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Product Specification
Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip
S1SS Series – Socket, Cable Assembly
T1M Series – Terminal, Right Angle Orientation
Other configurations available for:
Vertical applications
See www.samtec.com for more information.
Revision: A
© Samtec, Inc.
Page 1
Product Specification
Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip
1.0 SCOPE
1.1 This specification covers performance, testing and quality requirements for Samtec S1SS/T1M Series 1,00 mm
(.0394”) Dual Beam Discrete Wire Cable Assembly and Mating Terminal Strip. All information contained in this
specification is for a right angle configuration unless otherwise noted.
2.0 DETAILED INFORMATION
2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at
www.samtec.com?S1SS and www.samtec.com?T1M.
3.0 TESTING
3.1
3.2
3.3
3.4
Current Rating: 2.2A (Sn plating, 3 adjacent contacts)
Voltage Rating: 250 VAC
Operating Temperature Range: -35°C to +85°C
Electrical:
ITEM
TEST CONDITION
REQUIREMENT
STATUS
Withstanding Voltage
EIA-364-20 (No Flashover,
Sparkover, or Breakdown)
725 VAC
Pass
Insulation Resistance
EIA-364-21 (5000 MΩ
minimum)
1,000 MΩ
Pass
Contact Resistance
(LLCR)
EIA-364-23
Δ 15 mΩ maximum
(Samtec defined)/ No damage
Pass
REQUIREMENT
STATUS
3.5 Mechanical:
ITEM
TEST CONDITION
Durability
EIA-364-09C
30 cycles
Pass
Random Vibration
EIA-364-28 Condition V, Letter B
7.56 G 'RMS', 50 to 2000 Hz, 2
hours per axis, 3 axis total , PSD
0.04
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Event Detection: No interruption >
50 nanoseconds
Pass
Mechanical Shock
EIA-364-27 100 G, 6
milliseconds, sawtooth wave,
11.3 fps, 3 shocks/direction, 3
axis (18 total shocks)
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Event Detection: No interruption >
50 nanoseconds
Pass
EIA-364-04
30 grams minimum for gold
interface
75 grams minimum for tin
interface
Pass
Normal Force
Revision: A
© Samtec, Inc.
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Product Specification
Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip
3.6 Environmental:
ITEM
TEST CONDITION
REQUIREMENT
STATUS
Thermal Shock
EIA-364-32
Thermal Cycles: 100 (30 minute dwell)
Hot Temp: +85°C
Cold Temp: -55°C
Hot/Cold Transition: Immediate
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 725 VAC
IR: >9,000 MΩ
Pass
Thermal Aging
(Temp Life)
EIA-364-17
Test Condition 4 @ 105°C Condition B
for 250 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 725 VAC
IR: >9,000 MΩ
Pass
Cyclic Humidity
EIA-364-31
Test Temp: +25°C to +65°C
Relative Humidity: 90 to 95%
Test Duration: 240 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 825 VAC
IR: >9,000 MΩ
Pass
Gas Tight
EIA-364-36
Gas Exposure: Nitric Acid Vapor
Duration: 60 min.
Drying Temp.: 50°C +/- 3°C
Measurements: Within 1 hour of
Exposure
LLCR: Δ 15 mΩ
Pass
Revision: A
© Samtec, Inc.
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Product Specification
Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip
4.0 MATED SYSTEM
4.1 Orientations & dimensions
5.0 POLARIZING FEATURES
Revision: A
© Samtec, Inc.
Page 4
Product Specification
Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip
6.0 FRICTION LATCHES FEATURES
7.0 PROCESSING RECOMMENDATIONS
7.1 Mating Angle Requirements: Cable must be axially aligned to connector when mated and un-mated.
7.1.1
Revision: A
© Samtec, Inc.
Page 5
Product Specification
Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip
7.2 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum oven temperature of
260°C.
7.3 Stencil Thickness: The recommended stencil thickness is .005” (0.13mm).
7.4 Placement: Machine placement of the parts is recommended.
7.5 Thermal Profile: Due to the large number of processing variables (printed wiring board design, reflow oven type,
component quantity, solder paste type, etc.), Samtec does not provide specific reflow profiles for any
connector. We recommend that the solder paste manufacturer’s guidelines be followed for optimum soldering
results.
7.6 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved
through Nitrogen gas infusion) in the reflow process to improve solderability.
7.7 Rework Guidelines: Samtec recommends following these rework guidelines as needed: Surface Mount
Connector Rework Methods
8.0 ADDITIONAL RESOURCES
8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at
[email protected]
8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at
[email protected]
8.3 For additional processing information, contact our Interconnect Processing Group at [email protected].
8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental
Compliance Group at [email protected]
Revision: A
© Samtec, Inc.
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