Capacitors REV3_20060517 MIS CHIP CAPACITORS Part Number Capacitance (± 20%, pF) Chip Type TCCXXXX4A 0.2 ~ 4.5 A TCCXXXX4B 0.6 ~ 13 B TCCXXXX4C 3 ~ 50 C TCCXXXX4D 1.6 ~ 30 D TCCXXXX4E 55 ~ 550 E TCCXXXX4F 1 ~ 20 F TCCXXXX4G 8 ~ 110 G TCCXXXX4H 0.2 ~ 3.7 H TCCXXXX4I 2 ~ 27 I TCCXXXX4Q 45 ~ 450 Q TCCXXXX4S 15 ~ 155 S Note : The specified capacitors on this list are not limited to Transcom’s capability for MIS chip capacitors. Any capacitance or chip type not listed here, pls contact Transcom for further information! Thanks! DIE ATTACH AND WIRE BONDING Transcom’s MIS chip capacitors are processed with a high quality gold metallization for thermocompression, thermo-sonic or ultrasonic wire bonding. The top plate of the capacitors is 99.99% sputtered gold with a TiW barrier and typical 3 µm of Au which is suitable for Gold-tin or gold germanium eutectic solders. Epoxy die attach is also acceptable. DESCRIPTION Transcom’s MIS Chip Capacitors are available in a wide range of sizes and capacitance values. They are designed to be used as DC blocks coupling filter elements, RF bypass, microwave circuit resonant elements and a fixed capacitance tuning elements in filters, oscillators, and matching networks. The devices have long term stability making them suitable for high reliability application. The temperature coefficient is less than 200 ppm/° C, and operation is suitable from –65 °C to 200 ° C. Differing from ceramic capacitors, Transcom’s MIS Chip Capacitors have high Q and lower insertion loss of 0.1 dB in a 50 Ω system. Insulation resistance is greater than 10 6 MΩ .The wafers are supplied on expanded 6” hoop for high volume automated assembly methods and 100% DC tested to assure consistent quality. Capacitors are packaged in gel packs and 100% visual inspection is always available if required. ELECTRICAL SPECIFICATIONS Capacitance Range ............................0.2 to 550 pF Capacitance Thickness.................0.004” ± 0.001” Capacitance Tolerance ................................ ± 20% Operating temperature ............... -65 °C to 200 °C Temperature Coefficient ...........50 ppm/°C Typical Dielectric Withstanding Voltage ........ 50 V Typical Insulation Resistance ............106 Megohms Typical Leakage Current ............................... Typical < 1nA TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science- Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 Capacitors REV3_20060517 TYPICAL INSERTION LOSS VS. FREQUENCY (50 pF on 50 ohm system) Insertion Loss (dB) 2 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -0.25 -0.5 -0.75 -1 -1.25 -1.5 -1.75 -2 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Frequency (GHz) PART NUMBER INFORMATION OUTLINE DRAWINGS (Unit in Mils) TCC 0055 4 B Die size, B Chip Thickness, 4 (mil) Capacitance, 5.5 (pF) TransCom Capacitor DIMENSIONS IN MILS Outline B 7 X 11 X1 7 Y 11 Y1 C 7 11 27 31 D 11 14 11 14 E 47 51 47 51 F 9 13 9 13 G 21 25 21 25 K 15 18 15 18 Q 56 61 31 36 S 36 41 18 23 X1, Y1 Tolerance: ±0.5 mil TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 Capacitors REV3_20060517 PART NUMBER INFORMATION OUTLINE DRAWINGS (Unit in Mils) TCC 0045 4 A X1 Die size, A X Chip Thickness, 4 (mil) 2 Capacitance, 4.5 (pF) TransCom Capacitor DIMENSIONS IN MILS Outline X X1 Y Y1 A 1 7 (2) (2.4) 11 2.4 (2.4) 11 Y 2 Y1 X 1 Y I 1 16 (2) (7) 21 7 (7) 21 X1, Y1 Tolerance: +1 mil PART NUMBER INFORMATION OUTLINE DRAWINGS (Unit in Mils) TCC 0089 4 H X1 Die size, I X Chip Thickness, 4 (mil) Capacitance, 8.9 (pF) 1 1 TransCom Capacitor Y Y1 1 1 DIMENSIONS IN MILS Outline X X1 Y Y1 H 5 15 3 11 X1, Y1 Tolerance: ± 0.5 mil TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science- Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602