Product Specification Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip S1SS Series – Socket, Cable Assembly T1M Series – Terminal, Right Angle Orientation Other configurations available for: Vertical applications See www.samtec.com for more information. Revision: A © Samtec, Inc. Page 1 Product Specification Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec S1SS/T1M Series 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly and Mating Terminal Strip. All information contained in this specification is for a right angle configuration unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at www.samtec.com?S1SS and www.samtec.com?T1M. 3.0 TESTING 3.1 3.2 3.3 3.4 Current Rating: 2.2A (Sn plating, 3 adjacent contacts) Voltage Rating: 250 VAC Operating Temperature Range: -35°C to +85°C Electrical: ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) 725 VAC Pass Insulation Resistance EIA-364-21 (5000 MΩ minimum) 1,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass REQUIREMENT STATUS 3.5 Mechanical: ITEM TEST CONDITION Durability EIA-364-09C 30 cycles Pass Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 50 nanoseconds Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 50 nanoseconds Pass EIA-364-04 30 grams minimum for gold interface 75 grams minimum for tin interface Pass Normal Force Revision: A © Samtec, Inc. Page 2 Product Specification Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip 3.6 Environmental: ITEM TEST CONDITION REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 725 VAC IR: >9,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 725 VAC IR: >9,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >9,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass Revision: A © Samtec, Inc. Page 3 Product Specification Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip 4.0 MATED SYSTEM 4.1 Orientations & dimensions 5.0 POLARIZING FEATURES Revision: A © Samtec, Inc. Page 4 Product Specification Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip 6.0 FRICTION LATCHES FEATURES 7.0 PROCESSING RECOMMENDATIONS 7.1 Mating Angle Requirements: Cable must be axially aligned to connector when mated and un-mated. 7.1.1 Revision: A © Samtec, Inc. Page 5 Product Specification Series: S1SS / T1M 1,00 mm (.0394”) Dual Beam Discrete Wire Cable Assembly / Mating Terminal Strip 7.2 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum oven temperature of 260°C. 7.3 Stencil Thickness: The recommended stencil thickness is .005” (0.13mm). 7.4 Placement: Machine placement of the parts is recommended. 7.5 Thermal Profile: Due to the large number of processing variables (printed wiring board design, reflow oven type, component quantity, solder paste type, etc.), Samtec does not provide specific reflow profiles for any connector. We recommend that the solder paste manufacturer’s guidelines be followed for optimum soldering results. 7.6 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. 7.7 Rework Guidelines: Samtec recommends following these rework guidelines as needed: Surface Mount Connector Rework Methods 8.0 ADDITIONAL RESOURCES 8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]. 8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] Revision: A © Samtec, Inc. Page 6