3.2X1.6mm SMD CHIP LED LAMP APK3216MBC BLUE Features Description !3.2mmX1.6mm SMT LED, 1.1mm THICKNESS. The Blue source color devices are made with GaN !LOW POWER CONSUMPTION. on SiC Light Emitting Diode. !WIDE VIEWING ANGLE. Static electricity and surge damage the LEDS. It is !IDEAL FOR BACKLIGHT AND INDICATOR. recommended to use a wrist band or anti- ! VARIOUS COLORS AND LENS TYPES AVAILABLE. electrostatic glove when handling the LEDs. !PACKAGE :2000PCS / REEL. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO:DSAD1153 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN:L.ZHANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e APK3216MBC Iv (m c d ) @ 20m A L en s Ty p e BLUE (GaN) V i ew i n g An g l e Min . Ty p . 2θ1/2 7 18 90 ° WATER CLEAR Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Blue λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 430 nm I F =2 0 mA Blue 466 nm I F =2 0 mA Spectral Line Half-width Blue 60 nm I F =2 0 mA C Capacitance Blue 100 pF V F= 0 V ; f = 1 M H z VF Forward Voltage Blue 3.8 4.5 V I F =2 0 mA IR Reverse Current Blue 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C Par am et er B lu e Un it s Power dissipation 10 5 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating / Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO:DSAD1153 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN:L.ZHANG PAGE: 2 OF 4 Blue APK3216MBC SPEC NO:DSAD1153 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN:L.ZHANG PAGE: 3 OF 4 APK3216MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO:DSAD1153 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN:L.ZHANG PAGE: 4 OF 4