2.0x1.25mm SMD CHIP LED LAMP APTC2012MBC BLUE Features Description !2.0mmx1.25mm SMT LED,0.75mm THICKNESS. The Blue source color devices are made with GaN on !LOW SiC Light Emitting Diode. POWER CONSUMPTION. ! WIDE VIEWING ANGLE. Static electricity and surge damage the LEDS. It is !IDEAL FOR BACKLIGHT AND INDICATOR. recommended to use a wrist band or anti-electrostatic ! VARIOUS COLORS AND LENS TYPES AVAILABLE. glove when handling the LEDs. !PACKAGE : 2000PCS / REEL. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD0961 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN: S.J.HOU PAGE: 1 OF 4 Selection Guide Par t No . Dic e APTC2012MBC Iv (m c d ) @ 20 m A L en s Ty p e BLUE (GaN) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 4 10 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Blue λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 430 nm IF = 2 0 m A Blue 466 nm IF = 2 0 m A Spectral Line Half-width Blue 60 nm IF = 2 0 m A C Capacitance Blue 100 pF V F = 0 V; f = 1 M Hz VF Forward Voltage Blue 3.8 4.5 V IF = 2 0 m A IR Reverse Current Blue 10 uA VR = 5V Absolute Maximum Ratings at T)=25°°C P ar am e t e r B lu e Un it s Power dissipation 105 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating / Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD0961 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN: S.J.HOU PAGE: 2 OF 4 Blue APTC2012MBC SPEC NO: DSAD0961 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN: S.J.HOU PAGE: 3 OF 4 APTC2012MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD0961 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN: S.J.HOU PAGE: 4 OF 4