GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 50.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 15.815mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 50.225mm Recommended torque = 26 in lbs./ 416 in oz. 4 1 9 3 Assembled 10.11mm + IC thickness 2 8 7 Side View (Section AA) 10 6 11 SG-BGA-6207 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Customer's BGA IC 5 Status: Released Customer's Target PCB Scale: - Rev: B Drawing: J. Glab Date: 11/06/06 File: SG-BGA-6207 Dwg Modified: 7/21/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm (x4) Orientation Mark 2.6475mm 1.27mm typ. 1.25mm±0.13mm (x4) 0mm 2.54mm 2.2725mm Ø 0.85mm±0.025mm (x2) Non plated alignment hole Ø 0.635mmxPAD 50.225mm±0.125mm (x4) Socket Size Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 5.08mm Ø 1.61mm±0.05mm (x8) Non plated mounting hole 2.5mm±0.13mm 2.5mm±0.13mm 23.8625mm±0.025mm (x8) Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Backing plate size (x4) 52.725mm±0.125mm NOTE: Steel backing plate may be required based on end user's application SG-BGA-6207 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 2:1 Rev: B Drawing: J. Glab Date: 11/06/06 File: SG-BGA-6207 Dwg Modified: 7/21/09, AE PAGE 2 of 4 Compatible BGA Spec X D Y DETAIL e E Øb 3 Ø0.25 Z X Y Ø0.10 Z 0.20 1 Dimensions are in millimeters. 2 Interpret dimensions and tolerances per ASME Y14.5M-1994. 5 DETAIL 0.20 Z 3 A A1 Z BOTTOM VIEW SIDE VIEW TOP VIEW 4 DIM Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 0.2 Z Scale: - SG-BGA-6207 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 11/06/06 File: SG-BGA-6207 Dwg Modified: 7/21/09, AE MIN MAX 3.5 A A1 0.55 0.3 b 0.90 D 45.00 BSC E 45.00 BSC e 1.27 BSC Array: 35x35 Rev: B PAGE 3 of 4 2.5mm 1.27mm (x4) 2.5mm Top View 23.863mm±0.025mm (x8) 5mm 52.725mm Ø 1.61mm 0mm (x8) Drill thru -0.025mm 12.58mm Note: Backing plate holes are tapped to accept 0-80 screws. 10mm Sqr. 31.1mm (x4) 52.725mm Side View 1.59mm Insulation Plate 6.35mm Backing Plate Description: Insulation Plate and Backing Plate SG-BGA-6207 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: B Drawing: J. Glab Date: 11/06/06 File: SG-BGA-6207 Dwg Modified: 7/21/09, AE All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4