3.2x2.4mm SMD CHIP LED LAMP APD3224MBC BLUE Features Description !3.2x2.4mm SMT LED, 2.4mm THICKNESS. The Blue source color devices are made with GaN on !LOW POWER CONSUMPTION. SiC Light Emitting Diode. !IDEAL FOR BACKLIGHT AND INDICATOR. Static electricity and surge damage the LEDS. It is ! VARIOUS COLORS AND LENS TYPES AVAILABLE. recommended to use a wrist band or anti-electrostatic !PACKAGE glove when handling the LEDs. : 1500PCS / REEL. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAB0008 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e APD3224MBC Iv (m c d ) @ 20 m A L en s Ty p e BLUE (GaN) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 36 80 20 ° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Absolute Maximum Ratings at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Blue λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 430 nm I F =20mA Blue 466 nm I F =20mA Spectral Line Half-width Blue 60 nm I F =20mA C Capacitance Blue 100 pF V F =0V;f =1MHz VF Forward Voltage Blue 3.8 4.5 V I F =20mA IR Reverse Current Blue 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C P ar am e t e r B lu e Un it s Power dissipation 105 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating / Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB0008 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 Blue APD3224MBC SPEC NO: DSAB0008 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APD3224MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB0008 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4