000
tp
5000
ST183C..C Series
Trapezoidal pulse
TC = 55 °C
dI/dt = 50 A/µs
100
10
Pulse Basewidth (µs)
100
1000
10 000
Pulse Basewidth (µs)
Fig. 14 - Frequency Characteristics
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10 000
Snubber circuit
Rs = 47 Ω
Cs = 0.22 µF
VD = 80 % VDRM
1000
50 Hz
1000 500
2500
Peak On-State Current (A)
Peak On-State Current (A)
10 000
Vishay Semiconductors
400 200 100
1500
3000
5000
100
ST183C..C Series
Trapezoidal pulse
TC = 40 °C
dI/dt = 100 A/µs
10 000
tp
100
1000
50 Hz
1000
1500
2500
500
1000
400 200
100
3000
100
5000
ST183C..C Series
Trapezoidal pulse
TC = 55 °C
dI/dt = 100 A/µs
10 000
tp
10
10
Snubber circuit
Rs = 47 Ω
Cs = 0.22 µF
VD = 80 % VDRM
10
10 000
10
100
Pulse Basewidth (µs)
1000
10 000
Pulse Basewidth (µs)
Fig. 15 - Frequency Characteristics
100 000
Peak On-State Current (A)
Peak On-State Current (A)
100 000
20 joules per pulse
10 000
1
0.5
0.3
1000
2
4
10
0.2
0.1
100
ST183C..C Series
Sinusoidal pulse
tp
ST183C..C Series
Rectangular pulse
dI/dt = 50 A/µs
10 000
20 joules per pulse
2
4
10
1
1000
0.3 0.5
0.2
0.1
100
tp
10
10
100
1000
10
10 000
10
Pulse Basewidth (µs)
100
1000
10 000
Pulse Basewidth (µs)
Fig. 16 - Maximum On-State Energy Power Loss Characteristics
10
Rectangular gate pulse
a) Recommended load line for
rated dI/dt: 20 V, 10 Ω; tr ≤ 1 µs
b) Recommended load line for
≤ 30 % rated dI/dt: 10 V, 10 Ω
tr ≤ 1 µs
IGD
0.1
0.001
0.01
TJ = 40 °C
VGD
tp = 20 ms
tp = 10 ms
tp = 5 ms
tp = 3.3 ms
(b)
TJ = 25 °C
1
(1) PGM = 10 W,
(2) PGM = 20 W,
(3) PGM = 40 W,
(4) PGM = 60 W,
(a)
TJ = 125 °C
Instantaneous Gate Voltage (V)
100
(1)
Device: ST183C..C Series
0.1
(2)
(3) (4)
Frequency limited by PG(AV)
1
10
100
Instantaneous Gate Current (A)
Fig. 17 - Gate Characteristics
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ORDERING INFORMATION TABLE
Device code
VS-
ST
18
3
C
08
C
H
K
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Thyristor
3
-
Essential part number
4
-
3 = Fast turn-off
5
-
C = Ceramic PUK
6
-
Voltage code x 100 = VRRM (see Voltage Ratings table)
7
-
C = PUK case TO-200AB (A-PUK)
8
-
Reapplied dV/dt code (for tq test condition)
9
-
tq code
dV/dt - tq combinations available
dV/dt (V/µs)
10
12
tq (µs)
15
18
20
20
CN
CM
CL
CP
CK
50
DN
DM
DL
DP
DK
100
EN
EM
EL
EP
EK
200
FN*
FM
FL*
FP
FK
400
HN
HM
HL
HP
HK
* Standard part number.
All other types available only on request.
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95074
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Outline Dimensions
Vishay Semiconductors
TO-200AB (A-PUK)
DIMENSIONS in millimeters (inches)
Anode to gate
Creepage distance: 7.62 (0.30) minimum
Strike distance: 7.12 (0.28) minimum
19 (0.75)
DIA. MAX.
0.3 (0.01) MIN.
13.7/14.4
(0.54/0.57)
0.3 (0.01) MIN.
Gate terminal for
1.47 (0.06) DIA.
pin receptacle
19 (0.75)
DIA. MAX.
38 (1.50) DIA MAX.
2 holes 3.56 (0.14) x 1.83 (0.07) minimum deep
6.5 (0.26)
4.75 (0.19)
25° ± 5°
42 (1.65) MAX.
28 (1.10)
Quote between upper and lower pole pieces has to be considered after
application of mounting force (see thermal and mechanical specification)
Document Number: 95074
Revision: 01-Aug-07
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
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Document Number: 91000