CPC1335

CPC1335
Single Pole OptoMOS® Relay with
Bi-directional Transient Protection
INTEGRATED CIRCUITS DIVISION
Parameters
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Ratings
350
Units
VP
100
35
1
mArms / mADC

mA
Transient Protection Characteristics
Peak Pulse Power
600W
VWM
40.2V
Description
The CPC1335 is a single-pole, normally open
(1-Form-A) solid state relay with bi-directional
transient voltage suppressor (TVS) relay protection,
which is designed to meet the requirements of
EN50130-4 (installation class 3).
The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient GaAlAS infrared LED, controls the
optically coupled output.
Features
• Meets Requirements of EN50130-4
(Installation Class 3)
• 3750Vrms Input/Output Isolation
• 100% Solid State
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Approvals
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Part #
CPC1335P
CPC1335PTR
Applications
•
•
•
•
•
•
•
•
•
The CPC1335 is available in an 8-pin, space-saving
surface-mount package.
Security
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Aerospace
Industrial Controls
Description
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1000/Reel)
Pin Configuration
+ Control
– Control
1
8
2
7
3
6
4
5
TVS +/TVS -/+
Load
Load
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
Pb
DS-CPC1335-R07
toff
e3
www.ixysic.com
1
INTEGRATED CIRCUITS DIVISION
CPC1335
Absolute Maximum Ratings @ 25ºC
Parameter
SSR Output Blocking Voltage
TVS Working Voltage, Maximum (VWM)
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
SSR Output Power Dissipation 2
TVS Peak Pulse Power (PPP)
(IPP=9.3A, 10/1000s pulse)
Isolation Voltage, Input to Output
Operating Temperature
Storage Temperature
1
Ratings
350
40.2
5
50
1
150
400
600
Units
VP
V
V
mA
A
mW
mW
W
3750
-40 to +85
-40 to +125
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
2
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current
Continuous 1
Peak
On-resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 3
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
3
Conditions
Symbol
Min
Typ
Max
Units
IF=2mA
t=10ms
IL=100mA
VL=350VP
IL
ILPK
RON
ILEAK
-
25
-
100
±350
35
1
mArms / mADC
mAP

VL=50V, f=1MHz
ton
toff
COUT
-
40
10
10
-
IL=100mA
IF=5mA
VR=5V
IF
VF
IR
0.9
-
1.2
-
1
1.4
10
mA
V
A
3
-
pF
IF=2mA, VL=10V
CI/O
Load current derates linearly from 100mA @ 25ºC to 70ma @ 85ºC
Measurement taken within 1 second of on-time
For applications requiring high temperature operation (greater than 60ºC) a minimum LED drive current of 3mA is recommended.
A
ms
pF
Electrical Characteristics: TVS
Parameters
Output Characteristics @ 25°C
Clamping Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
2
Conditions
Symbol
Min
Typ
Max
Units
IPP=9.3A
I=1mA
VWM=40.2V
VC
VBR
IL
44.4
-
-
66.5
5
V
V
A
www.ixysic.com
R07
INTEGRATED CIRCUITS DIVISION
CPC1335
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA, TA=25ºC)
35
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA, TA=25ºC)
25
25
20
20
20
15
10
5
15
10
5
0
1.17
Device Count (N)
25
Device Count (N)
0
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
0.50
1.00
15
10
5
35
35
30
30
25
20
15
10
0.35
0.40 0.45 0.50 0.55
LED Current (mA)
27
28
29
30
On-Resistance (:)
31
3500
1.2
IF=10mA
IF=5mA
1.0
2000
1500
1000
0.28
-20
0
20
40
60
80
Temperature (ºC)
100
120
Turn-On Time (Ps)
0.16
0.12
0
20
40
60
Temperature (ºC)
80
100
443
Typical Turn-Off
vs. LED Forward Current
(TA=25ºC)
470
468
466
10
20
30
40
LED Forward Current (mA)
50
Typical Turn-Off Time
vs. Temperature
(VL=10V)
1.0
0.9
IF=1mA
2.0
1.5
IF=2mA
1.0
0.0
-40
0
Typical Turn-On Time
vs. Temperature
(VL=10V)
IF=5mA
0.5
-20
399 410 421 432
Blocking Voltage (VP)
472
50
2.5
0.20
0.08
-40
10
20
30
40
LED Forward Current (mA)
3.0
0.24
388
462
0
Typical LED Current to Operate
vs. Temperature
(IL=70mA)
10
464
0
-40
15
474
2500
500
0.8
0.38
20
476
Turn-Off Time (Ps)
Turn-On Time (Ps)
IF=50mA
0.36
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
377
3000
1.4
0.30 0.32 0.34
Turn-Off (ms)
25
32
Turn-On Time
vs. LED Forward Current
(TA=25ºC)
Typical LED Forward Voltage Drop
vs. Temperature
1.6
0.28
0
26
0.60
1.8
5
5
0
0.30
10
0.26
5
0
15
0
1.10
Device Count (N)
20
Device Count (N)
Device Count (N)
25
LED Forward Voltage Drop (V)
0.70 0.80 0.90
Turn-On (ms)
Typical On-Resistance Distribution
(N=50, IL=120mA, TA=25ºC)
Typical IF for Switch Operation
(N=50, IL=100mA, TA=25ºC)
LED Current (mA)
0.60
Turn-Off Time (ms)
Device Count (N)
30
0.8
IF=1mA
0.7
0.6
IF=2mA
0.5
IF=5mA
0.4
0.3
-20
0
20
40
60
Temperature (ºC)
80
100
0.2
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R07
www.ixysic.com
3
INTEGRATED CIRCUITS DIVISION
CPC1335
PERFORMANCE DATA*
Typical On-Resistance
vs. Temperature
(IF=3mA, IL=50mA)
150
Load Current (mA)
40
30
20
10
160
50
0
-50
120
100
80
-20
0
20
40
60
Temperature (ºC)
80
100
40
0
425
0.014
415
410
405
-1
0
1
Load Voltage (V)
2
-20
0
20
40
60
80
0.010
0.008
0.006
0
-40
100
-20
0
Temperature (ºC)
TVS Diode Breakdown Voltage
vs. Temperature
(Pins 7 & 8)
52
25
Leakage Current (nA)
51
50
49
48
47
46
45
-40
-20
0
20
40
60
Temperature (ºC)
80
80
100
40
60
80
100
120
1s
10s 100s
Time
TVS Diode Leakage vs. Temperature
(Pins 7 & 8)
(VL=40V)
TVS Derating Curve
120
100
20
15
10
5
0
-40
100
20
40
60
Temperature (ºC)
20
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms
0.002
-40
0
Energy Rating Curve
0.012
395
-20
Temperature (ºC)
0.004
400
-40
3
Load Current (A)
Leakage (PA)
420
-2
Typical Leakage vs. Temperature
Measured Across Pins 5 & 6
(VL=350V)
Typical Blocking Voltage
vs. Temperature
0.016
I F = 2mA
20
-3
430
I F = 5mA
60
-150
-40
Blocking Voltage (VP)
140
-100
0
TVS Breakdown Voltage (V)
180
100
Peak Pulse Power (% PPP @ 25ºC)
On-Resistance (:)
50
Maximum Load Current
vs. Temperature
Load Current (mA)
60
Typical Load Current
vs. Load Voltage
(IF=5mA, TA=25ºC)
-20
0
20
40
60
Temperature (ºC)
80
100
80
60
40
20
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
PPP - Peak Pulse Current (% IPP)
TVS Pulse Waveform 10/1000 (Ps)
110
100
90
80
70
60
50
40
30
20
10
0
1
10
100
1000
104
Time (Ps)
105
106
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
www.ixysic.com
R07
INTEGRATED CIRCUITS DIVISION
CPC1335
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1335P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1335P
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R07
e3
www.ixysic.com
5
INTEGRATED CIRCUITS DIVISION
CPC1335
MECHANICAL DIMENSIONS
CPC1335P
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
2.286 MAX.
(0.090 MAX.)
PCB Land Pattern
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
9.652 ± 0.381
(0.380 ± 0.015)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
Dimensions
mm
(inches)
CPC1335PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
P = 12.00
(0.472)
User Direction of Feed
Ao = 10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1335-R07
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/16/2012