Product Specification Series: SMA 50Ω SMA Jack / Plug SMA – Jack, Straight Orientation, PCB Terminated SMA – Plug, Straight Orientation, Cable Terminated Other configurations available for: Vertical and right angle cable-to-board applications Sealed I/O Through-hole, surface mount, edge mount, panel mount and mixed technology Termination to various cable types Reverse polarity See www.samtec.com for more information. Revision: B Date: October 16, 2014 Page 1 © 2012 Samtec, Inc. Product Specification Series: SMA 50Ω SMA Jack / Plug 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec SMA Series. These connectors are available in vertical, edge mount and right angle. All information contained in this specification is for a straight jack board connector to a straight plug cable assembly unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at http://www.samtec.com/rf/50-ohm/sma.aspx. 3.0 TESTING 3.1 ITEM Withstanding voltage Operating temperature IP66-IP68 testing RF174 RF316 RF58 RF405 RF402 RF25S 1.13 or 0.81mm 1000 VAC 1000 VAC 1000 VAC 1000 VAC 1000 VAC 1000 VAC 200 VAC NA -50°C TO 165°C NA NA NA -65°C TO 165°C NA IP68 IP68 NA NA NA NA NA Note: IP66-IP68 testing at the panel interface only. 3.2 Electrical: ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) See Section 3.1 Pass Insulation Resistance EIA-364-21 (5000 MΩ minimum) 15,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass 3.3 Mechanical: ITEM TEST CONDITION REQUIREMENT 100 cycles (w/Env.) 1000 cycles (w/o Env) STATUS Durability EIA-364-09C Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 1.0 microsecond Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, half sine, 12.3 ft/s, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 1.0 microsecond Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass Revision: B Date: October 16, 2014 Page 2 Pass © 2012 Samtec, Inc. Product Specification Series: SMA 50Ω SMA Jack / Plug 3.4 Environmental: ITEM TEST CONDITION REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >15,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >15,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >15,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass 4.0 MATED SYSTEM 4.1 Orientations Revision: B Date: October 16, 2014 Page 3 © 2012 Samtec, Inc. Product Specification Series: SMA 50Ω SMA Jack / Plug 5.0 HIGH SPEED PERFORMANCE 5.1 Frequency Range: Cable type RF174 RF316 RF58 RF405 RF402 RF25S SMA Orientation RA ST RA ST RA ST RA ST RA ST RA ST Frequency Range 0-8.5G 0-8.5G 0-8.5G 0-8.5G 0-10G 0-10G 0-20G 0-20G 0-20G 0-20G 0-20G 0-20G 5.2 Impedance: 50 ohm 5.3 Rating: 0 - 20 GHz (cable dependent) 6.0 PROCESSING RECOMMENDATIONS 6.1 Maximum Reflow Passes: The parts can withstand 3 reflow passes at a maximum oven temperature of 260°C. 6.2 Stencil Thickness: The recommended stencil thickness is .006” (.15 mm). 6.3 Placement: Manual placement of the parts is recommended. 6.4 Thermal Profile: Due to the large number of processing variables (printed wiring board design, reflow oven type, component quantity, solder paste type, etc.), Samtec does not provide specific reflow profiles for any connector. We recommend that the solder paste manufacturer’s guidelines be followed for optimum soldering results. 6.5 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. 6.6 Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the EIA-364-11A standard. 7.0 APPLICATION INFORMATION 7.1 Mating Torque 7.1.1 Min 2 in-lb 7.1.2 Recommended 7-10 in-lb 7.1.3 Max 15 in-lb 7.1.4 Tool: 8mm or 5/16 wrench 7.2 Min Cable Bend Radius: .125 in 7.3 Assembly crimp hand tool: CAT-HT-126667-21 7.4 Cable Retention: 15 LBS (Typical) 7.5 Interface Specifications: Meet MIL-STD-348A-310 8.0 ADDITIONAL RESOURCES 8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 8.3 For additional processing information, contact our Interconnect Processing Group at [email protected] 8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] Revision: B Date: October 16, 2014 Page 4 © 2012 Samtec, Inc.