TRANSCOM TC1404N

TC1404N
REV2_20070502
0.5W High Linearity and High Efficiency GaAs Power FETs
FEATURES
! 0.5W Typical Power at 12 GHz
PHOTO ENLARGEMENT
! Linear Power Gain: GL = 11 dB Typical at 12 GHz
! High Linearity: IP3 = 37 dBm Typical at 12 GHz
! High Power Added Efficiency: Nominal PAE of 40 % at 12 GHz
! Non-Via Hole Source for Single-Bias Application
! Suitable for High Reliability Application
! Breakdown Voltage: BVDGO ≥ 13.5 V
! Lg = 0.25 µm, Wg = 1.2 mm
! Tight Vp ranges control
! High RF input power handling capability
! 100 % DC Tested
DESCRIPTION
The TC1404N is a GaAs Pseudomorphic High Electron Mobility Transistor (PHEMT) which has high linearity
and high Power Added Efficiency. The device is processed without via-holes for single-bias applications. The
short gate length enables the device to be used in circuits up to 20GHz. All devices are 100% DC tested to assure
consistent quality. Bond pads are gold plated for either thermo-compression or thermo-sonic wire bonding.
Backside gold plating is compatible with standard AuSn die-attach. Typical applications include commercial and
military high performance power amplifiers
ELECTRICAL SPECIFICATIONS (TA=25 °C)
Symbol
Conditions
P1dB
Output Power at 1dB Gain Compression Point , f
GL
Linear Power Gain, f
= 12GHz VDS = 8 V, IDS = 120 mA
TYP
26.5
MAX
UNIT
27
dBm
= 12GHz VDS = 8 V, IDS = 120 mA
11
dB
rd
37
dBm
IP3
Intercept Point of the 3 -order Intermodulation, f = 12GHz VDS =8V, IDS = 120 mA, *PSCL = 14 dBm
PAE
Power Added Efficiency at 1dB Compression Power, f
IDSS
gm
VP
Pinch-off Voltage at VDS = 2 V, ID = 2.4 mA
= 12GHz
40
%
Saturated Drain-Source Current at VDS = 2 V, VGS = 0 V
360
mA
Transconductance at VDS = 2 V, VGS = 0 V
260
mS
-1.7
Volts
15
Volts
30
°C/W
BVDGO Drain-Gate Breakdown Voltage at IDGO =0.6 mA
Rth
MIN
Thermal Resistance
13.5
Note:
* PSCL: Output Power of Single Carrier Level.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
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TC1404N
REV2_20070502
ABSOLUTE MAXIMUM RATINGS (TA=25 °C)
Symbol
VDS
VGS
IDS
Pin
PT
TCH
TSTG
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current
RF Input Power, CW
Continuous Dissipation
Channel Temperature
Storage Temperature
Rating
12 V
-5 V
IDSS
26 dBm
1.9 W
175 °C
- 65 °C to +175 °C
CHIP DIMENSIONS
Units : Micrometer
Gate Pad : 45*45
Chip Thickness : 76.2
Drain Pad : 55*55
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
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TC1404N
REV2_20070502
SMALL SIGNAL MODEL, VDS = 8 V, IDS = 120 mA
SCHEMATI
Lg
PARAMETERS
Cgd
Rg
Rd
Gm
Cgs
Cds
Ri
Ld
Lg
0.02 nH
Rs
Rg
0.97 Ohm
Ls
0.005 nH
2.652 pF
Cds
0.274 pF
1.246 Ohm
Rds
55.8 Ohm
Cgd
0.144 pF
Rd
0.65 Ohm
Gm
574.6 mS
Ld
0.02 nH
Cgs
Rds
Ri
T
Rs
T
0.8 Ohm
3.9 psec
Ls
LARGE SIGNAL MODEL, VDS = 8 V, IDS = 120 mA
SCHEMATI
Lg
Rg
TOM2 MODEL PARAMETERS
Cgd
Rd
Rid
Cgs
Rdb
Id
Ris
Cds
Cbs
Rs
Ls
Ld
VTO
ALPHA
BETA
GAMMA
DELTA
Q
NG
ND
TAU
RG
RD
RS
IS
N
VBI
VDELTA
-1.62
14.13
0.354
0.0228
0.1565
0.88
0.1
0.01
3.9
0.97
0.65
0.8
1E-11
1
1
0.2
V
VMAX
CGD
CGS
CDS
RIS
RID
VBR
RDB
ps
CBS
Ohm TNOM
Ohm LS
Ohm LG
mA LD
AFAC
V
NFING
V
0.5
0.144
2.652
0.274
2.005
0.0001
13.5
119.667
2.5
25
0.005
0.02
0.02
1
1
V
pF
pF
pF
Ohm
Ohm
V
Ohm
pF
°C
nH
nH
nH
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C ± 5°C; Handling Tool: Tweezers;
Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
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