3.0X2.0mm SMD CHIP LED LAMP APK3020MBC BLUE Features Description !3.0mmX2.0mm SMT LED, 1.3mm THICKNESS. The Blue source color devices are made with !LOW POWER CONSUMPTION. GaN on SiC Light Emitting Diode. VIEWING ANGLE. Static electricity and surge damage the LEDS. It !WIDE !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE:2000PCS/REEL is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: CDA0404 APPROVED:J.LU REV NO: V.1 CHECKED: DATE: OCT/27/2001 DRAWN:Y.F.XU PAGE: 1 OF4 Selection Guide Par t No . Dic e APK3020MBC Iv (m c d ) @ 20 m A L en s Ty p e BLUE (GaN) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 3 15 12 0 ° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Blue λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 430 nm IF=20mA Blue 455 nm IF=20mA Spectral Line Halfwidth Blue 60 nm IF=20mA C Capacitance Blue 65 pF VF=0V;f=1MHz VF Forward Voltage Blue 4.0 4.5 V IF=20mA IR Reverse Current Blue 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C Par am et er B lu e Un it s Power dissipation 10 5 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operation Temperature -40°C To +80°C Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: CDA0404 APPROVED:J.LU REV NO: V.1 CHECKED: DATE: OCT/27/2001 DRAWN:Y.F.XU PAGE: 2 OF4 Blue APK3020MBC SPEC NO: CDA0404 APPROVED:J.LU REV NO: V.1 CHECKED: DATE: OCT/27/2001 DRAWN:Y.F.XU PAGE: 3 OF4 APK3020MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: CDA0404 APPROVED:J.LU REV NO: V.1 CHECKED: DATE: OCT/27/2001 DRAWN:Y.F.XU PAGE: 4 OF4