Preliminary Data Sheet Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 LOW IF TOTEM POLE OUTPUT TYPE HIGH CMR, IPM DRIVER, 6-PIN SDIP PHOTOCOUPLER DESCRIPTION The PS9309L and PS9309L2 are optical coupled high-speed, totem pole output (active high output type) isolators containing a GaAlAs LED on the input side and a photodiode and a signal processing circuit on the output side on one chip. The PS9309L and PS9309L2 are specified high CMR and pulse width distortion with operating temperature. It is suitable for IPM drive. The PS9309L is lead bending type (Gull-wing) for surface mounting. The PS9309L2 is lead bending type for long creepage distance (Gull-wing) for surface mount. FEATURES High common mode transient immunity (CMH, CML = ±15 kV/μs MIN.) Half size of 8-pin DIP Pulse width distortion (|tPLH − tPHL| = 80 ns MAX.) High isolation voltage (BV = 5 000 Vr.m.s.) Totem pole output (Active High Output Type) Embossed tape product : PS9309L-E3, PS9309L2-E3: 2 000 pcs/reel Pb-Free product Safety standards • UL approved: No. E72422 • CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950) • SEMKO approved: No. 1115598 • DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option) PIN CONNECTION (Top View) 6 5 4 SHIELD • • • • • • • • 1 2 1. Anode 2. NC 3. Cathode 4. GND 5. VO 6. VCC 3 APPLICATIONS • IPM Driver • General purpose inverter R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 Page 1 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title PACKAGE DIMENSIONS (UNIT: mm) Lead Bending Type (Gull-wing) For Surface Mount PS9309L 4.58±0.3 6.8±0.25 (0.82) 9.7±0.3 0.25±0.15 0.2±0.15 3.5±0.2 3.7±0.25 7.62 1.27 0.4±0.1 0.8±0.25 0.25 M Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount) PS9309L2 4.58±0.3 6.8±0.25 (0.82) 11.5±0.3 1.27 0.4±0.1 R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 0.25±0.15 0.2±0.15 3.5±0.2 3.7±0.25 7.62 0.75±0.25 0.25 M Page 2 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title PHOTOCOUPLER CONSTRUCTION Parameter Air Distance (MIN.) Outer Creepage Distance (MIN.) Isolation Distance (MIN.) PS9309L 7 mm 7 mm 0.4 mm PS9309L2 8 mm 8 mm 0.4 mm BLOCK DIAGRAM 1 6 5 3 4 Shield LED Output ON H OFF L MARKING EXAMPLE R 9309 N131 Company initial Type Number Assembly Lot No. 1 pin Mark N 1 31 Week Assembled Year Assembled (Last 1 Digit) Rank Code R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 Page 3 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title ORDERING INFORMATION Part Number Order Number PS9309L PS9309L-E3 PS9309L-AX PS9309L-E3-AX PS9309L2 PS9309L2-E3 PS9309L2-AX PS9309L2-E3-AX PS9309L-V PS9309L-V-E3 PS9309L-V-AX PS9309L-V-E3-AX PS9309L2-V PS9309L2-V-E3 PS9309L2-V-AX PS9309L2-V-E3-AX Note: Solder Plating Specification Pb-Free (Ni/Pd/Au) Packing Style Safety Standard Approval 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel Standard products (UL, CSA, SEMKO approved) Application Part *1 Number PS9309L PS9309L2 DIN EN60747-5-2 (VDE0884 Part2) approved (Option) 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel PS9309L PS9309L2 *1. For the application of the Safety Standard, following part number should be used. R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 Page 4 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Diode Forward Current*1 Reverse Voltage Detector Supply Voltage Output Voltage Output Current Power Dissipation*2 Isolation Voltage *3 Operating Ambient Temperature Storage Temperature Symbol IF VR VCC VO IO PC BV TA Tstg Ratings 20 5 −0.5 to +25 −0.5 to +25 25 210 5 000 −40 to +110 −55 to +125 Unit mA V V V mA mW Vr.m.s. °C °C Notes: *1. Reduced to 0.32 mA/°C at TA = 70°C or more. *2. Reduced to 3.75 mW/°C at TA = 70°C or more *3. AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-3 shorted together, 4-6 shorted together. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Output Voltage Forward Current (ON) Forward Voltage (OFF) R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 Symbol VCC VO IF (ON) VF (OFF) MIN. 4.5 0 4 0 TYP. 15 MAX. 20 20 10 0.8 Unit V V mA V Page 5 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title ELECTRICAL CHARACTERISTICS (TA = −40 to +110°C, VCC = 4.5 to 20 V, unless otherwise specified) Parameter Forward Voltage Reverse Current Input Capacitance Diode Detector Coupled High Level Output Voltage Symbol VF IR Ct VOH Conditions IF = 10 mA, TA = 25°C VR = 3 V, TA = 25°C VF = 0 V, f = 1 MHZ, TA = 25°C MIN. 1.3 TYP.*1 1.55 30 Unit V μA pF V VCC = 4.5 V, IO = −2.6 mA, IF = 4 mA 2.7 3.2 VCC = 20 V, IO = −2.6 mA, IF = 4 mA 17.4 18.6 MAX. 1.8 10 Low Level Output Voltage *2 VOL IO = 3.5 mA, IF = 0 mA 0.25 0.6 V High Level Supply Current ICCH VCC = 4.5 V, IF = 4 mA VCC = 20 V, IF = 4 mA 0.98 1.32 3 3 mA Low Level Supply Current ICCL VCC = 4.5 V, IF = 0 mA VCC = 20 V, IF = 0 mA 3 3 mA High Level Output Short *3 Circuit Current IOSH VCC = 4.5 V, VO = GND, IF = 4 mA −7 1.23 1.53 −45 Low Level Output Short *3 Circuit Current IOSL VCC = VO = 4.5 V, VF = 0 V 7 34 Threshold Input Current IFLH VCC = 4.5 V, VO > 2.7 V, IO = −2.6 mA Isolation Resistance RI-O VI-O = 500 VDC, RH = 60%, TA = 25°C Isolation Capacitance CI-O V = 0 V, f = 1 MHz, TA = 25°C 0.6 Propagation Delay Time *4 (H → L) tPHL CL = 15 pF, IF = 4 → 0 mA, VTHHL = 1.3 V 124 200 ns Propagation Delay Time *4 (L → H) tPLH CL = 15 pF, IF = 0 → 4 mA, VTHLH = 1.3 V 113 200 ns CL = 15 pF, IF = 4 ↔ 0 mA 11 80 ns Pulse Width Distortion (PWD) ⏐tPLH-tPHL⏐ 1.57 mA mA 3 12 mA Ω 10 pF 80 Maximum Propagation Delays (PDD) Rise Time (10-90%)*4 tr CL = 15 pF, IF = 0 → 4 mA 24 ns Fall Time (90-10%)*4 tf CL = 15 pF, IF = 4 → 0 mA 3.2 ns Common Mode Transient Immunity at High *5 Level Output CMH VCC = 5 V, TA = 25°C, IF = 4 mA, ⏐VCM⏐ = 1.0 kV 15 kV/μs Common Mode Transient Immunity at Low Level Output*5 CML VCC = 5 V, TA = 25°C, IF = 0 mA, ⏐VCM⏐ = 1.0 kV 15 kV/μs Notes: *1. Typical values at TA = 25°C *2. Because VO of 2.4 V may be output when the LED current is not input and when output supply of VCC = 4.5 V or less, it is important to confirm the characteristics (operation with the power supply on and off) during design, before using this device. *3. Duration of output short circuit time should not exceed 10 ms. R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 Page 6 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title *4. Test circuit for propagation delay time Pulse input (IF) (PW = 4 μs, 1 Duty cycle = 1/10) 2 0.1 μF 5 3 Input (monitor) VCC = 4.5 V 6 VO (monitor) 4 tPLH tPHL VOH Output 90% CL = 15 pF 47 Ω IF (ON) Input 50% IF 1.3 V VO 10% tr tf VOL Remark CL includes probe and stray wiring capacitance. *5. Test circuit for common mode transient immunity IF SW 1 6 2 5 3 4 + VCC = 5 V VCM 1 kV 90% 0.1 μF 10% tr VO (monitor) − VCM = 1 kV VO (IF = 10 mA) VO (IF = 0 mA) tf VOH 2.4 V 0.6 V VOL Remark CL includes probe and stray wiring capacitance. R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 Page 7 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title TAPING SPECIFICATIONS (UNIT: mm) 7.5±0.1 1.5 +0.1 –0 4.5 MAX. 10.2±0.1 4.0±0.1 16.0±0.3 2.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 1.5 +0.1 –0 0.35 8.0±0.1 4.05±0.1 5.08±0.1 Tape Direction PS9309L-E3 Outline and Dimensions (Reel) R 1.0 100±1.0 2.0±0.5 13.0±0.2 330±2.0 2.0±0.5 21.0±0.8 17.5±1.0 21.5±1.0 Packing: 2 000 pcs/reel R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 15.9 to 19.4 Outer edge of flange Page 8 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title 11.5±0.1 1.5 +0.1 –0 4.5 MAX. 12.0±0.1 4.0±0.1 24.0±0.3 2.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 2.0 +0.1 –0 8.0±0.1 0.35 4.05±0.1 5.08±0.1 Tape Direction PS9309L2-E3 Outline and Dimensions (Reel) R 1.0 100±1.0 2.0±0.5 13.0±0.2 330±2.0 2.0±0.5 21.0±0.8 25.5±1.0 29.5±1.0 Packing: 2 000 pcs/reel R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 23.9 to 27.4 Outer edge of flange Page 9 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) B C D A Part Number Lead Bending A B C D PS9309L lead bending type (Gull-wing) for surface mount 9.2 1.27 0.8 2.2 PS9309L2 lead bending type (Gull-wing) for long creepage distance (surface mount) 10.2 1.27 0.8 2.2 R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 Page 10 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open. Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may degrade the internal noise environment of the device. Note: *1. NC: Non-Connection (No Connection). 4. Avoid storage at a high temperature and high humidity. R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 Page 11 of 12 Preliminary document Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Caution GaAs Products Chapter Title This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 Page 12 of 12 Revision History PS9309L, PS9309L2 Preliminary Data Sheet Rev. Date Page 0.01 Feb 20, 2012 − Description Summary First edition issued All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. 4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics 7. Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. http://www.renesas.com SALES OFFICES Refer to "http://www.renesas.com/" for the latest and detailed information. Renesas Electronics America Inc. 2880 Scott Boulevard Santa Clara, CA 95050-2554, U.S.A. Tel: +1-408-588-6000, Fax: +1-408-588-6130 Renesas Electronics Canada Limited 1101 Nicholson Road, Newmarket, Ontario L3Y 9C3, Canada Tel: +1-905-898-5441, Fax: +1-905-898-3220 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-585-100, Fax: +44-1628-585-900 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Düsseldorf, Germany Tel: +49-211-65030, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. 7th Floor, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100083, P.R.China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 204, 205, AZIA Center, No.1233 Lujiazui Ring Rd., Pudong District, Shanghai 200120, China Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898 Renesas Electronics Hong Kong Limited Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2886-9318, Fax: +852 2886-9022/9044 Renesas Electronics Taiwan Co., Ltd. 13F, No. 363, Fu Shing North Road, Taipei, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 1 harbourFront Avenue, #06-10, keppel Bay Tower, Singapore 098632 Tel: +65-6213-0200, Fax: +65-6278-8001 Renesas Electronics Malaysia Sdn.Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics Korea Co., Ltd. 11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea Tel: +82-2-558-3737, Fax: +82-2-558-5141 © 2012 Renesas Electronics Corporation. All rights reserved. Colophon 1.1