GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 32.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Fillister head, Alloy steel with black oxide finish, 0-80 fine thread , 15.875mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, 1.59mm thick. 11 Backing Plate: Anodized Aluminum 6.35mm thick. 32.225mm Recommended torque = 6.42 in lbs. Side View (Section AA) 4 1 9 3 Assembled 9.75mm + IC thickness 2 8 7 10 6 Customer's BGA IC SG-BGA-6208 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 5 11 Customer's Target PCB Status: Released Scale: - Rev: B Drawing: J. Glab Date: 10/30/06 File: SG-BGA-6208 Dwg Modified: 7/21/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View 1.25mm±0.13mm(x4) Orientation Mark *Note: BGA pattern is not symmetrical with respect to the mounting holes. 3.173mm* 1.25mm±0.13mm(x4) 1.27mm typ. 2.54mm Socket Body Size 2.798mm Ø 0.85mm±0.025mm (x2) Alignment hole 32.225mm (x4) Ø 0.635mmPad 5.08mm Ø 1.61mm±0.05mm(x4) Mounting Hole 29.725mm(x4) 34.725mm (x4) Backing Plate Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6208 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 3:1 Rev: B Drawing: J. Glab Date: 10/30/06 File: SG-BGA-6208 Dwg Modified: 7/21/09, AE PAGE 2 of 4 Compatible BGA Spec DETAIL X D Y e E 3 Øb Ø0.15 Z Ø0.30 Z X Y 0.20 TOP VIEW DETAIL BOTTOM VIEW SIDE VIEW 5 0.20 Z DIM 1 Dimensions are in millimeters. 2 Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. A1 Z 4 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 0.2 Z MAX 2.6 A A1 A MIN 0.5 0.35 b 0.9 D 27.00 BSC E 27.00 BSC e 1.27 BSC Array 20x20 SG-BGA-6208 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: B Drawing: J. Glab Date: 10/30/06 File: SG-BGA-6208 Dwg Modified: 7/21/09, AE PAGE 3 of 4 2.5mm 1.27mm (x4) 2.5mm 34.725mm 29.725mm±0.025mm (x4) 5mm 5.03mm Top View 10mm Sqr. 16mm (x4) 34.725mm Note: Backing plate holes are tapped to accept 0-80 screws. 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Backing Plate with Insulation Plate SG-BGA-6208 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: B Drawing: J. Glab Date: 10/30/06 File: SG-BGA-6208 Dwg Modified: 7/21/09, AE All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4