Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR MINIQFN-16 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 165 27,720 85 °C, 85 % RH 0 0.00 BOND INT 200 150,000 200 °C + N2 0 0.00 HAST 165 165,500 130 °C, 85 % RH 0 0.00 Pressure Pot 165 15,840 121°, 15 PSIG 0 0.00 Solder DUNK 55 165 260 °C, 10 SEC 0 0.00 Solderability 45 360 883 M2003 0 0.00 Temp Cycle 220 137,500 - 65 °C - 150 °C 0 0.00 Document Number: 74408 31-Aug-06 www.vishay.com 1