RClamp0521Z Ultra Small RClamp® 1-Line ESD protection PRELIMINARY PROTECTION PRODUCTS - Z-PakTM Features Description RailClamp TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. They are designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. RClamp®0521Z has a typical capacitance of only 0.35pF. This allows it to be used on circuits operating in excess of 5GHz without appreciable signal attenuation. RClamp0521Z is in a 2-pin SLP0603P2X3 package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. Leads are finished with lead-free NiAu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. High ESD withstand Voltage: +/-17kV (Contact) and ® +/- 25kV (Air) per IEC 61000-4-2 Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 1 pack age Ultra-small 020 0201 package Protects one high-speed data line Low reverse current: <10nA typical (VR=5V) Working voltage: +/- 5V Low capacitance: 0.35pF typical Dynamic resistance: 0.90 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P2X3 package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Molding compound flammability rating: UL 94V-0 Marking : Marking code + dot matrix date code Packaging : Tape and Reel Applications HDMI 1.3 and HDMI 1.4 USB 2.0 MHL LVDS Interfaces FM Antenna PCI Express eSATA Interfaces Circuit Diagram Dimensions 0.62 0.22 0.32 1 0.16 0.355 BSC 2 0.25 Nominal Dimensions (mm) Revision 2/21/2014 SLP0603P2X3 (Bottom View) 1 www.semtech.com RClamp0521Z PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 100 Watts Peak Pulse Current (tp = 8/20μs) IP P 4 A ESD p er IEC 61000-4-2 (Air)1 ESD p er IEC 61000-4-2 (Contact)1 VESD +/- 25 +/- 17 kV TJ -55 to +125 °C TSTG -55 to +150 °C Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 5 V 9.3 11 V 0.005 0.100 μA Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C Clamp ing Voltage VC IPP = 1A, tp = 8/20μs 15 V Clamp ing Voltage VC IPP = 4A, tp = 8/20μs 25 V Dynamic Resistance2, 3, 4 RD tp = 100ns 0.90 Junction Cap acitance Cj VR = 0V, f = 1MHz 0.35 6 Ohms 0.50 pF Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A 4)Guaranteed by design. Not production tested © 2014 Semtech Corporation 2 www.semtech.com RClamp0521Z PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Clamping Voltage -VC (V) Clamping Voltage vs. Peak Pulse Current Typical Capacitance vs. Reverse Voltage 30 1.4 25 1.2 1 Cj(VR) / Cj(VR=0V) 20 15 10 Waveform Parameters: tr = 8µs td = 20µs 5 0.8 0.6 0.4 0.2 f = 1 MHz 0 0 0 1 2 3 4 5 0 1 2 4 5 Reverse Voltage - VR (V) Peak Pulse Current - IPP (A) Typical Insertion Loss (S21) TLP Characteristic 0.0 30 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns ‐0.5 25 TLP Current (A) ‐1.0 Loss (dB) 3 ‐1.5 ‐2.0 ‐2.5 ‐3.0 20 15 10 5 ‐3.5 0 0 ‐4.0 0.01 0.1 1 10 20 30 TLP Voltage (V) 10 40 50 Frequency (GHz) ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) 230 20 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane. -30 Clamping Voltage (V) Clamping Voltage (V) 180 130 80 30 -20 -80 -130 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane. -180 -230 -20 -10 0 10 20 © 2014 Semtech Corporation 30 40 Time (ns) 50 60 70 80 -20 3 -10 0 10 20 30 40 Time (ns) 50 60 70 80 www.semtech.com RClamp0521Z PRELIMINARY PROTECTION PRODUCTS Applications Information Recommended Mounting Pattern Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Stencil Aperture Mounting Pad Package 0.175 0.272 0.250 R ecommendation 0.298 Solder Stencil Design Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Stencil Thickness Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish © 2014 Semtech Corporation 0.270 0.100 mm (0.004") Type 4 size sphere or smaller Per JEDEC J-STD-020 N on-Solder mask defined OSP OR N iAu 4 www.semtech.com RClamp0521Z PRELIMINARY PROTECTION PRODUCTS Outline OutlineDrawing Drawing- -SO-8 SLP0603P2X3 A B D DIM A A1 b D E e L N aaa bbb E TOP VIEW DIMENSIONS MILLIMETERS MIN NOM MAX 0.235 0.25 0.265 0.000 0.02 0.025 0.22 0.24 0.20 0.585 0.62 0.655 0.285 0.32 0.355 0.355 BSC 0.14 0.16 0.18 2 0.08 0.10 A SEATING PLANE aaa C C A1 e/2 bbb bxN C A B 2xL e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP0603P2X3 DIMENSIONS (C) Z G DIM C G X Y Z MILLIMETERS (0.425) 0.175 0.270 0.250 0.675 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2014 Semtech Corporation 5 www.semtech.com RClamp0521Z PRELIMINARY PROTECTION PRODUCTS Marking Codes Ordering Information C Part Number Qty per Reel Reel Size RClamp 0521Z.TN T 10,000 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. Notes: 1)Dots represent date code matrix Carrier Tape Specification Device Orientation in Tape A0 B0 0.37 +/-0.03 mm 0.67 +/-0.03 mm K0 0.32 +/-0.02 mm Note: All dimensions in mm unless otherwise specified Date Code Location (Towards Sprocket Holes) © 2014 Semtech Corporation 6 www.semtech.com RClamp0521Z PRELIMINARY PROTECTION PRODUCTS Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2014 Semtech Corporation 7 www.semtech.com