BD16922EFV-M : Motor / Actuator Drivers

Datasheet
Motor/Actuator Drivers for DC Brush Motor series
Automotive 2ch
60V Max, H-bridge Drivers
BD16922EFV-M
General Description
Key Specifications
 Power Supply Voltage
8V to 36V
 Output Current
1.0A (Max)
 Output ON Resistance
(Total of upper and lower resistance)
2.25Ω (Typ)
 Operating Temperature Range
-40°C to +110°C
The BD16922EFV-M is a 1.0A-output, 2-channel
automotive reversible motor driver that allows for
operation mode selection from four modes; brake,
forward, reverse, and standby, according to two-input
logical operation. This motor driver provides high voltage
(up to a rating of 60V), low ON resistance, and compact
package, thus leading to contribution to enhancing the
reliability, reducing the power consumption, and cutting
the cost of sets.
Features



Package(s)
W (Typ) x D (Typ) x H (Max)
7.8mm×7.6mm×1.00mm
HTSSOP-B24
(Note 1)
AEC-Q100 Qualified
1 Built-in 1.0A DMOS H Bridge Output 2 Circuit
2 Input Control (Stand By, Forward Rotation,
Reverse Rotation, Brake)
 Low Standby Current
 Built-in output counter-electromotive force
absorption diode
 Built-in Overcurrent Protection Circuit (Detection
and Timer) (OCP)
 Built-in Overvoltage Protection (OVP)
 Built-in Thermal Shutdown (TSD)
 Built-in Overcurrent Protection State Output
Terminal (PO)
(Note1 : Grade 2)
Applications(Note 2)
For Automotive (Air conditioner, and door mirror)
Typical Application Circuit
5V
1
IN1P
IN2P
24
2
IN1N
IN2N
23
3
SGND1
SGND2
22
4
PO1
PO2
21
5
PGND1
PGND2
20
6
PGND1
PGND2
19
7
BD16922EFV-M
OUT1P
OUT2P
18
8
OUT1P
OUT2P
17
9
OUT1N
OUT2N
16
5V
M
M
OUT2N 15
10 OUT1N
11
PVCC1
PVCC2
14
12
PVCC1
PVCC2
13
Figure 1. Typical Application Circuit
(Note 2) Please make sure you consult our company sales representative before mass production of this IC,
if used other than Door Mirror and HVAC.
〇Product structure : Silicon monolithic integrated circuit
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
〇This product has no designed protection against radioactive rays
1/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Pin Configuration
Pin Description
(TOP VIEW)
Pin No.
Pin Name
Function
1
IN1P
Output state control
2
IN1N
Output state control
3
SGND1
4
PO1
1
IN1P
IN2P
24
2
IN1N
IN2N
23
3
SGND1
SGND2
22
4
PO1
PO2
21
5
PGND1
PGND2
20
5
PGND1
Output part GND
6
PGND1
PGND2
19
6
PGND1
Output part GND
7
OUT1P
OUT2P
18
7
OUT1P
Motor output
8
OUT1P
OUT2P
17
8
OUT1P
Motor output
9
OUT1N
OUT2N
16
9
OUT1N
Motor output
10
OUT1N
OUT2N
15
11
PVCC1
PVCC2
14
10
OUT1N
Motor output
12
PVCC1
PVCC2
13
11
PVCC1
Power supply
12
PVCC1
Power supply
13
PVCC2
Power supply
14
PVCC2
Power supply
15
OUT2N
Motor output
16
OUT2N
Motor output
17
OUT2P
Motor output
18
OUT2P
Motor output
19
PGND2
Output part GND
20
PGND2
Output part GND
21
PO2
22
SGND2
23
IN2N
Output state control
24
IN2P
Output state control
THERMAL
PAD
(GND)
Figure 2. Pin Configuration
Small signal GND
Output state output (open drain)
Output state output (open drain)
Small signal GND
Block Diagram
IN1P
Internal
Power
Supply
Internal
Power
Supply
OCP
OCP
IN2P
IN1N
IN2N
SGND1
PO1
PGND1
PGND1
SGND2
Output
State
Detection
OVP
OVP
TSD
TSD
Control State
Logic
Control State
Logic
Output
State
Detection
PO2
PGND2
PGND2
OUT1P
OUT2P
OUT1P
OUT2P
OUT1N
OUT2N
OUT1N
OUT2N
PVCC1
PVCC2
PVCC1
PVCC2
Figure 3. Block Diagram
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
2/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
VCC
60
V
VOUT
60
V
Input Voltage (PO1,2)
VPO
60
V
Input Voltage (IN1P, IN2P, IN1N, IN2N)
VIN
-0.3 to +20
V
IO
1.0
A
Pd
3.99
W
Operating Temperature Range
Topr
-40 to +110
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
150
°C
Power Supply Voltage (PVCC1,2)
Output Voltage
(OUT1P, OUT2P, OUT1N, OUT2N)
Output Current
(Note 1)
Power Dissipation
(Note 2)
Junction Temperature
(Note 1) Pd should not be exceeded
(Note 2) Derating in done 31.9 mW/°C for operating above Ta≥25°C (Mount on 4-layer 70.0mm x 70.0mm x 1.6mm board, ROHM standard
board)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an
open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in
case the IC is operated over the absolute maximum ratings.
Recommended Operating Conditions (Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
VCC
8
12
36
V
(Note 2)
VIN
-0.3
+5.0
+6.0
V
Output Voltage Range (PO1,2)
VPO
-
5.0
6.0
V
Power Supply Voltage Range
(Note 1)
Input Voltage Range
(IN1P, IN2P, IN1N, IN2N)
(Note 1) Pd should not be exceeded
(Note 2) In order to start operation while in forward or reverse mode, apply a voltage to all input pins after Vcc exceeds the minimum
operating voltage range (8V).
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Electrical Characteristics (Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
Parameter
Symbol
Limits
Min
Typ
Max
Unit
Conditions
Measurement
Circuit
Circuit Current 1
ICC1
-
0
10
μA
CH1 & CH2 : VIN ≤ 0.4V
1
Circuit Current 2
ICC2
-
4
8
mA
CH1 or CH2 : 0.4V < VIN
1
Circuit Current 3
ICC3
-
8
16
mA
CH1 & CH2 : 0.4V < VIN
1
Input H Voltage
VIH
3.0
-
-
V
1
Input L Voltage
VIL
-
-
1.0
V
1
Input H Current
IIH
25
50
100
μA
VIN = 5.0V, Inflow Current
1
Input L Current
IIL
-
0
10
μA
1
Output ON Resistance 1
RON1
-
2.25
3.50
Ω
Output ON Resistance 2
RON2
-
3.50
4.50
Ω
VIN = 0.0V, Outflow Current
Io = 0.1A to 0.8A,
Ta = -40°C to +25°C,
Upper and Lower Total
Io = 0.1A to 0.8A,
Ta = 25°C to 110°C,
Upper and Lower Total
Output Leak Current H
ILH
-
0
10
μA
VOUT = 0V, Stand-By Mode
3
Output Leak Current L
ILL
-
0
10
μA
VOUT = VCC, Stand-By Mode
3
Output Diode Voltage H
VFH
0.2
0.9
1.4
V
IO = 0.6A, VCC = 0V, Stand-By Mode
2
Output Diode Voltage L
VFL
0.2
0.9
1.4
V
IO = 0.6A, VCC = 0V, Stand-By Mode
2
VLPO
-
0.2
0.6
V
ILPO
-
0
10
μA
Overcurrent Detect Current
IOCP
1.050
1.275
1.550
A
2
Overvoltage Detect Voltage
VOVP
45
50
55
V
1
Protection Output Pin
Voltage L
Protection Output Pin
Leakage Current
(Note 1)
2
2
IPO = 3mA, For Activating the
2
Overcurrent Protection
VPO = VCC, For Activating the
3
Overcurrent Protection
(Note 1) See pages 15 and 16.
Truth Table
Input
Output
Operating Mode
IN1P, IN2P
IN1N, IN2N
OUT1P, OUT2P
OUT1N, OUT2N
H
H
L
L
Brake
H
L
H
L
Forward Rotation
L
H
L
H
Reverse Rotation
L
L
Open
Open
Stand-By
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
4/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves (Reference Data)
10
10
9
9
8
8
Circuit Current ICC1[µA]
Circuit Current ICC1[µA]
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
7
6
5
4
Ta=25°C
3
2
Ta=110°C
7
6
5
4
VCC=36V
3
VCC=12V
2
Ta=-40°C
VCC=8V
1
1
0
0
0
10
20
30
40
50
-50
60
0
8
8
7
7
6
Circuit Current ICC2[mA]
Circuit Current ICC2[mA]
150
Figure 5. Circuit Current vs Temperature
(Circuit Current 1 ICC1,
VIN=0V (Stand-By Mode))
Figure 4. Circuit Current vs Supply Voltage
(Circuit Current 1 ICC1, VCC=0V to 60V,
VIN=0V (Stand-By Mode))
Ta=110°C
5
4
Ta=25°C
Ta=-40°C
2
100
Temperature Ta[°C]
Supply Voltage VCC[V]
3
50
1
6
VCC=36V
5
VCC=12V
4
3
VCC=8V
2
1
0
0
5
10
15
20
25
30
35
40
-50
Supply Voltage VCC[V]
50
100
150
Temperature Ta[°C]
Figure 7. Circuit Current vs Temperature
(Circuit Current 2 ICC2,
CH1 : VIN=5.0V (Brake Mode),
CH2 : VIN=0V (Stand-By Mode))
Figure 6. Circuit Current vs Supply Voltage
(Circuit Current 2 ICC2,
CH1 : VIN=5.0V (Brake Mode),
CH2 : VIN=0V (Stand-By Mode))
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
0
5/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves (Reference Data)
- continued
16
16
14
14
12
Circuit Current ICC3[mA]
Circuit Current ICC3[mA]
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
Ta=110°C
10
8
Ta=25°C
6
Ta=-40°C
4
12
10
VCC=12V
8
6
2
0
0
10
15
20
25
30
35
40
VCC=8V
4
2
5
VCC=36V
-50
Supply Voltage VCC[V]
0
50
100
150
Temperature Ta[°C]
Figure 9. Circuit Current vs Temperature
(Circuit Current 3 ICC3,
VIN=5.0V (Brake Mode))
Figure 8. Circuit Current vs Supply Voltage
(Circuit Current 3 ICC3,
VIN=5.0V (Brake Mode))
8
Circuit Current ICC2[mA]
7
6
Ta=110°C
5
Ta=25°C
4
3
2
Ta=-40°C
1
0
0
5
10
15
20
Input Voltage VIN[V]
Figure 10. Circuit Current vs Input Voltage
(Circuit Current 2 ICC2, VCC=12V)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
6/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves (Reference Data)
- continued
3.0
3.0
2.8
2.8
2.6
2.6
2.4
Ta=25°C
Ta=-40°C
Input Voltage VIH[V]
Input Voltage VIH[V]
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
2.2
2.0
1.8
Ta=110°C
1.6
2.2
2.0
1.8
1.4
1.2
1.2
1.0
1.0
10
15
20
25
30
35
VCC=8V
1.6
1.4
5
VCC=36V
VCC=12V
2.4
-50
40
0
50
Figure 12. Input Voltage vs Temperature
(Input H Voltage VIH, VIN=0V→5.0V)
3.0
3.0
2.8
2.8
2.6
2.6
2.4
2.4
Input Voltage VIL[V]
Input Voltage VIL[V]
Figure 11. Input Voltage vs Supply Voltage
(Input H Voltage VIH, VIN=0V→5.0V)
2.2
Ta=25°C
Ta=-40°C
1.8
1.6
1.4
2.2
1.6
1.2
1.0
1.0
15
20
25
30
35
VCC=8V
-50
40
0
50
100
150
Temperature Ta[°C]
Supply Voltage VCC[V]
Figure 14. Input Voltage vs Temperature
(Input L Voltage VIL, VIN=5.0V→0V)
Figure 13. Input Voltage vs Supply Voltage
(Input L Voltage VIL, VIN=5.0V→0V)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
VCC=36V
1.8
1.2
10
VCC=12V
2.0
1.4
Ta=110°C
5
150
Temperature Ta[°C]
Supply Voltage VCC[V]
2.0
100
7/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves (Reference Data)
- continued
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
1.15
1.15
1.05
Ta=25°C
1.00
VCC=12V
1.10
Ta=-40°C
Input Voltage VIN[V]
Input Voltage VIN[V]
1.10
0.95
0.90
1.05
VCC=8V
1.00
VCC=36V
0.95
0.90
Ta=110°C
0.85
0.85
0.80
0.80
5
10
15
20
25
30
35
40
-50
0
Supply Voltage VCC[V]
100
450
90
350
Input Current IIH[µA]
Input Current IIH[µA]
80
Ta=110°C
Ta=25°C
250
200
Ta=-40°C
150
150
Figure 16. Input Voltage vs Temperature
(Circuit Current Active Voltage, VIN=0V→5.0V)
500
300
100
Temperature Ta[°C]
Figure 15. Input Voltage vs Supply Voltage
(Circuit Current Active Voltage, VIN=0V→5.0V)
400
50
70
60
Ta=25°C
50
40
30
100
20
50
10
0
Ta=110°C
Ta=-40°C
0
0
5
10
15
20
0
Input Voltage VIN[V]
2
3
4
5
Input Voltage VIN[V]
Figure 18. Input Current vs Input Voltage
(Input Current IIH, IIL)
Figure 17. Input Current vs Input Voltage
(Input Current IIH, IIL)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
1
8/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves (Reference Data)
- continued
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
2.5
2.5
Output On Resistance R ON[Ω]
Output On Resistance R ON[Ω]
Ta=110°C
2.0
Ta=25°C
1.5
1.0
Ta=-40°C
0.5
2.0
VCC=8V
1.5
VCC=12V
1.0
VCC=36V
0.5
0.0
0.0
0.0
0.2
0.4
0.6
0.8
0.0
1.0
0.2
0.4
0.6
0.8
1.0
Output Current Io[A]
Output Current Io[A]
Figure 20. Output On Resistance vs Output Current
(Output ON Resistance High Side, Ta=25°C)
Figure 19. Output On Resistance vs Output Current
(Output ON Resistance High Side, VCC=12V)
1.5
1.5
Output On Resistance R ON[Ω]
Output On Resistance R ON[Ω]
Ta=110°C
1.2
0.9
Ta=25°C
0.6
Ta=-40°C
0.3
0.0
1.2
VCC=12V
VCC=8V
0.9
0.6
VCC=36V
0.3
0.0
0.0
0.2
0.4
0.6
0.8
1.0
0.0
Output Current Io[A]
0.4
0.6
0.8
1.0
Output Current Io[A]
Figure 21. Output On Resistance vs Output Current
(Output ON Resistance Low Side, VCC=12V)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
0.2
Figure 22. Output On Resistance vs Output Current
(Output ON Resistance Low Side, Ta=25°C)
9/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves (Reference Data)
- continued
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
2.5
2.5
VCC=8V
Output On Resistance R ON[Ω]
Output On Resistance R ON[Ω]
Ta=110°C
2.0
Ta=25°C
1.5
1.0
Ta=-40°C
0.5
2.0
VCC=36V
1.5
VCC=12V
1.0
0.5
0.0
0.0
5
10
15
20
25
30
35
-50
40
0
50
100
150
Temperature Ta[°C]
Supply Voltage VCC[V]
Figure 24. Output On Resistance vs Temperature
(Output ON Resistance High Side, IO=0.8A)
Figure 23. Output On Resistance vs Supply Voltage
(Output ON Resistance High Side, IO=0.8A)
1.5
1.5
Output On Resistance R ON[Ω]
Output On Resistance R ON[Ω]
Ta=110°C
1.2
0.9
Ta=25°C
0.6
Ta=-40°C
0.3
0.0
1.2
VCC=8V
0.9
VCC=36V
0.6
VCC=12V
0.3
0.0
5
10
15
20
25
30
35
40
-50
Supply Voltage VCC[V]
50
100
150
Temperature Ta[°C]
Figure 25. Output On Resistance vs Supply Voltage
(Output ON Resistance Low Side, IO=0.8A)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
0
Figure 26. Output On Resistance vs Output Current
(Output ON Resistance Low Side, IO=0.8A)
10/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves (Reference Data)
- continued
10
10
9
9
8
8
7
7
Leak Current ILL[µA]
Leak Current ILH[µA]
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
6
5
4
3
6
5
4
3
2
2
1
1
0
0
0
10
20
30
40
50
0
60
10
20
40
50
60
Supply Voltage VCC[V]
Supply Voltage VCC[V]
Figure 28. Leak Current vs Supply Voltage
(Output Leak Current Low Side ILL,
VOUT=VCC, Ta=110°C)
Figure 27. Leak Current vs Supply Voltage
(Output Leak Current High Side ILH,
VOUT=0V, Ta=110°C)
1.4
1.4
Ta=-40°C
1.2
1.2
Ta=25°C
Outpu Voltage VFL[V]
Outpu Voltage VFH[V]
30
1.0
0.8
Ta=110°C
0.6
1.0
0.8
0.4
0.2
0.2
0.2
0.4
0.6
0.8
0.0
1.0
0.2
0.4
0.6
0.8
1.0
Input Current IO[A]
Input Current IO[A]
Figure 30. Output Voltage vs Input Current
(Output Diode Voltage Low Side VFL, VCC=0V)
Figure 29. Output Voltage vs Input Current
(Output Diode Voltage High Side VFH, VCC=0V)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Ta=110°C
0.6
0.4
0.0
Ta=-40°C
Ta=25°C
11/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves (Reference Data)
- continued
600
600
500
500
400
Output Voltage VLPO[mV]
Output Voltage VLPO[mV]
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
Ta=110°C
300
Ta=25°C
200
Ta=-40°C
100
400
VCC=36V
300
200
VCC=12V
VCC=8V
100
0
0
5
10
15
20
25
30
35
40
Supply Voltage VCC[V]
-50
0
50
100
150
Temperature Ta[°C]
Figure 32. PO output Voltage vs Temperature
(PO Pin Output Voltage VLPO, IPO=3mA,
For Activating the Overcurrent Protection)
Figure 31. PO Output Voltage vs Supply Voltage
(PO Pin Output Voltage VLPO, IPO=3mA,
For Activating the Overcurrent Protection)
10
9
Leak Current ILPO[µA]
8
7
6
5
4
3
2
1
0
0
10
20
30
40
50
60
Input Voltage VPO[V]
Figure 33. Leak Current vs Input Voltage
(PO Pin Leak Current ILPO, VPO=VCC, Ta=110°C)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
12/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves (Reference Data)
- continued
1.55
1.55
1.50
1.50
1.45
1.45
Output Current IOCP[A]
Output Current IOCP[A]
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
1.40
1.35
Ta=25°C
Ta=-40°C
1.30
1.25
1.20
1.15
1.40
1.35
1.25
1.20
1.15
Ta=110°C
1.10
1.10
1.05
1.05
5
10
15
20
25
30
35
Ta=25°C
1.30
Ta=-40°C
5
40
10
15
25
30
35
40
Supply Voltage VCC[V]
Supply Voltage VCC[V]
Figure 34. OCP Detect Current vs Supply Voltage
(OCP Detect Current High Side IOCP, IO=1.05A→1.55A)
Figure 35. OCP Detect Current vs Supply Voltage
(OCP Detect Current Low Side IOCP, IO=1.05A→1.55A)
1.55
1.55
1.50
1.50
1.45
1.45
Output Current IOCP[A]
Output Current IOCP[A]
20
Ta=110°C
1.40
1.35
VCC=8V
1.30
1.25
1.20
VCC=12V
1.15
1.40
1.35
1.20
1.10
1.05
1.05
0
50
100
-50
150
0
50
100
150
Temperature Ta[°C]
Temperature Ta[°C]
Figure 36. OCP Detect Current vs Temperature
(OCP Detect Current High Side IOCP, IO=1.05A→1.55A)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
VCC=12V
1.15
VCC=36V
VCC=8V
1.25
1.10
-50
VCC=36V
1.30
13/27
Figure 37. OCP Detect Current vs Temperature
(OCP Detect Current Low Side IOCP, IO=1.05A→1.55A)
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves (Reference Data)
- continued
55
50
54
49
53
48
Supply Voltage VCC[V]
Supply Voltage VCC[V]
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
52
51
50
49
48
47
46
45
44
43
47
42
46
41
45
40
-50
0
50
100
-50
150
50
100
150
Temperature Ta[°C]
Temperature Ta[°C]
Figure 39. Supply Voltage vs Temperature
(OVP Release Voltage, VCC=50V→40V)
Figure 38. Supply Voltage vs Temperature
(OVP Detect Voltage VOVP, VCC=45V→55V)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
0
14/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves Measurement Circuits (Reference Data)
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
1.
ICC1, ICC2, ICC3, VIH, VIL, IIH, IIL, VOVP
(1) ICC1
VCC=0Vto60V, VIN=0V
ICC1, ICC2, ICC3
(2) ICC2
CH1 : VIN=5.0V (Brake Mode),
CH2 : VIN=0V
VOVP
PVCC1
PVCC2
PVCC1
PVCC2
5V
5V
10μF
10μF
10kΩ
10kΩ
PO1
PO2
IN1P
IN2P
ININ
IN2N
IIH, IIL
(3) ICC3
VIN=5.0V (CH1 & CH2 : Brake Mode)
IIH, IIL
VIH, VIL
IIH, IIL
(4) VIH
VIN=0V→5.0V,
VIN for switching the operation mode
VIH, VIL
IIH, IIL
VIH, VIL
VIH, VIL
OUT1P
OUT2P
OUT1P
OUT2P
OUT1N
OUT2N
OUT1N
OUT2N
SGND1
SGND2
PGND1
PGND2
PGND1
PGND2
(5) VIL
VIN=5.0V→0V,
VIN for switching the operation mode
(6) IIH, IIL
VCC=0V, VIN=0Vto20V
(8) VOVP
VCC=45V→55V→40V
VCC for activating the overvoltage protection
Figure 40. Measurement Circuit 1
2.
RON1, RON2, VFH, VFL, VLPO, IOCP
VLPO
VLPO
0
0
PVCC1
PVCC2
PVCC1
PVCC2
5V
5V
10μF
10μF
RPO
RPO
VCC
H
L
(1) RON1, RON2
CH1, CH2 : Forward or Reverse Rotate Mode
IO=0Ato1.0A,
・High Side
Switch : L
・Low Side
Switch : H
VCC
IOCP
VFH, VFL
RON1, RON2
H
IOCP
L
VFH, VFL
RON1, RON2
PO1
PO2
IN1P
IN2P
ININ
IN2N
OUT1P
OUT2P
OUT1P
OUT2P
OUT1N
OUT2N
OUT1N
OUT2N
SGND1
SGND2
PGND1
PGND2
PGND1
PGND2
VCC
H
VCC
IOCP
VFH, VFL
RON1, RON2
IOCP
H
L
VFH, VFL
RON1, RON2
(3) VLPO
CH1, CH2 : Forward or Reverse Rotate Mode
RPO=1.6kΩ (IPO=3mA),
IO=1.55A,
Switch : H or L
(4) IOCP
CH1, CH2 : Forward or Reverse Rotate Mode
RPO=10kΩ,
IO=1.05A→1.55A,
・High Side
Switch : L
・Low Side
Switch : H
IO for activating the overcurrent protection
Figure 41. Measurement Circuit 2
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
L
(2) VFH, VFL
CH1, CH2 : Stand-By Mode
VCC=0V, VIN=0.0V,
IO=0Ato1.0A,
・VFH
Switch : H
・VFL
Switch : L
15/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Typical Performance Curves Measurement Circuits (Reference Data)
- continued
(Unless otherwise specified VCC = 8V to 36V, Ta = -40°C to +110°C)
3.
ILH, ILL, ILPO
(1) ILH, ILL
VOUT=0V→60V
(2) ILPO
VPO=0V→60V
PVCC1
PVCC2
PVCC1
PVCC2
ILPO
ILH, ILL
ILH, ILL
ILPO
PO1
PO2
IN1P
IN2P
ININ
IN2N
OUT1P
OUT2P
OUT1P
OUT2P
OUT1N
OUT2N
OUT1N
OUT2N
SGND1
SGND2
PGND1
PGND2
PGND1
PGND2
ILH, ILL
ILH, ILL
Figure 42. Measurement Circuit 3
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Timing Chart
1. Overcurrent Protection (OCP) Timing Chart (INP=H, INN=L, Forward Rotate Mode, Ta=25°C)
Normal
Abnormal
Normal
IOCP
IO
0
Operating State (H)
OUT1P/2P
Open State
Open State
OUT1N/2N
Operating State (L)
H
PO1,2
L
TOFF
TON
TON = 10μsec(Typ), 4μsec(Min), 22μsec(Max)
TOFF = 255μsec(Typ), 170μsec(Min), 340μsec(Max)
Figure 43. Overcurrent Protection Timing Chart
(1) The overcurrent protection circuit is designed to conduct protection operation by the channel (i.e.,
OUT1P&OUT1N or OUT2P&OUT2N).
(2) The overcurrent protection circuit uses an output voltage detection system (output current  output
ON resistance).
(3) If 1.275A (Typ) or more current passes through the circuit for a period of 10µsec (Typ), the protection
circuit will put the output pins into an open state for a period of 255µsec (Typ) and subsequently
return to the normal operation. If overcurrent continues to pass through the circuit even after
returning to the normal operation, the said protection operation will be repeated.
2. Overvoltage Protection (OVP) Timing Chart (INP=H, INN=L, Forward Rotate Mode, Ta=25°C)
50V(Typ)
45V(Typ)
PVCC1,2
Operating State (H)
OUT1P/2P
Open State
Open State
OUT1N/2N
Operating State (L)
H
PO1,2
L
Normal
Protection
Normal
Figure 44. Overvoltage Protection Timing Chart
(1) The overvoltage protection circuit is designed to conduct protection operation by the channel (i.e.,
OUT1P&OUT1N or OUT2P&OUT2N).
(2) If voltage applied to PVCC1or 2 pin exceeds 50V (Typ), the protection circuit will put the output pins into an
open state and if the voltage falls below 45V (Typ), it will return to the normal operation.
(3) The protection circuit is activated only while in forward, reverse, or brake mode and not activated while in
standby mode.
(4) If power supply voltage exceeds the absolute maximum rating even when the overvoltage protection circuit
is activated, the motor driver can break down.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Timing Chart
- continued
3. Thermal Shutdown (TSD) Timing Chart (INP=H, INN=L, Forward Rotate Mode)
175°C(Typ)
150°C(Typ)
Temp
Operating State (H)
OUT1P/2P
Open State
Open State
OUT1N/2N
Operating State (L)
H
PO1,2
L
Normal
Protection
Normal
Figure 45. Thermal Shutdown Timing Chart
(1) The thermal shutdown circuit is designed to conduct protection operation by the channel (i.e.,
OUT1P&OUT1N or OUT2P&OUT2N).
(2) If IC chip temperature (Tj) exceeds 175C (Typ), the circuit will put the output pins into an open state and if
the temperature falls below 150C (Typ), it will return to the normal operation.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Recommended Application Example
Input 3
(Note 1)(Note 2)
Input 4
Motor 2
5V
10μF
M
13
PVCC2
15
14
PVCC2
OUT2N
OUT2N
16
17
18
OUT2P
OUT2P
19
21
PO2
PGND2
22
SGND2
20
23
IN2N
PGND2
24
IN2P
4.7kΩ
to
100kΩ
BD16922EFV-M
PVCC1
PVCC1
11
M
5V
10μF
Motor 1
Input 1
12
OUT1N
10
OUT1P
8
OUT1N
OUT1P
7
4.7kΩ
to
100kΩ
9
PGND1
PO1
4
6
SGND1
3
PGND1
IN1N
2
5
IN1P
1
THERMAL PAD
Input 2
Figure 46. BD16922EFV-M Recommended Application Example
(Note 1) The external circuit constants shown in the diagram above represent a recommended value, respectively.
(Note 2) The external resistors PO1 and PO2 are a pull-up resistor.
Cautions on Designing of Application Circuits
1. Applicable Motors
Be noted that The BD16922EFV-M motor driver can only drive DC motors and cannot drive stepping motors. Furthermore,
in order to use this motor driver for any motors other than automotive motors (for air conditioners and door mirrors),
contact your ROHM representative.
2. Use of Only Either One of CH1 and CH2
To use only either one of CH1 and CH2, cause a short circuit between PVCC1 and PVCC2 as shown in Figure 46., and
then fix the input not to be used to the L (low) level.
3. PVCC1 and PVCC2
Be sure to mount a power supply decoupling capacitor in the vicinity of the IC pins between the power supply and the
ground. Determine the capacitance of the capacitor after fully ensuring that it presents no problems in characteristics.
Furthermore, cause a short circuit between PVCC1 and PVCC2 (set them to the same potential) before using the IC.
4. Input Pin Voltage
This IC provides guarantee for circuit operation at input H voltage and input L voltage (see page 4). Using the IC at
intermediate potential (with VIN set to 1.0V to 3.0V) may disable the normal operation of any of the protection functions.
To avoid that, apply 50mV/µs or more input voltage.
5. Counter-Electromotive Force
The counter-electromotive force may vary with operating conditions and environment, and individual motor characteristics.
Fully ensure that the counter-electromotive force presents no problems in the operation or the IC.
6. Fluctuations in Output Pin Voltage
If any output pin makes a significant fluctuation in the voltage to fall below GND potential due to heat generation
conditions, power supply, motor to be used, or other conditions, this may result in malfunctions or other failures. In such
cases, take appropriate measures, including the addition of a Schottky diode between the output pin and ground.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
19/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Cautions on Designing of Application Circuits
- Continued
7. Large-Current Lines
A large current passes through the power supply pins PVCC1 and 2 of the IC motor block and the PGND1 and 2 pins of
the motor block. This large current causes backflow depending on board pattern layout or external circuit constants such
as the capacitance of the capacitor between the power supply and ground, thus leading to malfunctions, oscillation, or
other unfavorable results. To avoid that, layout a board pattern using thick interconnects wherever possible and
recommended values like those shown in Figure 46. as external circuit constants, and then fully ensure that the layout
presents no problems in characteristics. After that, determine the board pattern layout.
8. Rush Current
This IC has no built-in circuit that limits rush currents caused by applying current to the power supply or switching
operation mode. To avoid the rush currents, take physical measures such as adding a current-limiting resistor between
PVCC1/2 pins and the power supply.
9. Thermal Pad
Since a thermal pad is connected to the sub side of this IC, connect it to the ground potential. Furthermore, do not use
the thermal pad as ground interconnect.
10. Overvoltage Protection
This IC has a built-in overvoltage protection function that protects output pins when overvoltage is applied. If voltage
applied to PVCC1 and 2 pins exceeds 50V (Typ), the output pin will open. However, note that this function is only
enabled while in forward, reverse, or brake mode and disabled while in standby mode. Furthermore, since the built-in
overvoltage protection function may break down if voltage exceeds the absolute maximum rating of power supply voltage,
do not apply voltage exceeding the absolute maximum rating.
11. Overcurrent Protection
This IC has a built-in overcurrent protection function that protects it from breakdown when the output pin is short-circuited.
Overcurrent protection is a function that protects the IC from breakdown due to short-circuited output pin, but is likely to
cause the IC to generate heat or deteriorate if it remains in the overcurrent state and eventually break down. If
overcurrent continues to flow (if PO pin behaves as shown in Figure 43.), take measures to make the IC standby in terms
of application.
12. Thermal Shutdown
This IC has a built-in thermal shutdown circuit as an overheat-protection measure. The thermal shutdown circuit is a
circuit absolutely intended to protect the IC from thermal runaway, not intended to protect or guarantee the IC.
Consequently, do not operate the thermal shutdown circuit based on the subsequent continuous use or operation of the
circuit.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
20/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Power Dissipation
（プラスチックモールド）
Pd［W］
3.99
3.0
2.0
1.0
0
25
50
75
100
110
125
150
Ta［℃］
Figure 47. BD16922EFV-M Power Dissipation
Derating in done 31.9 mW/°C for operating above Ta≥25°C (Mount on 4-layer 70.0mm x 70.0mm x 1.6mm board, ROHM
standard board)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
21/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
(Note 1)
I/O Equivalence Circuits
Pin No.
Pin Name
I/O Equivalence Circuit
PVCC1,2
11 12 13 14
1
2
23
24
IN1P
IN1N
IN2N
IN2P
IN1P/2P
IN1N/2N
1
2
23
24
100kΩ
100kΩ
SGND1,2
3
3
22
SGND1
SGND2
-
30Ω
PO1,2
4
4
21
22
21
PO1
PO2
SGND1,2
3
5
6
19
20
PGND1
PGND1
PGND2
PGND2
22
-
PVCC1,2
11 12 13 14
7
8
9
10
15
16
17
18
OUT1P
OUT1P
OUT1N
OUT1N
OUT2N
OUT2N
OUT2P
OUT2P
OUT1P/2P
OUT1N/2N
7
9
10
15 16 17 18
PGND1,2
5
11
12
13
14
8
PVCC1
PVCC1
PVCC2
PVCC2
6
19 20
-
(Note 1) Resistance values shown in the diagrams above represent a typical limit, respectively.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
22/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
23/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Operational Notes
11.
- continued
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 48. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
24/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Ordering Information
B
D
1
6
9
2
E
2
F
V
Package
EFV:HTSSOP-B24
Part Number
-
ME2
Packaging and forming specification
M : for Automotive
E2: Embossed tape and reel
Marking Diagrams
HTSSOP-B24
(TOP VIEW)
Part Number Marking
16922EFV
LOT Number
1PIN MARK
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
25/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
HTSSOP-B24
26/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
BD16922EFV-M
Revision History
Date
Revision
03.Oct.2013
001
29.May.2015
002
11.Sep.2015
003
Changes
New Release
P.1
Note1
Note2
add comment
add comment
None (adjust revision number between Japanese version and English version)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
27/27
TSZ02201-0G1G0B300330-1-2
11.Sep.2015 Rev.003
Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001