TESDB5V0A 5V, 2-Channels ESD Protection Array Small Signal Diode SOT-143 A F I E Features J B Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) Meet IEC61000-4-4 (EFT) rating. 40A (5/50ns) K Protects two directional I/O lines Working Voltage : 5V H D C Pb free version, RoHS compliant, and Halogen free Unit (mm) Dimensions Mechanical Data G Unit (inch) Min Max Min Max A 2.800 3.040 0.110 0.120 Terminal: Matte tin plated, lead free. B 1.200 1.400 0.047 0.055 High temperature soldering guaranteed: 260°C/10s C 0.760 0.940 0.030 0.037 Molding Compound Flammability Rating : UL 94V-0 D 0.300 0.510 0.012 0.020 Weight : 10mg (approximately) E 2.100 2.640 0.083 0.104 Marking Code : SL3 F 0.013 0.015 0.001 0.001 Case :SOT-143 package, molded plastic G 0.080 0.200 0.003 0.008 Applications H 0.400 0.600 0.016 0.024 USB Power & Data Line Protection I 0.750 1.070 0.030 0.042 I2C Bus Protection Video Line Protection J 2.100 2.640 0.083 0.104 0.2 (BSC) K 0.008(BSC) Microcontroller Input Protectionrs T1/E1 secondary IC side Protection Pin Configutation & PAD Layout ISDN S/T Interface WAN/LAN Equipment VCC 4 Ethernet 10BaseT IO#2 3 1.4 1.92 Ordering Information 2.20 Part No. Package Packing TESDB5V0A SOT-143 3K / 7" Reel 1.72 Packing Code Marking RBG SL3 1 GND Maximum Ratings and Electrical Characteristics 2 IO#2 1.2 Rating at 25°C ambient temperature unless otherwise specified. 1.0 Unit : mm Maximum Ratings Symbol Value Units Peak Pulse Power (tp=8/20μs waveform) PPP 200 W Peak Pulse Current (tp = 8/20μs) IPP 10 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD ±15 ± 8 KV Type Number Junction Temperature Range TJ Storage Temperature Range TSTG . . -55 to + 150 °C -55 to + 150 °C . . Electrical Characteristics Type Number Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamping Voltage Junction Capacitance I R= V R= IPP= IPP= 1mA 5V 1A 3A VR=0V, f=1.0MHz Max 5 Symbol VRWM Min - V(BR) 6 - V IR - 5 9.8 17 uA Vc CJ 3 (Typ.) Units V V pF Notes: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary despending on application. Version : B11 TESDB5V0A 5V, 2-Channels ESD Protection Array Small Signal Diode Rating and Characteristic Curves FIG 2. Pulse Waveform FIG 1. Admissible Power Dissipation Curve 120 110 100 Waveform Parameters: tr = 8μs, td = 20μs 90 Percent of IPP Power Rating (%) 100 80 80 70 e-1 60 60 50 40 40 30 td=Ipp/2 20 20 10 0 0 0 20 40 60 80 100 120 140 160 0 180 5 10 15 20 25 30 Time (us) FIG 4. Typical Junction Capacitance FIG 3. Clamping Voltage vs. Peak Pulse Current 5 25 Normalized Capacitance Clamping Voltage (V) 30 20 15 10 Waveform Parameters: tr = 8μs, td = 20μs 5 4 3 2 1 f = 1.0MHz 0 0 0 1 2 3 4 5 6 7 8 9 Peak Pulse Current (A) 10 11 12 0 1 2 3 4 5 Reverse Voltage (V) Version : B11 TESDB5V0A 5V, 2-Channels ESD Protection Array Small Signal Diode Applications Information Designed for the protect two data lines from transient over-voltages by clamping them to afixed reference. Data lines are connected at pins 2 and 3. The negative reference (REF1) is connected at pin1 and which should be connected directly to a ground plane on the board for best results. The positive reference (REF2) is connected at pin 4. 4 1 3 2 Pin Definition 2, 3 I/O Lines 1 Ground 4 VCC Typical Application RJ45 Schematic Diagram for Gigabit Ethernet ESD Protection To Protected Device IO#1 IO#2 To Protected Device IO#1 IO#2 VCC VCC 10KΩ Data Line and Power Supply Protection Using VCC Data Line Protection with Bias and Power Supply Isolation Resistor To Protected Device IO#1 IO#2 NC Data Line Protection Using Internal ESD Diode Version : B11 TESDB5V0A 5V, 2-Channels ESD Protection Array Small Signal Diode Carrier & Reel specification TSC label Item Top Cover Tape Carieer Tape Any Additional Label (If Required) 10 Pitches Cumulative Tolerance on Tape ±2.0mm ( ±0.008") P0 D P1 T E Symbol Dimension(mm) Carrier depth K 1.22 Max. Sprocket hole D 1.50 +0.10 Reel outside diameter A 180 ± 1 Reel inner diameter D1 50 Min. Feed hole width D2 13.0 ± 0.5 Sprocke hole position E 1.75 ±0.10 Sprocke hole pitch P0 4.00 ±0.10 Embossment center P1 2.00 ±0.10 Overall tape thickness T 0.6 Max. Tape width W 8.30 Max. Reel width W1 14.4 Max. F K0 W BB0 0 B1 D' Top Cover Tape See Note1 K For Components 2.0mm X 1.2mm and Larger A0 Center Lines of Cavity Embossment For Machine Reference Only Including Draft and RADLL Concentric Around B 0 W1 A D2 Direction of Feed D1 Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10 o within the determined cavity. Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders. Version : B11