TEA1795T GreenChip synchronous rectifier controller Rev. 1 — 4 November 2010 Product data sheet 1. General description The TEA1795T is a member of the new generation of Synchronous Rectifier (SR) controller ICs for switched mode power supplies. Its high level of integration enables the design of a cost-effective power supply with a minimum number of external components. The TEA1795T is a dedicated controller IC for synchronous rectification on the secondary side of resonant converters. It has two driver stages for driving the SR MOSFETs, which are rectifying the outputs of the central tap secondary transformer windings. The two gate driver stages have their own sensing inputs and operate independently of each other. The TEA1795T is fabricated in a Silicon On Insulator (SOI) process. 2. Features and benefits 2.1 Distinctive features Accurate synchronous rectification functionality Wide supply voltage range (8.5 V to 38 V) Separate sense inputs for sensing the drain and source voltage of each SR MOSFET High level of integration, resulting in a minimum external component count High driver output voltage of 10 V to drive all MOSFET brands to the lowest RDSon 2.2 Green features Low current consumption High system efficiency from no load to full load 2.3 Protection features UnderVoltage Protection (UVP) 3. Applications The TEA1795T is intended for resonant power supplies. In such applications, it can drive two external synchronous rectifier MOSFETs which replace diodes for the rectification of the voltages on the two secondary windings of the transformer. It can be used in applications such as: Adapters ATX power supplies TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller Server power supplies LCD television Plasma television 4. Ordering information Table 1. Ordering information Type number TEA1795T/N1 Package Name Description Version SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 5. Block diagram VCC 7 SUPPLY AND BIAS UVLO control A DSA TIMER 0.4 μs 4 & R Q S Q TIMER 0.5 μs 3 GDA DRIVER −25 mV SSA −12 mV −220 mV 1 TEA1795T control B DSB TIMER 0.4 μs 5 & R Q S Q TIMER 0.5 μs 6 GDB DRIVER −25 mV SSB −12 mV −220 mV 8 2 GND Fig 1. TEA1795T Product data sheet 001aal796 Block diagram All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 2 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller 6. Pinning information 6.1 Pinning SSA 1 GND 2 8 SSB 7 VCC TEA1795T GDA 3 6 GDB DSA 4 5 DSB 014aaa976 Fig 2. Pin configuration 6.2 Pin description Table 2. Pin description Symbol Pin Description SSA 1 source sense input MOSFET A GND 2 ground GDA 3 gate driver output MOSFET A DSA 4 drain sense input for synchronous timing MOSFET A DSB 5 drain sense input for synchronous timing MOSFET B GDB 6 gate driver output MOSFET B VCC 7 supply voltage SSB 8 source sense input MOSFET B 7. Functional description 7.1 Introduction The TEA1795T is a controller for synchronous rectification to be used in resonant applications. It can drive two synchronous rectifier MOSFETs on the secondary side of the central tap transformer winding. A typical configuration is shown in Figure 3. TEA1795T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 3 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller Vin Qprim1 PRIMARY SIDE CONTROLLER CHB TR Qprim2 Vout RDRNSENSE1 Qsec1 IC1 VCC DSA GDA Cout RDRNSENSE2 Qsec2 DSB TEA1795T GDB SSB SSA GND 001aal797 Fig 3. TEA1795T: typical configuration 7.2 Start-up and UnderVoltage LockOut (UVLO) The IC leaves the UVLO state and activates the synchronous rectifier circuitry when the voltage on the VCC pin is above Vstartup (8.5 V typical). When the voltage drops below 8.0 V (typical), the UVLO state is reentered and the SR MOSFET gate driver outputs are actively kept low. 7.3 Supply management All (internal) reference voltages are derived from a temperature compensated, on-chip band gap circuit. 7.4 Synchronous rectification (DSA, SSA, DSB and SSB pins) The voltages present between the drain and source terminals of the SR MOSFETs are used to derive the timing for the gate drive signal. The IC senses the voltage difference between the drain sense (pins DSA and DSB) and the source sense (pins SSA and SSB) connections. When this voltage difference is lower than Vact(drv) (−220 mV typical), the corresponding gate driver output voltage is driven high and the external SR MOSFET is switched on. When the external SR MOSFET is switched on, the input signals on the drain sense pins and source sense pins are ignored during the minimum synchronous rectification active time (tact(sr)(min), 520 ns typical). This minimizes false switch-off due to the sensing of high frequency ringing signals at the start of the conduction phase. Once this minimum synchronous rectification active time has ended, the IC monitors the difference between the drain sense inputs and the source sense inputs. When the difference is higher than Vreg(drv) (−25 mV typical), the gate driver output voltage is regulated to maintain this −25 mV difference between the drain sense pins and the source sense pins. As a result, the SR MOSFET can be switched off quickly when the current through the external SR MOSFET reaches zero. TEA1795T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 4 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller The zero current is detected by sensing a Vdeact(drv) (−12 mV typical) difference between the drain sense pins and the source sense pins (see Figure 4). A synchronous rectification off-timer (toff(sr)(min), 400 ns typical) is started and the next switching cycle can only be started when the synchronous rectification off-timer has finished. secondary current 0A drain sensesource sense voltage 0V Vdeact(drv) Vreg(drv) Vact(drv) gate driver blanking windows Fig 4. 0V tact(sr)(min) toff(sr)(min) t 001aal798 Synchronous rectification signals 7.5 Gate driver (GDA and GDB pins) The gate driver circuit to the gate of the external SR MOSFET has a source capability of typically 400 mA and a sink capability of typically 2.7 A. This allows fast turn-on and turn-off of the external SR MOSFET for efficient operation. The source stage is coupled to the timer (see Figure 1). When the timer has finished, the source capability is reduced to a small current (4 mA typical) capable of keeping the driver output voltage at its level. The output voltage of the driver is limited to 10 V (typical). This high output voltage drives all MOSFET brands to the minimum on-state resistance. During start-up conditions (VCC < Vstartup) and UVLO the driver output voltage is actively pulled low. 7.6 Source sense (SSA and SSB pins) The IC is equipped with additional source sense pins (SSA and SSB). These pins are used for the measurement of the drain-to-source voltage of the external SR MOSFET. This drain-to-source voltage determines the timing of the gate driver. The source sense input should be connected as close as possible to the source pin of the external SR MOSFET to minimize timing errors, caused by voltage difference on PCB tracks, due to parasitic inductance in combination with large dI/dt values. TEA1795T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 5 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground (pin 2); positive currents flow into the chip. Voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the other ratings are not violated. Symbol Parameter Conditions Min Max Unit VCC supply voltage continuous −0.4 +38 V Vsense(D)A drain sense voltage A continuous - 120 V Vsense(D)B drain sense voltage B continuous - 120 V Idrv(G)A gate driver current A δ < 10 % −0.8 +3.0 A Idrv(G)B gate driver current B δ < 10 % −0.8 +3.0 A II(DSA) input current on pin DSA −3 - mA II(DSB) input current on pin DSB −3 - mA II(SSA) input current on pin SSA −1 +1 mA II(SSB) input current on pin SSB −1 +1 mA - 0.45 W Voltages Currents General Tamb < 80 °C Ptot total power dissipation Tstg storage temperature −55 +150 °C Tj junction temperature −40 +150 °C ElectroStatic Discharge voltage (ESD) VESD electrostatic discharge voltage class 2 human body model [1] - 2000 V machine model [2] - 200 V - 500 V charged device model [1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [2] Equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω resistor. 9. Thermal characteristics Table 4. TEA1795T Product data sheet Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient JEDEC test board 150 K/W Rth(j-c) thermal resistance from junction to case JEDEC test board 100 K/W All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 6 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller 10. Characteristics Table 5. Characteristics Tamb = 25 °C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 8.2 8.5 8.8 V - 0.5 - V VCC = 8 V (VCC < Vstartup) - 0.35 - mA fsw = 200 kHz; no load on pins GDA and GDB - 1.85 - mA −260 −220 −180 mV Supply voltage management (pin VCC) Vstartup start-up voltage Vhys hysteresis voltage ICC(oper) operating supply current [1] Synchronous rectification sense input (pins DSA/SSA and pins DSB/SSB) Vact(drv) driver activation voltage Vsense(S)A = 0 V; Vsense(S)B = 0 V Vreg(drv) driver regulation voltage Vsense(S)A = 0 V; Vsense(S)B = 0 V Vdeact(drv) driver deactivation voltage Vsense(S)A = 0 V; Vsense(S)B = 0 V VI(cm) −33 −25 −17 mV - −12 - mV common-mode input voltage pins SSA and SSB −0.7 - +0.7 V td(act)(drv) driver activation delay time Vsense(S)A = 0 V; Vsense(S)B = 0 V; Vsense(D)A = falling from +0.5 V to −0.5 V; Vsense(D)B = falling from +0.5 V to −0.5 V - 100 - ns td(deact)(drv) driver deactivation delay time Vsense(S)A = 0 V; Vsense(S)B = 0 V; Vsense(D)A = rising from −0.35 V to +0.5 V; Vsense(D)B = rising from −0.35 V to +0.5 V - 35 - ns tact(sr)(min) minimum synchronous rectification active time 415 520 625 ns toff(sr)(min) minimum synchronous rectification off-time 310 400 490 ns VCC = 15 V; pins GDA/GDB = 2 V; during minimum synchronous rectification active time −0.46 −0.4 −0.34 A VCC = 15 V; pins GDA/GDB = 5 V; minimum synchronous rectification active time has ended - −4 - mA pins GDA/GDB = 2 V 1 1.4 - A pins GDA/GDB = 9.5 V 2.2 2.7 - A VCC = 15 V - 10 12 V 500 - - kHz [2] Gate driver (pins GDA/GDB) Isource Isink source current sink current Vo(max) maximum output voltage VCC = 15 V Switching fsw(max) maximum switching frequency [1] The VCC stop voltage is Vstartup − Vhys. [2] The Vdeact(drv) level is always above the Vreg(drv) level. TEA1795T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 7 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller 11. Application information A switched mode power supply with the TEA1795T consists of a primary side half bridge, a transformer, a resonant capacitor and an output stage. In the output stage SR MOSFETs are used to obtain low conduction loss rectification. These SR MOSFETs are controlled by the TEA1795T. The timing for the synchronous rectifier switch is derived from the voltage difference between the corresponding drain sense and source sense pins. The resistor in the drain sense connection is needed to protect the TEA1795T against excessive voltages. These resistors should typically be 1 kΩ. Higher values might impair correct timing, lower values may not provide sufficient protection. Special attention should be paid to the connection of the drain sense and source sense pins. The voltages measured on these pins are used for the timing of the gate driver output. Wrong measurement results in wrong timing. The connections to these pins should not interfere with the power wiring. The power wiring conducts currents with high dI/dt values. This can easily cause measurement errors resulting from induced voltages due to parasitic inductances. The separate source sense pins make it possible to sense the source voltage of the external MOSFETs directly, without having to use the current carrying power ground tracks for this. 11.1 Application diagram resonant application Vin Qprim1 PRIMARY SIDE CONTROLLER CHB TR Qprim2 Vout RDRNSENSE1 RDRNSENSE2 1 kΩ 1 kΩ Qsec1 IC1 VCC DSA GDA Cout Qsec2 DSB TEA1795T GDB SSB SSA GND 001aal799 Fig 5. Typical resonant application with TEA1795T TEA1795T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 8 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller 11.2 Application diagram multi-output flyback application Vout2 TR Vin Cout2 Vout1 Qprim RDRNSENSE1 RDRNSENSE2 1 kΩ 1 kΩ Qsec1 IC1 VCC DSA PRIMARY SIDE CONTROLLER GDA Cout1 Qsec2 DSB TEA1795T GDB SSB SSA GND 001aal800 Fig 6. TEA1795T Product data sheet Multi-output flyback application with TEA1795T All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 9 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller 12. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp L 4 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ o 8 o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Fig 7. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Package outline SOT096-1 (SO8) TEA1795T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 10 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller 13. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes TEA1795T v.1 20101104 Product data sheet - - TEA1795T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 11 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 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Export might require a prior authorization from national authorities. TEA1795T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 12 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. GreenChip — is a trademark of NXP B.V. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TEA1795T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 November 2010 © NXP B.V. 2010. All rights reserved. 13 of 14 TEA1795T NXP Semiconductors GreenChip synchronous rectifier controller 16. Contents 1 2 2.1 2.2 2.3 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 8 9 10 11 11.1 11.2 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1 Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1 Protection features . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Start-up and UnderVoltage LockOut (UVLO) . . 4 Supply management. . . . . . . . . . . . . . . . . . . . . 4 Synchronous rectification (DSA, SSA, DSB and SSB pins). . . . . . . . . . . . . . . . . . . . . . . . . . 4 Gate driver (GDA and GDB pins) . . . . . . . . . . . 5 Source sense (SSA and SSB pins) . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 8 Application diagram resonant application . . . . . 8 Application diagram multi-output flyback application . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 4 November 2010 Document identifier: TEA1795T