SUBMINIATURE SOLID STATE LAMP AM2520MBC03 Features BLUE Description !SUBMINIA TURE PACKAGE. The Blue source color devices are made with GaN on !WIDE VIEWING ANGLE. SiC Light Emitting Diode. ! GULL WING LEAD. Static electricity and surge damage the LEDS. It is ! LONG recommended to use a wrist band or anti-electrostatic ! LOW LIFE - SOLID STATE RELIABILITY. PACKAGE PROFILE. ! PACKAGE glove when handling the LEDs. : 1000PCS / REEL. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO:DSAD1261 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN: L.ZHANG PAGE: 1 OF 4 Selection Guide Dic e Par t No . AM2520MBC03 Iv (m c d ) @ 20 m A L en s Ty p e BLUE (GaN) V i ew i n g An g l e Min . Ty p . 2θ1/2 18 60 20 ° WATER CLEAR Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er λpeak Peak Wavelength Blue λD Dominate Wavelength ∆λ1/2 D ev i c e Ty p . Un it s Tes t Co n d it io n s 43 0 nm I F =20mA Blue 466 nm I F =20mA Spectral Line Half-width Blue 60 nm I F =20mA pF VF=0V;f=1MHz 4.5 V I F =20mA 10 uA V R = 5V C Capacitance Blue 100 VF Forward Voltage Blue 3.8 IR Reverse Current Blue Max . Absolute Maximum Ratings at T)=25°°C P ar am e t e r B lu e Un it s Power dissipation 10 5 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating /Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO:DSAD1261 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN: L.ZHANG PAGE: 2 OF 4 Blue AM2520MBC03 SPEC NO:DSAD1261 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN: L.ZHANG PAGE: 3 OF 4 AM2520MBC03 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO:DSAD1261 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN: L.ZHANG PAGE: 4 OF 4