SMD Type MOSFET

MOSFET
SMD Type
P-Channel MOSFET
SI2321DS-HF (KI2321DS-HF)
SOT-23-3
Unit: mm
■ Features
0.4
+0.2
2.9 -0.1
+0.1
0.4 -0.1
3
● VDS (V) =-20V
● RDS(ON) < 57mΩ (VGS =-4.5V)
1
● RDS(ON) < 76mΩ (VGS =-2.5V)
0.55
+0.2
1.6 -0.1
+0.2
2.8 -0.1
● ID =-3.3A (VGS =-4.5V)
2
+0.02
0.15 -0.02
+0.1
0.95 -0.1
+0.1
1.9 -0.2
● RDS(ON) < 110mΩ (VGS =-1.8V)
1.1
+0.2
-0.1
● Pb−Free Package May be Available. The G−Suffix Denotes a
Pb−Free Lead Finish
0-0.1
1
3
S
+0.1
0.68 -0.1
G
1. Gate
2. Source
3. Drain
D
2
■ Absolute Maximum Ratings Ta = 25℃
Parameter
Symbol
5 sec
Steady State
Drain-Source Voltage
VDS
-20
Gate-Source Voltage
VGS
±8
Continuous Drain Current
Ta = 25℃
Ta = 70℃
Pulsed Drain Current
Power Dissipation
ID
Ta = 70℃
Thermal Resistance.Junction- to-Ambient t≤5 sec
Steady State
PD
RthJA
-2.9
-2.6
-2.3
A
-12
0.89
0.71
0.57
0.45
W
140
175
RthJF
75
Junction Temperature
TJ
150
Storage Temperature Range
Tstg
-55 to 150
Thermal Resistance.Junction- to-Foot
V
-3.3
IDM
Ta = 25℃
Unit
℃/W
℃
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MOSFET
SMD Type
P-Channel MOSFET
SI2321DS-HF (KI2321DS-HF)
■ Electrical Characteristics Ta = 25℃
Parameter
Drain-Source Breakdown Voltage
Symbol
VDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Body leakage current
IGSS
Gate Threshold Voltage
VGS(th)
Test Conditions
ID=-250μA, VGS=0V
Min
Typ
-20
-1
VDS=-16V, VGS=0V, TJ=55℃
-10
VDS=0V, VGS=±8V
VDS=VGS ID=-250μA
On state drain current
ID(ON)
-0.4
VDS=-5V, ID=-3.3A
-6
3
Coss
Reverse Transfer Capacitance
Crss
120
Total Gate Charge
Qg
8
Turn-On DelayTime
td(on)
Turn-On Rise Time
tr
Turn-Off DelayTime
td(off)
tf
Maximum Body-Diode Continuous Current
Diode Forward Voltage
*1Pulse test: PW ≤ 300us duty cycle ≤ 2%.
■ Marking
Marking
D1* F
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S
715
VGS=0V, VDS=-6V, f=1MHz *1
VGS=-4.5V, VDS=-6V, ID=-3.3A *1
pF
170
13
nC
1.2
2.2
VGS=-4.5V, VDS=-6V, RL=6Ω,RGEN=6Ω
ID=-1.0A *1
IS
VSD
mΩ
A
Output Capacitance
Qgs
V
76
gFS
Qgd
-0.9
110
Ciss
Gate Source Charge
nA
VGS=-1.8V, ID=-4A
Forward Transconductance
Gate Drain Charge
±100
VGS=-2.5V, ID=-2.8A
VGS=-4.5V, VDS=-5V
μA
57
Input Capacitance
Turn-Off Fall Time
2
RDS(On)
Unit
V
VDS=-16V, VGS=0V
VGS=-4.5V, ID=-3.3A
Static Drain-Source On-Resistance
Max
IS=-1.6A,VGS=0V
15
25
35
55
60
90
40
60
ns
-1.6
A
-1.2
V
MOSFET
SMD Type
P-Channel MOSFET
SI2321DS-HF (KI2321DS-HF)
■ Typical Characterisitics
Output Characteristics
12
2V
10
10
8
8
I D - Drain Current (A)
I D - Drain Current (A)
VGS = 4.5 thru 2.5 V
6
1.5 V
4
2
0.4
0.8
6
4
TC = 125 C
2
0.5 V
0
0.0
Transfer Characteristics
12
25 C
1.0 V
1.2
1.6
- 55 C
0
0.0
2.0
0.5
VDS - Drain-to-Source Voltage (V)
2.5
Capacitance
1200
C - Capacitance (pF)
)
r DS(on) - On-Resistance (
2.0
0.25
0.20
0.15
VGS = 1.8 V
0.10
VGS = 2.5 V
900
Ciss
600
300
Coss
0.05
Crss
VGS = 4.5 V
0.00
0
2
4
6
8
10
0
12
16
20
Normalized On-Resistance vs. Junction Temperature
1.5
r DS(on) - On-Resistance ( )
(Normalized)
2
1
0
2
8
Gate Charge
3
0
4
VDS - Drain-to-Source Voltage (V)
VDS = 10 V
ID = 3.3 A
4
0
12
ID - Drain Current (A)
5
V GS - Gate-to-Source Voltage (V)
1.5
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.30
1.0
4
6
Qg - Total Gate Charge (nC)
8
10
1.3
VGS = 4.5 V
ID = 3.3 A
1.1
0.9
0.7
0.5
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature ( C)
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MOSFET
SMD Type
P-Channel MOSFET
SI2321DS-HF (KI2321DS-HF)
■ Typical Characterisitics
20
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.5
10
TJ = 150 C
r DS(on) - On-Resistance (
I S - Source Current (A)
)
0.4
TJ = 25 C
1
0.2
ID = 3.3 A
0.1
0.0
0.1
0.0
0.3
0.2
0.4
0.6
0.8
1.0
0
1.2
1
VSD - Source-to-Drain Voltage (V)
3
4
5
6
7
8
VGS - Gate-to-Source Voltage (V)
Single Pulse Power
Threshold Voltage
0.4
10
ID = 250 A
0.3
8
0.2
6
Power (W)
V GS(th) Variance (V)
2
0.1
4
0.0
TA = 25 C
2
- 0.1
.
- 0.2
- 50
- 25
0
25
50
75
100
125
TJ - Temperature ( C)
0
150
0.01
0.1
Safe Operating Area
100
Limited
by rDS(on)
I D - Drain Current (A)
10
100 s, 10 s
1
1 ms
10 ms
100 ms
0.1
TA = 25 C
Single Pulse
dc, 100 s, 10 s, 1 s
0.01
0.1
1
10
VDS - Drain-to-Source Voltage (V)
4
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Time (sec)
100
10
100
600
MOSFET
SMD Type
P-Channel MOSFET
SI2321DS-HF (KI2321DS-HF)
■ Typical Characterisitics
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 130 C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
100
600
Square Wave Pulse Duration (sec)
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