LX3051 3 Gbs LX3050 10 Gbs LX3052 10Gbs 1x4 ARRAY InGaAs PIN PHOTODIODE New Product Information and Sales Kit Manufactured by: Microsemi Integrated Products Garden Grove, CA Telephone: 714-898-8121 More than solutions – enabling possibilities LX3050/1/2 InGaAs PIN PHOTODIODES WWW . Microsemi .C OM INTRODUCTION CONFIDENTIAL INFORMATION This new product introduction guide is intended for use only by Microsemi’s sales people and authorized representatives and distributors. This material can be adapted for customer presentations, but the sales strategy and summary [pricing, availability, etc.] is confidential and should not be shown to customers DESCRIPTION Microsemi’s InGaAs Coplanar PIN Photodiode chips are ideal for high bandwidth 1310 and 1550 nm single-mode-fiber optical networking applications. The device family offers superior responsivity performance and high bandwidth with large active area in single die and 1x4 array die. The G-S-G coplanar waveguide allows very low cross-talk within the array. The LX305X family of photo diodes are currently offered in die form allowing manufacturers the versatility of custom assembly using either bond wire or flip chip configurations. This device is ideal for manufacturers of optical receivers, transceiver, transponders, optical transmission modules, and combination PIN photo diode – transimpedance amplifier. SALES KIT Copyright © 2001 Rev. 1.0 6/16/03 Page 2 New Product Information and Sales Kit LX3050/1/2 InGaAs PIN PHOTODIODES KEY PRODUCT INFORMATION WWW . Microsemi .C OM BLOCK DIAGRAM LX3051 LX3050 LX3052 KEY FEATURES LX3051 single die, 3 Gbs, 80µm active area LX3050 single die, 10 Gbs, 32µm active area LX3052 1x4 array die, 10 Gbs, 32µm active area Coplanar Waveguide, 50 ohm characteristic impedance High Responsivity Low Dark Current High Bandwidth Anode/Cathode on illuminated Side 125µm Pad pitch Die good for bond wire or flip chip applications Die good for non-hermetic packaging (passed bare-die 85/85 test) Copyright © 2001 Rev. 1.0 6/16/03 SALES KIT Page 3 New Product Information and Sales Kit LX3050/1/2 InGaAs PIN PHOTODIODES TYPICAL APPLICATION LX3051 3 Gigabit telecom, datacom, fibre channel, storage application. SONET/SDH OC48/STM16 Connections Internal Telecom and Datacom Switch/Router Connection Any optical link over single-mode fiber at a maximum distance of 40km Good for any data rate 1.25/2.5/3.125/ Gbps WWW . Microsemi .C OM • • • • • TYPICAL APPLICATION LX3050 • • • • • 10 Gigabit Ethernet, telecom, datacom, fibre channel, storage application. SONET/SDH OC192/STM64 Connections Internal Telecom and Datacom Switch/Router Connection Any optical link over single-mode fiber at a maximum distance of 40km Good for any data rate 10 to12.5 Gbps TYPICAL APPLICATION LX3052 • 4-channel parallel link to make 40 Gbs. SALES KIT Copyright © 2001 Rev. 1.0 6/16/03 Page 4 New Product Information and Sales Kit LX3050/1/2 InGaAs PIN PHOTODIODES COMPETITIVE ANALYSIS LX3051/LX3050/LX3052 Competitor Device Microsemi LX3051 80 0.95 0.43 5.8 0.4 Optospeed PDCS75T 75 0.9 0.5 5.0 10 D12A7060 60 0.9 0.7 3.1 0.1 50 0.9 0.4 4 0.1 LX3050 32 0.95 0.135 15.0 0.2 Emcore 8413-1150 32 0.9 0.18 15 0.5 Optospeed PDCS32T 32 0.9 0.15 15 10 Sumitomo F0900032 B 30 0.9 0.20 10 0.2 20 0.9 0.18 17.7 0.1 32 0.95 0.135 15.0 0.2 Luxnet XL Photonics Microsemi XL Photonics Microsemi LX3052 Notes WWW . Microsemi .C OM Aperture ResponCapacit Dark Diameter sivity ance BW (GHz) Current (µm) @1310(A/W) (pF) (nA) Total 40 Gbs None Alternative Microsemi Solutions Device Description Notes InGaAs PIN Photodiodes • Anode on top, cathode bottom for the single 3Gbs PIN MXP4003 InGaAs PIN Photodiodes • Anode on top, cathode bottom for the single 10Gbs PIN Copyright © 2001 Rev. 1.0 6/16/03 Page 5 New Product Information and Sales Kit SALES KIT MXP4002 LX3050/1/2 InGaAs PIN PHOTODIODES SALES STRATEGY Our customers make these products: photo-receiver, transceiver, and transponder. Most customers have their custom packages and want to buy bare PIN photodiode die. Customers are very technically oriented and need to work with Microsemi technical support. Potential Customers Vitesse WWW . Microsemi .C OM Customers DA Lightcom JDSU Ignis Optics Molex Luxtera Honeywell Lightron SALES KIT Copyright © 2001 Rev. 1.0 6/16/03 Page 6 New Product Information and Sales Kit LX3050/1/2 InGaAs PIN PHOTODIODES SUMMARY Pricing LX3051 LX3050 LX3052 Package DC Die Die Die Industrial (-20 to 85°C) 1000+ $4.13 $9.29 $25.29 $5.07 $13.93 $37.94 Note: Availability Samples: Production: WWW . Microsemi .C OM Device Now Now Options Packages: None Temperature: C Commercial -20 to 85 Technical Support See Microsemi’s Website Datasheet: Application Note: Evaluation Board: See Datasheet N/A Factory Contacts Technical Questions: Truc Vu (714) 372-8345 Marketing Manager: Paul Bibeau (714) 372-8046 SALES KIT Copyright © 2001 Rev. 1.0 6/16/03 Page 7 New Product Information and Sales Kit