Package Reliability

Package Reliability
Vishay Siliconix
ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAKr TSSOP-16
Stress
Sample Size
Device Hr./Cyc
Condition
Total Fails
Fail Percentage
HAST
154
15,400
130_C, 85%RH
0
0.00
Pressure Pot
165
15,840
121_, 15 PSIG
0
0.00
Solderability
20
N/A
883 M2003
0
0.00
Temp Cycle
163
81,500
−65_C−150_C
0
0.00
Document Number: 73198
25-Oct-04
www.vishay.com
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