AO6706 - Alpha & Omega Semiconductor

AO6706
30V N-Channel MOSFET
General Description
Product Summary
VDS (V) = 30V
ID = 3.6A (VGS = 10V)
RDS(ON) < 65mΩ (VGS = 10V)
RDS(ON) < 75mΩ (VGS = 4.5V)
RDS(ON) < 160mΩ (VGS = 2.5V)
SCHOTTKY
VDS (V) = 20V
IF = 1A
VF<[email protected]
The AO6706 uses advanced trench technology to
provide excellent R DS(ON) and low gate charge. A
Schottky diode is provided to facilitate the
implementation of a bidirectional blocking switch, or
for DC-DC conversion applications.
TSOP6
Top View
Bottom View
Top View
D
K
A
1
6
K
S
2
5
N/C
G
3
4
D
G
S
A
Pin1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TA=25°C
Continuous Drain Current A
TA=70°C
Pulsed Drain Current B
IDM
VKA
Schottky reverse voltage
TA=25°C
Continuous Forward Current A
Pulsed Forward Current
TA=70°C
B
TA=25°C
TA=70°C
TJ, TSTG
Junction and Storage Temperature Range
Parameter: Thermal Characteristics MOSFET
t ≤ 10s
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient
A
C
Maximum Junction-to-Lead
Thermal Characteristics Schottky
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient
A
C
Alpha & Omega Semiconductor, Ltd.
Steady-State
Steady-State
t ≤ 10s
Steady-State
Steady-State
Symbol
RθJA
RθJL
RθJA
RθJL
Units
V
±12
3.3
V
2.6
A
10
IF
PD
Schottky
30
IFM
Power Dissipation
Maximum Junction-to-Lead
ID
MOSFET
20
2
V
1
A
1.15
10
0.92
0.7
0.59
-55 to 150
-55 to 150
°C
Typ
Max
Units
80.3
110
117
43
150
80
109.4
135
136.5
58.5
175
80
W
°C/W
°C/W
AO6706
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
IDSS
Zero Gate Voltage Drain Current
Conditions
Min
ID=250µA, VGS=0V
Typ
V
1
TJ=55°C
5
Gate-Body leakage current
VDS=0V, VGS=±12V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250µA
1
ID(ON)
On state drain current
VGS=4.5V, VDS=5V
10
VGS=10V, ID=3.3A
TJ=125°C
1.4
65
53
75
mΩ
160
mΩ
VGS=2.5V, ID=1A
106
VDS=5V, ID=3.3A
11.7
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.81
IS
Maximum Body-Diode Continuous Current
Output Capacitance
Reverse Transfer Capacitance
Rg
Gate resistance
226
Gate Source Charge
mΩ
S
1
V
2.5
A
270
pF
39
pF
29
pF
VGS=0V, VDS=0V, f=1MHz
1.4
4
Ω
3
3.6
nC
VGS=4.5V, VDS=15V, ID=3.3A
1.4
nC
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
V
90
Forward Transconductance
VGS=0V, VDS=15V, f=1MHz
nA
1.8
44
gFS
DYNAMIC PARAMETERS
Input Capacitance
Ciss
100
64
Static Drain-Source On-Resistance
VGS=4.5V, ID=3.0A
µA
A
RDS(ON)
Crss
Units
30
VDS=24V, VGS=0V
IGSS
Coss
Max
Qgd
Gate Drain Charge
0.55
nC
tD(on)
Turn-On DelayTime
2.6
ns
tr
Turn-On Rise Time
3.2
ns
tD(off)
Turn-Off DelayTime
14.5
ns
tf
Turn-Off Fall Time
trr
Qrr
VGS=10V, VDS=15V, RL=4.7Ω,
RGEN=6Ω
2.1
IF=3.3A, dI/dt=100A/µs
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=3.3A, dI/dt=100A/µs
SCHOTTKY PARAMETERS
VF
Forward Voltage Drop
Irm
Maximum reverse leakage current
CT
IF=0.5A
10.2
ns
13
ns
nC
0.5
V
3.8
0.39
VR=16V
VR=16V, TJ=125°C
0.1
mA
20
Junction Capacitance
VR=10V
34
trr
Schottky Reverse Recovery Time
IF=1A, dI/dt=100A/µs
5.2
Qrr
Schottky Reverse Recovery Charge
IF=1A, dI/dt=100A/µs
0.8
pF
10
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
value in any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
curve provides a single pulse rating. Rev3: Nov. 2010
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AO6706
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
15
10V
3.5V
VDS=5V
8
12
4V
6V
3V
6
ID(A)
ID (A)
9
4
6
VGS=2.5V
125°C
2
3
0
25°C
0
0
1
2V (Volts)3
4
DS
Fig 1: On-Region Characteristics
5
200
0
0.5
1
1.5
2
2.5
3
VGS(Volts)
Figure 2: Transfer Characteristics
270
1.8
VGS=4.5V
ID=3.0A
RDS(ON) (mΩ )
Normalized On-Resistance
175
1.6
150
VGS=2.5V
125
1.7
VGS=10V
3.6 I =3.3A
D
1.4
100
1.2
VGS=4.5V
75
50
VGS=10V
25
0
VGS=2.5V
ID=1A
1
0.8
0
2
4
6
3.5
8
10
13
0
25
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
100
1.0E+01
ID=3.3A
90
1.0E+00
125°C
1.0E-01
70
IS (A)
RDS(ON) (mΩ )
80
125°C
1.0E-02
60
25°C
25°C
1.0E-03
50
40
1.0E-04
30
0
2
4
6
8
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
10
1.0E-05
0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
1.2
AO6706
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
400
5
VDS=15V
ID=3.3A
350
4
300
Capacitance (pF)
Ciss
VGS (Volts)
250
3
200
2
150
Coss
Crss
100
1
50
0
0
0
1
2 Q (nC) 3
4
g
Figure 7: Gate-Charge Characteristics
5
0
5
10 VDS (Volts)
15
20
25
Figure 8: Capacitance Characteristics
30
270
100.0
20
TJ(Max)=150°C
TA=25°C
TJ(Max)=150°C
TA=25°C
1.7
15
RDS(ON)
limited
10µs
100µs
10
1ms
10ms
1.0
1s
3.6
Power (W)
ID (Amps)
10.0
5
0.1s
10s
DC
0
0.001
0.1
0.1
1
10
100
(Volts) Biased Safe
VDS
Figure 9: Maximum
Forward
Operating Area (Note E)
Zθ JA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=110°C/W
13
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
0.01
100
1000